Electronic component module and manufacturing method thereof
An electronic component module includes an electronic component, a resin structure body, a through wiring, a wiring layer, and a close-contact layer. The resin structure body covers at least a portion of the electronic component. The through wiring extends through the resin structure body. The wiring layer electrically connects the electronic component and the through wiring to each other. The close-contact layer is provided between the resin structure body and the through wiring and is in contact with the resin structure body and the through wiring. The close-contact layer includes an inorganic insulation film.
1. An electronic component module comprising: an electronic component; a resin structure body that covers at least a portion of the electronic component; a through wiring that extends through the resin structure body; a wiring layer that electrically connects the electronic component and the through wiring to each other; and a close-contact layer that is provided at least between the resin structure body and the through wiring and is in contact with the resin structure body and the through wiring; wherein the close-contact layer includes an inorganic insulation film; the close-contact layer further includes a diffusion prevention film that is made of a material differing from a material of the inorganic insulation film and that reduces diffusion of metal; and the diffusion prevention film is disposed between the inorganic insulation film and the through wiring.
2. The electronic component module according to claim 1 , wherein the close-contact layer includes: a first close-contact portion in contact with the resin structure body and the through wiring; and a second close-contact portion in contact with the resin structure body and the wiring layer.
3. The electronic component module according to claim 2 , wherein the first close-contact portion and the second close-contact portion are integral with each other.
4. The electronic component module according to claim 3 , wherein the first close-contact portion and the second close-contact portion are made of a same or substantially a same material as each other.
5. The electronic component module according to claim 1 , wherein the inorganic insulation film is made of a metal oxide or a metal nitride having electrical insulation properties, or a silicon oxide or a silicon nitride.
6. The electronic component module according to claim 1 , wherein the diffusion prevention film is made of at least one of a silicon nitride and a metal oxide.
7. The electronic component module according to claim 1 , wherein the resin structure body is made of an epoxy resin or a polyimide resin.
8. The electronic component module according to claim 1 , wherein the wiring layer is made of a conductor including Cu.
9. The electronic component module according to claim 1 , wherein the through wiring is made of Cu.
10. The electronic component module according to claim 1 , further comprising: an electrode on the wiring layer; and a resist layer on the wiring layer, the resist layer being in a location that differs from a location of the electrode; wherein the resist layer is made of a material having lower wettability than the electrode and the wiring layer.
11. The electronic component module according to claim 1 , further comprising: an external-connection wiring layer electrically connected to the through wiring; and a resist layer on the external-connection wiring layer; wherein the resist layer is made of a material having lower wettability than the external-connection wiring layer.