Multi-layer ceramic electronic component having external electrode with base film and electrically conductive thin film
A multi-layer ceramic electronic component includes: a ceramic body including a main surface facing in a first direction, an end surface facing in a second direction orthogonal to the first direction, a side surface facing in a third direction orthogonal to the first and second directions, and internal electrodes laminated in the first direction; and an external electrode formed on a surface of the ceramic body, the external electrode including a base film including an end-surface-covering portion that covers the end surface, and a main-surface-covering portion that covers part of the main surface continuously from the end-surface-covering portion, an electrically conductive thin film including a base-covering portion that covers the main-surface-covering portion, and a ceramic-body-covering portion that extends from the base-covering portion in the second direction and covers part of the main surface, and a plating film that covers the electrically conductive thin film and the base film.
1. A multi-layer ceramic electronic component, comprising:
a ceramic body including
a main surface facing in a first direction,
an end surface facing in a second direction orthogonal to the first direction,
a side surface facing in a third direction orthogonal to the first direction and the second direction, and
internal electrodes laminated in the first direction; and
an external electrode formed on a surface of the ceramic body, the external electrode including
a base film including
an end-surface-covering portion that covers the end surface, and
a main-surface-covering portion that covers part of the main surface continuously from the end-surface-covering portion,
an electrically conductive thin film including
a base-covering portion that covers the main-surface-covering portion, and
a ceramic-body-covering portion that extends from the base-covering portion in the second direction and covers part of the main surface, and
a plating film that covers the electrically conductive thin film and the base film,
wherein a first length of the multi-layer ceramic electronic component measured in the first direction is equal to or shorter than half of a second length of the multi-layer ceramic electronic component measured in the second direction, and wherein the first length of the multi-layer ceramic electronic component measured in the first direction is equal to or shorter than half of a third length of the multi-layer ceramic electronic component measured in the third direction,
wherein the main-surface-covering portion has a main-surface-covering dimension of 10 μm or more and 100 μm or less in the second direction from an outer edge portion of the main surface in the second direction,
wherein the ceramic-body-covering portion has a ceramic-body-covering dimension of 100 μm to 200 μm in the second direction from an end portion of the main-surface-covering portion in the second direction, and
wherein the electrically conductive thin film is absent from the end surface.
2. The multi-layer ceramic electronic component according to claim 1 , wherein
the main-surface-covering dimension is 70 μm or less.
3. The multi-layer ceramic electronic component according to claim 1 , wherein the first length of the multi-layer ceramic electronic component is 30 μm or more and 60 μm or less, and
the main-surface-covering dimension being smaller than the first length of the multi-layer ceramic electronic component.
4. The multi-layer ceramic electronic component according to claim 1 , wherein the first length of the multi-layer ceramic electronic component is 50 μm to 99 μm, the second length of the multi-layer ceramic electronic component is 600 μm to 1,000 μm, and the third length of the multi-layer ceramic electronic component is 500 μm to 1,000 μm.