IP Library › Granted Patent US 11,038,595
Granted Patent B2
US 11,038,595 · App. 16/409,723 · Granted Jun 15, 2021

Optical transmission/reception circuit

Inventors: Alexandre Coullomb (Apprieu, FR); Romain Coffy (Voiron, FR); Jean-Michel Riviere (Froges, FR)
Assignee: STMicroelectronics (Grenoble 2) SAS
H04B10/40H01L25/042H01L31/0203H04B10/501H04B10/691
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Quick Facts
Patent No.
US 11,038,595
App. No.
16/409,723
Granted
Jun 15, 2021
Kind
B2
Abstract

An optoelectronic device includes a substrate and a first optoelectronic chip flush with a surface of the substrate. The device includes a cover that covers the substrate and the first optoelectronic chip. The cover comprises a cavity above a first optical transduction region of the first optoelectronic chip. The device also includes a second optoelectronic chip having a second optical transduction region spaced apart from the first optical transduction region and the cavity continues above the second optical transduction region.

Claims (38)

1. A device comprising:

a substrate including a top surface;

a first optoelectronic chip positioned in the substrate and having a top surface flush with the top surface of the substrate;

a second optoelectronic chip positioned in the substrate and having a top surface flush with the top surface of the substrate; and

a cover covering the substrate, the first optoelectronic chip, and the second optoelectronic chip, the cover including a first cavity that extends continuously over a first optical transduction region of the first optoelectronic chip and over a second optical transduction region of the second optoelectronic chip.

2. The device of claim 1 , wherein the cover has a planar surface mechanically coupled to the top surface of the substrate.

3. The device of claim 1 , wherein the cover comprises an electric connection in contact with the first optoelectronic chip.

4. The device of claim 1 , wherein the first cavity is filled with a transparent material.

5. The device of claim 1 , wherein the cover comprises a transparent element above the first optical transduction region.

6. The device of claim 5 , wherein the transparent element is continued above the second optical transduction region.

7. The device of claim 5 , further comprising a shield partially covering the transparent element above the second optical transduction region.

8. The device of claim 1 , further comprising a transparent element in the cover, the transparent element overlying a third optical transduction region of the second optoelectronic chip.

9. The device of claim 1 , wherein the cover includes a second cavity extending over at least a portion of the second optoelectronic chip.

10. The device of claim 9 , wherein a portion of the cover located between the first cavity and the second cavity contacts the second optoelectronic chip between the second optical transduction region and a third optical transduction region of the second optoelectronic chip.

11. The device of claim 10 , further comprising a transparent element in the cover, the transparent element overlying the second cavity and aligned with the third optical transduction region.

12. A device comprising:

a substrate;

a first optoelectronic chip positioned in the substrate and having a first optical transduction region;

a second optoelectronic chip positioned in the substrate and having a second optical transduction region; and

a cover covering the substrate and the first and second optoelectronic chips, wherein the cover includes a cavity that extends continuously over the first and second optical transduction regions.

13. The device of claim 12 , wherein the cover comprises an electric connection in contact with the chip.

14. The device of claim 12 , further comprising a transparent element that fills the cavity.

15. The device of claim 12 , further comprising a shield partially covering the transparent element above the second transduction region.

16. The device of claim 12 , further comprising a transparent element in the cover, the transparent element overlying the cavity and aligned with the first optical transduction region of the first optoelectronic chip.

17. A device comprising:

a substrate including a top surface;

an optical transmitter positioned in the substrate and having a top surface flush with the top surface of the substrate;

a first optical receiver positioned in the substrate and having a top surface flush with the top surface of the substrate; and

a cover covering the substrate and including a cavity overlying the optical transmitter and the first optical receiver, the cavity extending continuously from a first position overlying a portion of the optical transmitter to a second position overlying a portion of the first optical receiver.

18. The device of claim 17 , wherein a portion of the cover extends over a first portion of the cavity and overlies the first optical receiver, and the cover includes an opening that overlies a second portion of the cavity and overlies the optical transmitter, the device further comprising a transparent element that fills the opening and overlies the second portion of the cavity and the optical transmitter.

19. The device of claim 17 , further comprising:

a transparent element that fills the cavity; and

a shield partially covering the transparent element above the first optical receiver.

20. The device of claim 17 , further comprising:

a first optoelectronic chip positioned in the substrate and including the first optical receiver and a second optical receiver;

a second optoelectronic chip positioned in the substrate and including the optical transmitter;

a first transparent element positioned in a first opening of the cover and overlying the second optical receiver; and

a second transparent element positioned in a second opening of the cover and overlying the optical transmitter.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 8, 2020
From: COULLOMB, ALEXANDRE; COFFY, ROMAIN; RIVIERE, JEAN-MICHEL
To: STMICROELECTRONICS (GRENOBLE 2) SAS
Reel/Frame 052870/0092 →
Priority Claims (1)
FR 1854154 · May 18, 2018 · national
Continuity (1)
Related Publication 20190356390A1 · Nov 21, 2019