Multilayer electronic component

1. A multilayer electronic component, comprising:

a body including a dielectric layer and first and second internal electrodes alternately layered in a layering direction with the dielectric layer interposed therebetween, and including first and second surfaces opposing each other in the layering direction, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other;

a first external electrode disposed on the third surface, connected to the first internal electrode, and including a first electrode layer extending to a portion of each of the first, second, fifth, and sixth surfaces and a first conductive resin layer covering the first electrode layer; and

a second external electrode disposed on the fourth surface, connected to the second internal electrode, and including a second electrode layer extending to a portion of each of the first, second, fifth, and sixth surfaces and a second conductive resin layer covering the second electrode layer,

wherein R1 and R2 satisfy R1>R2, in which R1 is defined as a surface roughness of each of the first, second, fifth, and sixth surfaces in contact with the first and second electrode layers, and R2 is defined as a surface roughness of each of the first, second, fifth, and sixth surfaces in contact with the first and second conductive resin layers.

2. The multilayer electronic component of claim 1 , wherein an arithmetical average roughness of R1 is greater than 0.2 μm and 3.0 μm or less.

3. The multilayer electronic component of claim 1 , wherein an arithmetical average roughness of R2 is 0.3 μm or less.

4. The multilayer electronic component of claim 1 , wherein an arithmetical average roughness of R2 is greater than an arithmetical average roughness of a region of the first, second, fifth, and sixth surfaces exposed from the first and second external electrodes.

5. The multilayer electronic component of claim 1 , wherein an arithmetical average roughness of R1 is greater than an arithmetical average roughness of the third and fourth surfaces.

6. The multilayer electronic component of claim 1 , wherein the first and second conductive resin layers include a conductive metal and a base resin.

7. The multilayer electronic component of claim 1 , wherein the first and second electrode layers include a conductive metal and glass.

8. The multilayer electronic component of claim 1 , wherein a surface roughness of any portion of each of the first, second, fifth, and sixth surfaces in contact with the first and second electrode layers is defined as R1.

9. A multilayer electronic component, comprising:

a body including a dielectric layer and a capacitance forming portion including first and second internal electrodes alternately layered in a layering direction with the dielectric layer interposed therebetween and cover portions respectively disposed on and below the capacitance forming portion, and including first and second surfaces opposing each other in the layering direction, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other;

a first external electrode disposed on the third surface, connected to the first internal electrode, and including a first electrode layer extending to a portion of each of the first, second, fifth, and sixth surfaces and a first conductive resin layer covering the first electrode layer; and

a second external electrode 132 disposed on the fourth surface, connected to the second internal electrode, and including a second electrode layer extending to a portion of each of the first, second, fifth, and sixth surfaces and a second conductive resin layer covering the second electrode layer,

wherein R1′ and R2 satisfy R1′>R2, in which R1′ is defined as a surface roughness of the cover portions in contact with the first and second electrode layers, and R2 is defined as a surface roughness of each of the first, second, fifth, and sixth surfaces in contact with the first and second conductive resin layers.

10. The multilayer electronic component of claim 9 , wherein an arithmetical average roughness of R1′ is greater than 0.2 μm and 3.0 μm or less.

11. The multilayer electronic component of claim 9 , wherein an arithmetical average roughness of R2 is 0.3 μm or less.

12. The multilayer electronic component of claim 9 , wherein an arithmetical average roughness of R2 is greater than an arithmetical average roughness of a region of the first, second, fifth, and sixth surfaces exposed from the first and second external electrodes.

13. The multilayer electronic component of claim 9 , wherein an arithmetical average roughness of R1′ is greater than an arithmetical average roughness of a region of the third and fourth surfaces in which the capacitance forming portion is in contact with the first and second electrode layers.

14. The multilayer electronic component of claim 9 , wherein the first and second conductive resin layers include a conductive metal and a base resin.

15. The multilayer electronic component of claim 9 , wherein the first and second electrode layers include a conductive metal and glass.

16. The multilayer electronic component of claim 9 , wherein a surface roughness of any portion of each of the first, second, fifth, and sixth surfaces in contact with the first and second electrode layers is defined as R1′.