IP Library › Granted Patent US 11,031,700
Granted Patent B2
US 11,031,700 · App. 16/592,989 · Granted Jun 8, 2021

Antenna module and communication device

Inventor: Saneaki Ariumi (Kyoto, JP)
Assignee: MURATA MANUFACTURING CO., LTD.
H01Q21/0025H01Q1/22H01Q9/0407H01Q13/08H01Q21/065H01Q23/00
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Quick Facts
Patent No.
US 11,031,700
App. No.
16/592,989
Granted
Jun 8, 2021
Kind
B2
Abstract

An antenna module ( 10 ) includes a dielectric substrate ( 110 ), patch antennas ( 100 ) that are disposed at locations near a first main surface of the dielectric substrate ( 110 ), a RFIC ( 30 ) that is mounted at a location near a second main surface of the dielectric substrate ( 110 ) opposite the first main surface and that is electrically connected to the patch antennas ( 100 ), and an identification mark ( 50 ) that is located in an antenna arrangement area that is an area of the dielectric substrate ( 110 ) except for an outer circumferential area in which the patch antennas ( 100 ) are not arranged. The identification mark ( 50 ) is located in the antenna arrangement area so as not to overlap feed points ( 115 ) with which the respective patch antennas ( 100 ) are provided in a plan view of the first main surface.

Claims (69)

1. An antenna module comprising:

a dielectric substrate;

patch antennas disposed at locations near a first main surface of the dielectric substrate;

a radio frequency circuit component mounted at a location near a second main surface of the dielectric substrate opposite the first main surface and electrically connected to the patch antennas; and

an identification mark located in an antenna arrangement area, wherein the antenna arrangement area is an area of the dielectric substrate near the first main surface of the dielectric substrate except for an outer circumferential area in which the patch antennas are not arranged when viewed in a plan view of the first main surface,

wherein the identification mark is located in the antenna arrangement area so as not to overlap feed points provided in respective ones of the patch antennas when viewed in a plan view of the first main surface,

wherein the patch antennas include a first patch antenna, a second patch antenna, a third patch antenna and a fourth patch antenna,

wherein the first patch antenna and the second patch antenna are adjacent to each other in a row direction in the plan view,

wherein the third patch antenna and the fourth patch antenna are adjacent to each other in the row direction,

wherein the first patch antenna and the third patch antenna are adjacent to each other in a column direction intersecting with the row direction in the plan view,

wherein the second patch antenna and the fourth patch antenna are adjacent to each other in the column direction in the plan view, and

wherein the identification mark is located so as to contain a center of gravity of a planar shape connecting the feed point of the first patch antenna, the feed point of the second patch antenna, the feed point of the third patch antenna, and the feed point of the fourth patch antenna to each other in the plan view.

2. The antenna module according to claim 1 , wherein the identification mark does not overlap any of the patch antennas in the plan view.

3. The antenna module according to claim 2 , wherein the identification mark is composed of a metal material.

4. The antenna module according to claim 1 , wherein the identification mark is composed of a dielectric material.

5. The antenna module according to claim 1 , further comprising:

a shield wire disposed at a location near the first main surface between the patch antennas in the plan view and extending in directions in which the patch antennas are arranged, and

wherein the identification mark does not overlap the shield wire in the plan view.

6. A communication device comprising:

the antenna module according to claim 1 ; and

a base band integrated circuit,

wherein the radio frequency circuit component is a radio frequency integrated circuit configured to perform a signal process of a transmission system for outputting, to each patch antenna, a signal received from the base band integrated circuit and up-converted, or a signal process of a reception system for outputting, to the base band integrated circuit, a radio frequency signal received from each patch antenna and down-converted, or both.

7. The antenna module according to claim 2 , further comprising:

a shield wire disposed at a location near the first main surface between the patch antennas in the plan view and extending in directions in which the patch antennas are arranged, and

wherein the identification mark does not overlap the shield wire in the plan view.

