Method for manufacturing resistive random access memory structure

1. A method for manufacturing a semiconductor structure, comprising:

forming a bottom electrode layer over a substrate;

forming a dielectric layer over the bottom electrode layer;

forming a top electrode layer over the dielectric layer;

patterning the bottom electrode layer, the dielectric layer, and the top electrode layer to form a dielectric structure between a bottom electrode and a top electrode;

etching the bottom electrode from a sidewall of the bottom electrode to partially expose a bottom surface of the dielectric structure; and

forming an etch stop layer over the exposed bottom surface of the dielectric structure.

2. The method for manufacturing a semiconductor structure as claimed in claim 1 , wherein the dielectric structure is wider than the bottom electrode after etching the bottom electrode from the sidewall of the bottom electrode.

3. The method for manufacturing a semiconductor structure as claimed in claim 2 , further comprising:

etching the top electrode from a sidewall of the top electrode to partially expose a top surface of the dielectric structure.

4. The method for manufacturing a semiconductor structure as claimed in claim 3 , wherein the bottom electrode is wider than the top electrode after etching the top electrode from the sidewall of the top electrode.

5. The method for manufacturing a semiconductor structure as claimed in claim 1 , wherein the top electrode is wider than the bottom electrode after etching the top electrode from the sidewall of the top electrode.

6. The method for manufacturing a semiconductor structure as claimed in claim 1 , further comprising:

forming a hard mask structure over the top electrode; and

forming a via structure through the hard mask structure, wherein the via structure is in direct contact with the top electrode.

7. The method for manufacturing a semiconductor structure as claimed in claim 6 , further comprising:

forming an interlayer dielectric layer over the substrate, wherein a portion of the interlayer dielectric layer is sandwiched between the hard mask structure and the dielectric structure.

8. A method for manufacturing a semiconductor structure, comprising:

forming a bottom electrode layer over a substrate;

forming a dielectric layer over the bottom electrode layer;

forming a top electrode layer over the dielectric layer;

patterning the bottom electrode layer, the dielectric layer, and the top electrode layer to form a bottom electrode, a dielectric structure over the bottom electrode, and a top electrode over the dielectric structure, wherein a sidewall of the bottom electrode, a sidewall of the dielectric structure, and a sidewall of the bottom electrode are substantially aligned; and

recessing the bottom electrode and the top electrode, so that the dielectric structure becomes wider than the top electrode and the bottom electrode, and the bottom electrode and the top electrode have different widths after etching the top electrode from the sidewall of the top electrode.

9. The method for manufacturing a semiconductor structure as claimed in claim 8 , further comprising:

conformally forming an etch stop layer on the top electrode, the dielectric structure, and the bottom electrode, wherein the etch stop layer directly covers a top surface, a sidewall, and a bottom surface of the dielectric structure.

10. The method for manufacturing a semiconductor structure as claimed in claim 8 , further comprising:

forming an etch stop layer on sidewalls of the top electrode, the dielectric structure, and the bottom electrode; and

forming an interlayer dielectric layer on the etch stop layer,

wherein a portion of the dielectric structure overlaps the interlayer dielectric layer.

11. The method for manufacturing a semiconductor structure as claimed in claim 8 , wherein the sidewall of the bottom electrode, the sidewall of the top electrode, and the sidewall of the dielectric structure are not aligned with each other after recessing the bottom electrode and the top electrode.

12. The method for manufacturing a semiconductor structure as claimed in claim 8 , further comprising:

forming a hard mask structure over the top electrode;

forming an etch stop layer on sidewalls of the top electrode, the dielectric structure, the bottom electrode, and a top surface of the hard mask structure; and

forming an interlayer dielectric layer on the etch stop layer,

wherein a bottom surface of the hard mask structure is in direct contact with the etch stop layer.

13. A method for manufacturing a semiconductor structure, comprising:

forming a bottom electrode layer over a substrate;

forming a dielectric layer over the bottom electrode layer;

forming a top electrode layer over the dielectric layer;

patterning the bottom electrode layer, the dielectric layer, and the top electrode layer to form a dielectric structure between a bottom electrode and a top electrode; and

etching the bottom electrode and the top electrode by performing a wet etching process, so that an extending portion of the dielectric structure extrudes from the bottom electrode and the top electrode.

14. The method for manufacturing a semiconductor structure as claimed in claim 13 , wherein an etching rate of the bottom electrode is different from an etching rate of the top electrode during the wet etching process.

15. The method for manufacturing a semiconductor structure as claimed in claim 13 , wherein the etching process is performed at a temperature in a range from about 15° C. to about 80° C.

16. The method for manufacturing a semiconductor structure as claimed in claim 13 , wherein the etching process comprises using a mixture of NH 3 , H 2 O 2 , and H 2 O.

17. The method for manufacturing a semiconductor structure as claimed in claim 13 , further comprising:

forming an etch stop layer over sidewalls of the top electrode, the dielectric structure, and the bottom electrode and a top surface and a bottom surface of the dielectric structure.

18. The method for manufacturing a semiconductor structure as claimed in claim 6 , wherein the via structure is in direct contact with the hard mask structure.

19. The method for manufacturing a semiconductor structure as claimed in claim 12 , further comprising:

forming a via structure passing through the etch stop layer and through the hard mask structure.