Semiconductor structure and fabrication method thereof
A semiconductor structure and fabrication method thereof are provided. The fabrication method includes: providing a base substrate including a substrate and a plurality of fins on the substrate; forming gate structures across the fins, to cover a portion of sidewalls of the fins and a portion of top surfaces of the fins; forming stress layers in the fins on sides of each gate structure; forming barrier layers on sidewalls of the gate structure; and forming doped regions by applying first ion implantation processes to the fins under the stress layers using the barrier layers as a mask.
1. A fabrication method for a semiconductor structure, comprising:
providing a base substrate including a substrate and a plurality of fins on the substrate;
forming gate structures each across the fins, each gate structure includes a gate dielectric layer, a gate electrode on the gate dielectric layer, an interface layer on the gate electrode, a first hard mask layer on the interface layer, a second hard mask layer on the first hard mask layer, gate spacers on sidewalls of the gate electrode, sidewalls of the interface layer, sidewalls of the first hard mask layer, and sidewalls of the second mask layer, a first mask layer on the gate spacers, and a second mask layer on the first mask layer;
forming stress layers in each fin on sides of each gate structure;
after forming the stress layers and before forming barrier layers, forming a stop layer on the stress layers and on the gate structures;
forming the barrier layers on sidewalls of each gate structure after forming the stop layer;
forming doped regions by a first ion implantation process on a portion of the fins under the stress layers using the barrier layers as an etch mask.
2. The method according to claim 1 , wherein:
the stop layer is made of a material including silicon nitride.
3. The method according to claim 2 , wherein:
the stop layer has a thickness of about 60 Å to about 200 Å.
4. The method according to claim 1 , wherein:
when the semiconductor structure includes an N-type device, the first ion implantation process is performed using implanting ions including arsenic ions, and an implanting energy of about 2 keV to about 30 keV; and
when the semiconductor structure has P-type devices, the first ion implantation process is performed using implanting ions including boron ions, and an implanting energy of about 1 keV to about 10 keV.
5. The method according to claim 1 , wherein:
when the semiconductor structure includes an N-type device, the barrier layers have a thickness of about 50 Å to about 300 Å; and
when the semiconductor structure includes a P-type device, the barrier layers have a thickness of about 50 Å to about 250 Å.
6. The method according to claim 1 , wherein:
the barrier layers are made of a material including silicon oxide.
7. The method according to claim 1 , wherein:
when the semiconductor structure includes an N-type device, the first ion implantation process is performed using implanting ions including arsenic ions, and an implanting energy of about 2 keV to about 30 keV; and
when the semiconductor structure has P-type devices, the first ion implantation process is performed using implanting ions including boron ions, and an implanting energy of about 1 keV to about 10 keV.
8. The method according to claim 1 , after forming the barrier layers, further including:
forming stress layer doped regions by performing a second ion implantation process on the stress layers; wherein:
the stress layer doped regions and the doped regions together constitute the source/drain doped regions of the semiconductor structure.
9. The method according to claim 8 , further including:
performing an annealing process after the ion implantation processes for forming the source/drain doped regions.
10. The method according to claim 1 , wherein:
the substrate includes an N-type region for forming N-type devices and a P-type region for forming P-type devices.
11. The method according to claim 1 , wherein:
the semiconductor structure includes input/output devices.
12. The method according to claim 1 , further including:
removing the barrier layers after forming the doped regions.
13. The method according to claim 12 , after removing the barrier layers, further including:
forming a dielectric layer on the stop layer;
forming through holes in the dielectric layer by using the stop layer as an etch stop layer; and
forming conductive plugs in the through holes.
14. The method according to claim 1 , wherein the stop layer is directly on and directly covers the second mask layer, the first mask layer, the gate spacers, and the second hard mask layer.