IP Library › Granted Patent US 11,047,039
Granted Patent B2
US 11,047,039 · App. 16/232,496 · Granted Jun 29, 2021

Substrate carrier having hard mask

Inventors: Alexander Lerner (San Jose, CA); Kim Vellore (San Jose, CA); Ami Sade (Sunnyvale, CA); Steven Sansoni (Livermore, CA); Andrew Constant (Cupertino, CA); Kevin Moraes (Fremont, CA); Roey Shaviv (Palo Alto, CA); Niranjan Kumar (Cupertino, CA); Jeffrey Brodine (Los Gatos, CA); Michael Karazim (San Jose, CA)
Assignee: APPLIED MATERIALS, INC.
C23C14/50C23C14/042C23C14/24
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Quick Facts
Patent No.
US 11,047,039
App. No.
16/232,496
Granted
Jun 29, 2021
Kind
B2
Abstract

Substrate carrier apparatus having a hard mask are disclosed herein. In some embodiments, a substrate carrier apparatus includes a carrier body having a support surface to support a substrate; and a mask assembly disposed above the support surface. The mask assembly includes an annular frame disposed atop the support surface; and a hard mask coupled to and disposed within the annular frame above the support surface, wherein the hard mask includes one or more openings arranged in a predetermined pattern and disposed through the hard mask, and wherein the hard mask includes a plurality of spacer elements extending from a bottom surface of the hard mask.

Claims (32)

1. A substrate carrier apparatus, comprising:

a carrier body having a support surface to support a substrate; and

a mask assembly disposed above the support surface, the mask assembly comprising:

an annular frame disposed atop the support surface; and

a hard mask coupled to and disposed within the annular frame above the support surface, wherein the hard mask includes one or more openings arranged in a predetermined pattern and disposed through the hard mask, and wherein the hard mask includes a plurality of spacer elements extending from a bottom surface of the hard mask.

2. The substrate carrier apparatus of claim 1 , further comprising:

a flexure element coupled to the annular frame and configured to compensate for substrate thickness variations.

3. The substrate carrier apparatus of claim 2 , wherein the flexure element includes a plurality of springs, each of which is coupled to the annular frame at a first end, and a corresponding plurality of coupling bodies, each of which is coupled to a corresponding one of the plurality of springs at a second end of the spring opposite the annular frame, and wherein the plurality of coupling bodies are coupled to an upper surface of the hard mask.

4. The substrate carrier apparatus of claim 2 , wherein the flexure element comprises one or more elastomeric elements disposed between the annular frame and the support surface.

5. The substrate carrier apparatus of claim 1 , wherein the plurality of spacer elements are configured to maintain a predetermined gap between the hard mask and the substrate between about 20 μm and about 50 μm, when the substrate is disposed atop the support surface.

6. The substrate carrier apparatus of claim 1 , further comprising:

one or more magnets disposed in the carrier body beneath the support surface in an area beneath the annular frame to bias the annular frame towards the carrier body.

7. The substrate carrier apparatus of claim 1 , wherein the hard mask further comprises one or more protrusions extending from the bottom surface of the hard mask and configured to prevent deflection of the hard mask towards the substrate beyond a predetermined deflection.

8. The substrate carrier apparatus of claim 1 , wherein the carrier body is formed of a non-metallic material.

9. The substrate carrier apparatus of claim 1 , wherein a thickness of the hard mask is between about 20 μm and about 50 μm.

10. The substrate carrier apparatus of claim 1 , wherein the support surface is textured.

11. The substrate carrier apparatus of claim 1 , wherein the carrier body is a portable electrostatic chuck.

12. A substrate carrier apparatus, comprising:

a carrier body having a support surface to support a substrate; and

a mask assembly disposed above the support surface, the mask assembly comprising:

an annular frame disposed atop the support surface;

a hard mask coupled to and disposed within the annular frame above the support surface, wherein the hard mask includes one or more openings arranged in a predetermined pattern and disposed through the hard mask, and wherein the hard mask includes a plurality of spacer elements extending from a bottom surface of the hard mask to maintain a predetermined gap between the hard mask and the substrate between about 20 μm and about 50 μm, when the substrate is disposed atop the support surface; and

a flexure element coupled to the annular frame and configured to compensate for substrate thickness variations.

13. The substrate carrier apparatus of claim 12 , wherein the flexure element includes a plurality of springs, each of which is coupled to the annular frame at a first end, and a corresponding plurality of coupling bodies, each of which is coupled to a corresponding one of the plurality of springs at a second end of the spring opposite the annular frame, and wherein the plurality of coupling bodies are coupled to an upper surface of the hard mask.

14. The substrate carrier apparatus of claim 12 , wherein the flexure element comprises one or more elastomeric elements disposed between the annular frame and the support surface.

15. The substrate carrier apparatus of claim 12 , further comprising:

one or more magnets disposed in the carrier body beneath the support surface in an area beneath the annular frame to bias the annular frame towards the carrier body.

16. The substrate carrier apparatus of claim 12 , wherein the hard mask further comprises one or more protrusions extending from the bottom surface of the hard mask and configured to prevent deflection of the hard mask towards the substrate beyond a predetermined deflection.

17. The substrate carrier apparatus of claim 12 , wherein the carrier body is formed of a non-metallic material.

18. The substrate carrier apparatus of claim 12 , wherein a thickness of the hard mask is between about 20 μm and about 50 μm.

19. The substrate carrier apparatus of claim 12 , wherein the support surface is textured.

20. The substrate carrier apparatus of claim 12 , wherein the carrier body is a portable electrostatic chuck.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 12, 2019
From: LERNER, ALEXANDER; VELLORE, KIM; SADE, AMI; SANSONI, STEVEN; CONSTANT, ANDREW; MORAES, KEVIN; SHAVIV, ROEY; KUMAR, NIRANJAN; BRODINE, JEFFREY; KARAZIM, MICHAEL
To: APPLIED MATERIALS, INC.
Reel/Frame 048305/0867 →
Continuity (2)
Provisional Application 62614777 · Jan 8, 2018
Related Publication 20190211442A1 · Jul 11, 2019