Reel-to-reel laser sintering methods and devices in FPC fabrication
A reel-to-reel method of creating pads on a layer of metal sheet or circuitry pattern on the fly. The method includes placing a sintering paste in the intended spots for pads followed by irradiation of the sintering paste by a laser.
1. A method of preparing a pad on a flexible printed circuit in a reel-to-reel machine, the method comprising:
providing a metal foil having a thickness, a first surface and a second surface;
feeding the metal foil into a reel-to-reel machine;
placing a paste on a designated pad location of the metal foil, wherein the paste includes a metal particle filler;
apply a laser to the paste thereby removing a non-metal component of the paste while sintering the metal particle filler onto the designated pad location of the metal foil; and
silkscreening the paste onto a sacrificial liner and then transferring the paste onto the designated pad location of the metal foil reel-to-reel.
2. The method as recited in claim 1 , wherein applying of the laser to the paste happens before a circuitry pattern is formed on the metal foil, and the laser is applied by a laser scanner in the reel-to-reel machine.
3. The method as recited in claim 2 , using a high-definition camera to detect an actual location of the paste placed on the metal foil and use said actual location as a reference point or use said actual location to calibrate where the circuitry pattern will be formed.
4. The method as recited in claim 3 , where in the metal foil is an aluminum foil.
5. The method as recited in claim 3 , wherein the metal particle filler includes tin.
6. The method as recited in claim 3 , wherein the metal particle filler includes nickel.
7. The method as recited in claim 6 , wherein the metal foil is a continuous foil of metal being fed through the reel-to-reel machine such that when a leading end of the metal foil exits the reel-to-reel machine, a trailing end of the metal foil has yet to enter into the reel-to-reel machine.
8. The method as recited in claim 2 , wherein the laser is a fiber laser.
9. The method as recited in claim 1 , wherein applying of the laser to the paste happens after a circuitry pattern is formed on the metal foil, and the laser is applied by a laser scanner in the reel-to-reel machine.
10. The method as recited in claim 9 , prior to applying a laser to the paste, using a high-definition camera to survey the location and/or pattern of the paste on the metal foil relative to a reference point.