Vertically oriented planar structures of transition metal chalcogenides for advanced electronic and optoelectronic systems
The present invention relates to methods for fabricating vertical homogenous and heterogeneous two-dimensional structures, the fabricated vertical two-dimensional structures, and methods of using the same. The methods demonstrated herein produce structures that are free standing and electrically isolated.
1. Planar structures comprising at least one planar structure on a substrate, made using a method of fabricating planar structures from a first material powder and a second material powder, wherein the method comprises the steps of:
placing a substrate on a first crucible in a furnace;
placing an amount of the first material powder in the first crucible underneath the substrate;
placing an amount of the second material powder in a second crucible upstream from the first crucible;
introducing a flow of gas into the furnace and maintaining a furnace pressure of between 1 and 1000 torr;
heating the furnace to at least one temperature between 500 and 1000° C. and holding for at least one period of time between 5 and 120 minutes; and
equilibrating the furnace temperature to room temperature;
thereby generating at least one planar structure on the substrate with the second material powder annealed to the at least one planar structure on the substrate;
wherein the at least one planar structure has a triangular morphology comprising multilayered vertically oriented planar molybdenum chalcogenide domains which are angled relative to the plane of the surface of the substrate at about 90°, and
wherein the at least one planar structure has a triangular morphology from the surface of the substrate.
2. The planar structures of claim 1 , wherein the substrate is selected from the group consisting of: sapphire, silicon, silicon carbide, silicon dioxide, graphene, graphite, non-alkali glass, poly-silicon carbide, and poly-silicon.
3. The planar structures of claim 1 , wherein the planar structures have a thickness of less than 20 layers.
4. The planar structures of claim 3 , wherein each layer is less than 1 nm thick.
5. The planar structures of claim 3 , wherein the layers are separated by van der Waals gaps.
6. The planar structures of claim 1 , wherein the method further comprises the step of adding at least one additional material to the planar structures to form planar heterostructures.
7. The planar structures of claim 1 , wherein the planar structures have a horizontal length of at least 0.1 μm.
8. The planar structures of claim 1 , wherein the multilayered vertically oriented planar molybdenum chalcogenide domains comprise MoS 2 .
9. The planar structures of claim 1 , wherein the planar structures have a vertical height of less than 20 nm.
10. The planar structure of claim 1 , wherein the multilayered vertically oriented planar molybdenum chalcogenide domains are multilayered vertically oriented planar MoS 2 domains.
11. Planar structures comprising at least one planar structure on a substrate,
wherein the at least one planar structures comprises multilayered vertically oriented planar molybdenum chalcogenide domains which are angled relative to the plane of the surface of the substrate at about 90° , and
wherein the multilayered vertically oriented planar molybdenum chalcogenide domains have a triangular morphology from the surface of the substrate.
12. The planar structures of claim 11 , wherein the substrate is selected from the group consisting of: sapphire, silicon, silicon carbide, silicon dioxide, graphene, graphite, non-alkali glass, poly-silicon carbide, and poly-silicon.
13. The planar structures of claim 11 , wherein the planar structures have a horizontal length of at least 0.1 μm.
14. The planar structures of claim 11 , wherein the planar structures have a vertical height of less than 20 nm.
15. The planar structures of claim 11 , wherein the planar structures have a thickness of less than 20 layers.