IP Library › Granted Patent US 11,032,936
Granted Patent B2
US 11,032,936 · App. 16/671,943 · Granted Jun 8, 2021

Information processing device and board device

Inventors: Tsuyoshi So (Kawasaki, JP); Takaya Nakayama (Kawasaki, JP); Jiro Tsujimura (Kawasaki, JP); Yuki Kanai (Kawasaki, JP); Yoichi Sato (Kawasaki, JP)
Assignee: FUJITSU LIMITED
H05K7/20163H05K5/0256H05K7/20172H05K7/20436
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Quick Facts
Patent No.
US 11,032,936
App. No.
16/671,943
Granted
Jun 8, 2021
Kind
B2
Abstract

An information processing device includes a board, a receiver that includes a top wall facing the board, the receiver to allow a coupling device to be inserted into a space between the board and the top wall, a movable part provided in the top wall, the movable part to be movable in a direction facing the board, the movable part having a contact portion to be in contact with a top surface of the coupling device, an elastic part that has elasticity provided at the movable part, the elastic part urging the movable part toward the board, a heat sink thermally coupled to the movable part through the elastic part, a housing positioned over a side opposite the board relative to the heat sink, the housing having a facing wall facing the heat sink, and a fan to supply wind to the heat sink along the facing wall.

Claims (27)

1. An information processing device comprising:

a board;

a receiver that includes a top wall facing the board, the receiver configured to allow a coupling device to be inserted into a space between the board and the top wall;

a movable part provided in the top wall, the movable part configured to be movable in a direction facing the board, the movable part having a contact portion configured to be in contact with a top surface of the coupling device;

an elastic part that has elasticity provided at the movable part, the elastic part urging the movable part toward the board;

a housing positioned over a side opposite the board relative to the heat sink, the housing having a facing wall facing the heat sink;

a fan configured to supply wind to the heat sink along the facing wall;

a heat generator, separate from the coupling device, disposed over the board and positioned upstream of the movable part in a wind flowing direction;

a heat transfer member thermally coupled to the elastic part and the heat generator;

a first heat sink thermally coupled to the heat transfer member and the heat generator; and

a second heat sink thermally coupled to the heat transfer member.

2. The information processing device according to claim 1 , wherein the first heat sink is positioned upstream of the second heat sink in a wind flowing direction.

3. The information processing device according to claim 1 , wherein the heat generator is positioned upstream of the second heat sink in a wind flowing direction, and the second heat sink is disposed relative to the heat generator in a direction perpendicular to the wind flowing direction in plan view of the board.

4. The information processing device according to claim 1 , wherein the first heat sink is positioned on a top surface of the heat generator.

5. The information processing device according to claim 4 , wherein the heat transfer member is a heat pipe.

6. The information processing device according to claim 1 , wherein the contact portion is a projecting portion that projects toward the board relative to the top wall.

7. A board device comprising:

a board;

a receiver that includes a top wall facing the board, the receiver configured to allow a coupling device to be inserted into a space between the board and the top wall;

a movable part provided in the top wall, the movable part configured to be movable in a direction facing the board, the movable part having a contact portion configured to be in contact with a top surface of the coupling device;

an elastic part that has elasticity provided at the movable part, the elastic part urging the movable part toward the board;

a heat generator, separate from the coupling device, disposed over the board and positioned upstream of the movable part in a wind flowing direction;

a heat transfer member thermally coupled to the elastic part and the heat generator;

a first heat sink thermally coupled to the heat transfer member and the heat generator; and

a second heat sink thermally coupled to the heat transfer member.

8. The board device according to claim 7 , wherein the first heat sink is positioned upstream of the second heat sink in a wind flowing direction.

9. The board device according to claim 7 , wherein the contact portion is a projecting portion that projects toward the board relative to the top wall.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 1, 2019
From: SO, TSUYOSHI; NAKAYAMA, TAKAYA; TSUJIMURA, JIRO; KANAI, YUKI; SATO, YOICHI
To: FUJITSU LIMITED
Reel/Frame 050915/0772 →
Priority Claims (1)
JP JP2018-217700 · Nov 20, 2018 · national
Continuity (1)
Related Publication 20200163249A1 · May 21, 2020