Systems and methods for signal communication with scalable, modular network nodes
A radio frequency (RF) aperture includes an interface board. An array of electrically conductive tapered projections have bases disposed on a front side of the interface printed circuit board and extend away from the front side of the interface printed circuit board. RF circuitry is disposed at the back side of the interface board and is electrically connected with the electrically conductive tapered projections.
1. A radio frequency (RF) aperture comprising:
an interface board having a front side and a back side;
an array of electrically conductive tapered projections having bases disposed on the front side of the interface board and extending away from the front side of the interface board, wherein the electrically conductive tapered projections are hollow and one or more electronic components are disposed inside the hollow electrically conductive tapered projections; and
RF circuitry disposed at the back side of the interface board and electrically connected with the array of electrically conductive tapered projections on the front side of the interface board.
2. The RF aperture of claim 1 wherein the interface board is an interface printed circuit board and the one or more electronic components disposed inside the hollow electrically conductive tapered projections are mounted on the front side of the interface printed circuit board and are electrically connected with the back side of the interface printed circuit board by electrical feedthroughs passing through the interface printed circuit board.
3. The RF aperture of claim 2 wherein the one or more electronic components disposed inside the hollow electrically conductive tapered projections and mounted on the front side of the interface printed circuit board are disposed in a recess or hole in the front side of the interface printed circuit board.
4. A radio frequency (RF) aperture comprising:
an interface board having a front side and a back side;
an array of electrically conductive tapered projections having bases disposed on the front side of the interface board and extending away from the front side of the interface board; and
RF circuitry disposed at the back side of the interface board and electrically connected with the array of electrically conductive tapered projections on the front side of the interface board;
wherein the electrically conductive tapered projections of the array of electrically conductive tapered projections include a first set of electrically conductive tapered projections of equal size arranged in a rectilinear array and a second set of electrically conductive tapered projections disposed between the electrically conductive tapered projections of the first set of electrically conductive tapered projections.
5. The RF aperture of claim 4 wherein the electrically conductive tapered projections of the array of electrically conductive tapered projections are arranged in a rectilinear array are randomly positioned on the front side of the interface printed circuit board.
6. A radio frequency (RF) aperture comprising:
an interface board having a front side and a back side;
an array of electrically conductive tapered projections having bases disposed on the front side of the interface board and extending away from the front side of the interface board;
dielectric filler disposed between the electrically conductive tapered projections; and
RF circuitry disposed at the back side of the interface board and electrically connected with the array of electrically conductive tapered projections on the front side of the interface board.
7. The RF aperture of claim 6 wherein the dielectric filler has a step-graded permittivity.
8. The RF aperture of claim 6 wherein the dielectric filler comprises multiple layers in which the layers have different permittivities.
9. The RF aperture of claim 6 wherein the dielectric filler has a graded permittivity.
10. A radio frequency (RF) aperture comprising:
an interface board having a front side and a back side;
an array of faceted electrically conductive tapered projections having bases disposed on the front side of the interface board and extending away from the front side of the interface board; and
RF circuitry disposed at the back side of the interface board and electrically connected with aperture pixels comprising differential RF receive and/or transmit elements defined by neighboring facets of neighboring pairs of faceted electrically conductive tapered projections, wherein the RF circuitry includes one or more signal chains each comprising:
a receive signal chain;
a transmit signal chain; and
a switch, duplexer, or circulator coupled to the receive signal chain and to the transmit signal chain.
11. The RF aperture of claim 10 wherein each signal chain further comprises one or more baluns coupling the switch, duplexer, or circulator to one or more aperture pixels.
12. The RF aperture of claim 11 wherein:
the receive signal chain includes a low noise amplifier; and
the transmit signal chain includes a power amplifier.
13. The RF aperture of claim 11 wherein the one or more signal chains include:
row signal chains driving rows of aperture pixels; and
column signal chains driving columns of aperture pixels.
14. The RF aperture of claim 10 wherein the one or more signal chains are each differential signal chains comprising:
a differential receive signal chain;
a differential transmit signal chain; and
a switch, duplexer, or circulator coupled to the receive signal chain and to the transmit signal chain;
wherein the switch, duplexer, or circulator is coupled to one or more aperture pixels without an intervening balun.
15. The RF aperture of claim 14 wherein:
the differential receive signal chain includes a low noise amplifier; and
the differential transmit signal chain includes a power amplifier.
16. The RF aperture of claim 14 wherein the one or more differential signal chains include:
row differential signal chains driving rows of aperture pixels; and
column differential signal chains driving columns of aperture pixels.
17. The RF aperture of claim 10 wherein the faceted electrically conductive tapered projections are four-sided pyramids with four-fold rotational symmetry.
18. The RF aperture of claim 17 wherein each faceted electrically conductive tapered projection further includes a square apex facet at which the four sides of the four-sided pyramid meet.
19. The RF aperture of claim 10 wherein the faceted electrically conductive tapered projections are one of:
four-sided pyramids with two-fold rotational symmetry;
six-sided hexagonal pyramids with six-fold rotational symmetry; or
triangular pyramids with three-fold rotational symmetry.