8. An antenna module comprising:

a dielectric substrate;

patch antennas disposed at locations near a first main surface of the dielectric substrate;

a radio frequency circuit component mounted at a location near a second main surface of the dielectric substrate opposite the first main surface and electrically connected to the patch antennas; and

an identification mark located in an antenna arrangement area, wherein the antenna arrangement area is an area of the dielectric substrate near the first main surface of the dielectric substrate except for an outer circumferential area in which the patch antennas are not arranged when viewed in a plan view of the first main surface,

wherein the identification mark is located in the antenna arrangement area so as not to overlap feed points provided in respective ones of the patch antennas when viewed in a plan view of the first main surface,

wherein the identification mark does not overlap any of the patch antennas in the plan view,

wherein the patch antennas are arranged in a matrix,

wherein the patch antennas include a first patch antenna and a second patch antenna, and the first patch antenna and the second patch antenna are adjacent to each other in a row direction in the plan view,

wherein the feed point of the first patch antenna is unevenly distributed in a column direction intersecting with the row direction from a center of the first patch antenna in the plan view, and

wherein the feed point of the second patch antenna is unevenly distributed in the column direction from a center of the second patch antenna in the plan view, and

wherein the identification mark is located between the first patch antenna and the second patch antenna.

9. The antenna module according to claim 8 , wherein the identification mark is composed of a metal material.

10. The antenna module according to claim 8 , further comprising:

a shield wire disposed at a location near the first main surface between the patch antennas in the plan view and extending in directions in which the patch antennas are arranged, and

wherein the identification mark does not overlap the shield wire in the plan view.

11. A communication device comprising:

the antenna module according to claim 8 ; and

a base band integrated circuit,

wherein the radio frequency circuit component is a radio frequency integrated circuit configured to perform a signal process of a transmission system for outputting, to each patch antenna, a signal received from the base band integrated circuit and up-converted, or a signal process of a reception system for outputting, to the base band integrated circuit, a radio frequency signal received from each patch antenna and down-converted, or both.

12. An antenna module comprising:

a dielectric substrate;

patch antennas disposed at locations near a first main surface of the dielectric substrate;

a radio frequency circuit component mounted at a location near a second main surface of the dielectric substrate opposite the first main surface and electrically connected to the patch antennas; and

an identification mark located in an antenna arrangement area, wherein the antenna arrangement area is an area of the dielectric substrate near the first main surface of the dielectric substrate except for an outer circumferential area in which the patch antennas are not arranged when viewed in a plan view of the first main surface,

wherein the identification mark is located in the antenna arrangement area so as not to overlap feed points provided in respective ones of the patch antennas when viewed in a plan view of the first main surface,

wherein the identification mark does not overlap any of the patch antennas in the plan view,

wherein the patch antennas are arranged in a matrix,

wherein the patch antennas include a first patch antenna and a second patch antenna, and the first patch antenna and the second patch antenna are adjacent to each other in a row direction in the plan view,

wherein the feed point of the first patch antenna is unevenly distributed in the row direction from a center of the first patch antenna in the plan view, and

wherein the feed point of the second patch antenna is unevenly distributed in the row direction from a center of the second patch antenna in the plan view, and

wherein the identification mark is located between the first patch antenna and the second patch antenna.

13. The antenna module according to claim 12 ,

wherein an area between the first patch antenna and the second patch antenna includes a first area nearer to the first patch antenna than to the second patch antenna, and a second area nearer to the second patch antenna than to the first patch antenna, and

wherein the identification mark is located in one of the first area and the second area nearer to a center of gravity between the feed point of the first patch antenna and the feed point of the second patch antenna.

14. The antenna module according to claim 12 , wherein the identification mark is composed of a metal material.

15. The antenna module according to claim 13 , wherein the identification mark is composed of a metal material.

16. The antenna module according to claim 12 , further comprising:

a shield wire disposed at a location near the first main surface between the patch antennas in the plan view and extending in directions in which the patch antennas are arranged, and

wherein the identification mark does not overlap the shield wire in the plan view.

17. A communication device comprising:

the antenna module according to claim 12 ; and

a base band integrated circuit,

wherein the radio frequency circuit component is a radio frequency integrated circuit configured to perform a signal process of a transmission system for outputting, to each patch antenna, a signal received from the base band integrated circuit and up-converted, or a signal process of a reception system for outputting, to the base band integrated circuit, a radio frequency signal received from each patch antenna and down-converted, or both.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 4, 2019
From: ARIUMI, SANEAKI
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 050626/0118 →
Priority Claims (1)
JP JP2017-076732 · Apr 7, 2017 · national
Continuity (2)
Continuation PCTJP2018012228 · Mar 26, 2018
Related Publication 20200036103A1 · Jan 30, 2020
Cited By (2)
US 12,266,857 US 12,322,867