IP Library › Granted Patent US 11,024,524
Granted Patent B2
US 11,024,524 · App. 16/519,982 · Granted Jun 1, 2021

Heat treatment method and heat treatment apparatus for managing dummy wafer

Inventors: Tomohiro Ueno (Kyoto, JP); Kazuhiko Fuse (Kyoto, JP); Mao Omori (Kyoto, JP)
Assignee: SCREEN HOLDINGS CO., LTD.
H01L21/67115H01L21/67288H01L22/12
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Quick Facts
Patent No.
US 11,024,524
App. No.
16/519,982
Granted
Jun 1, 2021
Kind
B2
Abstract

Dummy running is carried out which performs preheating treatment using halogen lamps and flash heating treatment using flash lamps on a dummy wafer to control the temperature of in-chamber structures including a susceptor and the like. In this process, a preheating counter or a flash heating counter is incremented each time the preheating treatment or the flash heating treatment is performed. An alarm is issued, if the preheating counter or the flash heating counter that is a wear-and-tear value of the dummy wafer is not less than a predetermined threshold value. This allows an operator of a heat treatment apparatus to recognize that the deterioration of the dummy wafer reaches a limit value, thereby preventing the erroneous treatment of a dummy wafer suffering advanced deterioration.

Claims (11)

1. A method of managing a dummy wafer for a heat treatment process in which a susceptor supporting the dummy wafer is subjected to heat treatment prior to a start of treatment of a wafer lot in order to increase a temperature of the susceptor in advance, said susceptor supporting a wafer to be treated after the heat treatment, said method comprising the steps of:

(a) counting a wear-and-tear value indicating a degree of deterioration of the dummy wafer resulting from the heat treatment; and

(b) issuing an alarm when the wear-and-tear value of said dummy wafer is not less than a predetermined threshold value.

2. The method according to claim 1 , wherein

said step (a) and said step (b) are performed when said dummy wafer is being treated in a heat treatment apparatus.

3. The method according to claim 1 , wherein

said step (b) is performed when an instruction to start transport of said dummy wafer whose wear-and-tear value reaches said threshold value is received in a heat treatment apparatus.

4. The method according to claim 3 , wherein

the transport of said dummy wafer is further prohibited when said instruction to start the transport is received.

5. The method according to claim 1 , wherein

said wear-and-tear value is the number of times of preheating using a continuous lighting lamp or the number of times of flash heating using a flash lamp.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 24, 2019
From: UENO, TOMOHIRO; FUSE, KAZUHIKO; OMORI, MAO
To: SCREEN HOLDINGS CO., LTD.
Reel/Frame 049842/0761 →
Priority Claims (1)
JP JP2018-175937 · Sep 20, 2018 · national
Continuity (1)
Related Publication 20200098601A1 · Mar 26, 2020