Method for the bonding and debonding of substrates
A product-substrate-to-carrier-substrate bond with a product substrate, which is bonded to a carrier substrate via a connection layer, wherein a soluble layer is arranged between the connection layer and the product substrate, and wherein a) the soluble layer is soluble due to an interaction with an electromagnetic radiation of a radiation source, and b) the connection layer and the carrier substrate are both at least predominantly transparent to the electromagnetic radiation transmitted through the connection layer, wherein a material of the soluble layer and the electromagnetic radiation are chosen such that an increase of temperature of the soluble layer caused by the interaction with the electromagnetic radiation is less than 50° C.
1. A product-substrate-to-carrier-substrate bond with a product substrate, which is bonded to a carrier substrate via a connection layer, wherein a soluble layer is arranged between the connection layer and the product substrate, and wherein
a) the soluble layer is soluble due to an interaction with an electromagnetic radiation of a radiation source, and
b) the connection layer and the carrier substrate are both at least predominantly transparent to electromagnetic radiation transmitted through the connection layer,
wherein a material of the soluble layer and the electromagnetic radiation are chosen such that an increase of temperature of the soluble layer caused by the interaction with the electromagnetic radiation is less than 50° C.
2. The product-substrate-to-carrier-substrate bond with a product substrate according to claim 1 , wherein physical and/or chemical properties of the soluble layer, with respect to the electromagnetic radiation, are complement corresponding physical and/or chemical properties of the connection layer and/or the carrier substrate.
3. The product-substrate-to-carrier-substrate bond with a product substrate according to claim 1 , wherein an absorption of photons of the electromagnetic radiation in the connection layer is less than 50%.
4. The product-substrate-to-carrier-substrate bond with a product substrate according to claim 1 , wherein an absorption of photons of the electromagnetic radiation in the soluble layer is more than 50%.
5. The product-substrate-to-carrier-substrate bond with a product substrate according to claim 1 , wherein a temperature of the connection layer increases by less than 50° C. during debonding.
6. The product-substrate-to-carrier-substrate bond with a product substrate according to claim 1 , wherein the soluble layer is sublimated by the electromagnetic radiation.
7. The product-substrate-to-carrier-substrate bond with a product substrate according to claim 1 , wherein the soluble layer is applied between the connection layer and the product substrate with a layer thickness less than 10 μm.