Manufacturing method of micro LED display module
A manufacturing method of micro LED display module is provided. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The driver chip block has a plurality of pixel electrodes. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to the pixel electrodes and the other is electrically connected to the light transmissive conductive layer. The trenches define a plurality of micro LED pixels arranged in an array. Each trench at least penetrates through the light emitting layer and one of the semiconductor layers. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, and the color layer is disposed on the light transmissive conductive layer.
1. A manufacturing method of micro light emitting diode (LED) display module, the method comprising the following steps:
initially, preparing a LED wafer and a driver circuit wafer, wherein a portion of the LED wafer is defined as a LED block, the LED block has a first semiconductor layer, a light emitting layer and a second semiconductor layer, the light emitting layer is disposed between the first semiconductor layer and the second semiconductor layer, the first semiconductor layer connects with a substrate, the first semiconductor layer is a N-type semiconductor layer and the second semiconductor layer is a P-type semiconductor layer, and a chip size portion of the driver circuit wafer is defined as a driver chip block;
next, etching the LED block to form a plurality of trenches arranged crisscrossingly, wherein the trenches define a plurality of micro LED pixels arranged in an array, each of the trenches at least penetrates through the second semiconductor layer and the light emitting layer, and the first semiconductor layer is not penetrated through by each of the trenches;
next, bonding the LED block and the driver chip block to each other, wherein the second semiconductor layer is electrically connected to a plurality of pixel electrodes of the driver chip block, and each of the micro LED pixels corresponds to one of the pixel electrodes; and
next, removing the substrate;
next, disposing a light transmissive conductive layer on the first semiconductor layer, wherein the light transmissive conductive layer has a common electrode corresponding to the micro LED pixels; and
next, disposing a color layer on the light transmissive conductive layer, wherein the color layer is a red, green and blue color layer.
2. The manufacturing method according to claim 1 , wherein the N-type semiconductor layer further comprises a N-type doped layer and a N-type buffer layer, and the N-type doped layer is located between the N-type buffer layer and the light emitting layer.
3. The manufacturing method according to claim 1 , wherein the P-type semiconductor layer further comprises a P-type doped layer and a P-type buffer layer, and the P-type doped layer is located between the P-type buffer layer and the light emitting layer.
4. The manufacturing method according to claim 1 , further comprising a step of electrically connecting the driver chip block with a circuit board, wherein the driver chip block is a driver chip diced from the driver circuit wafer.
5. The manufacturing method according to claim 4 , wherein the light transmissive conductive layer is electrically connected with the circuit board via a conductive glue after the step of disposing the light transmissive layer.
6. The manufacturing method according to claim 1 , wherein the light transmissive conductive layer is electrically connected with the driver chip block via a conductive glue.
7. The manufacturing method according to claim 1 , wherein the light transmissive conductive layer comprises a glass layer coated with an ITO conductive film, and the ITO conductive film is electrically connected with each of the micro LED pixels.
8. The manufacturing method according to claim 1 , wherein the light transmissive conductive layer is an ITO conductive layer formed through physical sputtering.
9. The manufacturing method according to claim 1 , wherein the color layer is a color filter.
10. The manufacturing method according to claim 1 , wherein the color layer is formed by spraying quantum dots.
11. The manufacturing method according to claim 1 , further comprising the following step before the step of bonding the LED block and the driver chip block to each other and after the step of etching the LED block: dicing the LED block from the LED wafer; and wherein the step of bonding the LED block and the driver chip block to each other is to bond the LED block and the driver circuit wafer having the driver chip block to each other.
12. The manufacturing method according to claim 1 , further comprising the following step before the step of bonding the LED block and the driver chip block to each other and after the step of preparing the LED wafer and the driver circuit wafer: dicing the LED block and the driver chip block from the LED wafer and the driver circuit wafer respectively.
13. The manufacturing method according to claim 1 , wherein the step of bonding the LED block and the driver chip block to each other is to bond the LED wafer having the LED block and the driver circuit wafer having the driver chip block to each other.
14. The manufacturing method according to claim 1 , further comprising the following step: filling non-conductive glue into the trenches.