Assembly and sub-assembly for thermal control of electronic devices
An assembly for controlling the temperature of a device includes: a heat sink configured to be maintained at a temperature below a desired set point temperature; a heater element having a surface configured to be thermally coupled to a surface of the device; and a thermally conductive pedestal interposed between the heat sink and the heater element. The heater is configured to apply heat to the device when the temperature of the device falls below the set point temperature, and heat is transferable to the heat sink through the pedestal and heater element when the temperature of the device is above the set point temperature.
1. A thermal control assembly comprising:
a heat sink configured to be maintained at a temperature below a desired set point temperature;
a heater element having a surface configured to be thermally coupled to a surface of a device; and
a thermally conductive pedestal interposed between the heat sink and the heater element;
wherein the heater element is configured to apply heat to the device when the temperature of the device falls below the set point temperature, and heat is transferable to the heat sink through the pedestal and heater element when the temperature of the device is above the set point temperature.
2. The thermal control assembly of claim 1 , further comprising a thermally conductive interface material disposed between the heat sink and the pedestal.
3. The thermal control assembly of claim 2 , wherein the interface material comprises a carbon nanotube material.
4. The thermal control assembly of claim 2 , wherein the interface material comprises a thermally conductive epoxy.
5. The thermal control assembly of claim 1 , further comprising a thermally conductive interface material disposed between the pedestal and the heater element.
6. The thermal control assembly of claim 5 , wherein the interface material comprises a thermally conductive elastomeric material.
7. The thermal control assembly of claim 1 , wherein the thermal control assembly is movable relative to the device to thermally couple with a surface of the device.
8. The thermal control assembly of claim 1 , further comprising a thermally conductive metallization layer formed on the surface of the heater element so as to contact a surface of the device.
9. The thermal control assembly of claim 1 , wherein the heater element and pedestal form a sub-assembly that is detachable from the heat sink.
10. The thermal control assembly of claim 1 , wherein the sub- assembly mounts to the heat sink at at least two angular orientations.
11. A thermal control sub-assembly comprising:
a heater element having a first surface and an opposing second surface, the second surface configured to be thermally coupled to a surface of a device;
a thermally conductive pedestal attached to the first surface so as to establish a thermal path to transfer heat from the device via the heater element to a heat sink,
wherein the heater is configured to apply heat to the device when the temperature of the device falls below a set point temperature, and heat is transferable to the heat sink through the pedestal and heater element when the temperature of the device is above the set point temperature.
12. The thermal control sub-assembly of claim 11 , further comprising a thermally conductive interface material disposed between the heat sink and the pedestal.
13. The thermal control sub-assembly of claim 12 , wherein the interface material comprises a carbon nanotube material.
14. The thermal control sub-assembly of claim 12 , wherein the interface material comprises a thermally conductive epoxy.
15. The thermal control sub-assembly of claim 11 , further comprising a thermally conductive interface material disposed between the pedestal and the heater element.
16. The thermal control sub-assembly of claim 15 , wherein the interface material comprises a thermally conductive elastomeric material.
17. The thermal control sub-assembly of claim 11 , further comprising a retaining member configured to attach the thermal control sub-assembly to a thermal head that includes the heat sink.
18. The thermal control sub-assembly of claim 11 , further comprising a thermally conductive metallization layer formed on the surface of the heater element so as to contact a defined surface of the device.