Pressure sensor package

1. A pressure sensor package, comprising:

a package lead frame comprising a molding plastic layer defining a top surface and a plurality of lead frame units mounted in said molding plastic layer;

a sidewall disposed on said top surface of said molding plastic layer and surrounding a receiving chamber and an opening;

a pressure sensor module mounted directly on said top surface of said molding plastic layer and disposed in said receiving chamber; and

a packaging silicone mounted in said receiving chamber to encapsulate said pressure sensor module, and said packaging silicone being exposed to said opening of said sidewall.

2. The pressure sensor package as claimed in claim 1 , wherein said molding plastic layer further defines an opposite bottom surface; said lead frame units each comprising a top edge and an opposing bottom edge respectively exposed to an outside of the opposing said top surface and said bottom surface of said molding plastic layer.

3. The pressure sensor package as claimed in claim 1 , wherein said sidewall is selectively made from a molding resin or a metal material.

4. The pressure sensor package as claimed in claim 1 , wherein said pressure sensor module comprises a plurality of chip units stacked up on said top surface of said molding plastic layer.

5. The pressure sensor package as claimed in claim 1 , wherein said pressure sensor module is electrically connected with said lead frame units by metal wires.

6. The pressure sensor package as claimed in claim 1 , wherein said molding plastic layer is made from epoxy resin.

7. The pressure sensor package as claimed in claim 1 , wherein said lead frame units are made from a metal material.