Immersion cooling enclosures with insulating liners

1. An immersion cooling system, comprising:

a container constructed with a substrate material, the container having an internal space configured to contain a dielectric coolant submerging one or more computing devices in the internal space; and

an insulating liner between the substrate material of the container and the dielectric coolant in the internal space of the container, the insulating liner having a first side configured to be in contact with the dielectric coolant and a second side in direct contact with the substrate material of the container, wherein the insulating liner is non-permeable to the dielectric coolant.

2. The immersion cooling system of claim 1 wherein the insulating liner includes an insulating layer constructed from a polymeric material that is non-permeable to the dielectric coolant.

3. The immersion cooling system of claim 1 wherein the insulating liner includes:

an insulating layer constructed from a polymeric material that is non-permeable to the dielectric coolant; and

a protection layer between the insulating layer and the dielectric coolant, the protection layer being constructed from one or more of Nylon, Kevlar, ultra-high molecular weight polyethylene, silk, or carbon fibers.

4. The immersion cooling system of claim 1 wherein the insulating liner includes:

an insulating layer constructed from a polymeric material that is non-permeable to the dielectric coolant;

a protection layer between the insulating layer and the dielectric coolant, the protection layer being constructed from one or more of Nylon, Kevlar, ultra-high molecular weight polyethylene, silk, or carbon fibers; and

a sealing layer between the insulating layer and the substrate material of the container, the sealing layer being constructed from one or more of a ballistic gelatin or multiple strata of rubber.

5. The immersion cooling system of claim 1 wherein the insulating liner includes:

an insulating layer constructed from a polymeric material that is non-permeable to the dielectric coolant; and

a perfusion layer between the insulating layer and the substrate material of the container, the perfusion layer including one or more channels in fluid communication with a vacuum source configured to remove any dielectric coolant passing through the insulating layer.

6. The immersion cooling system of claim 1 wherein the insulating liner includes:

an insulating layer constructed from a polymeric material that is non-permeable to the dielectric coolant; and

a perfusion layer between the insulating layer and the substrate material of the container, the perfusion layer including a base having multiple protrusions extending toward the insulating layer, wherein adjacent pairs of protrusions form multiple channels in fluid communication with a vacuum source configured to remove any dielectric coolant passing through the insulating layer.

7. The immersion cooling system of claim 1 , further comprising a condenser in thermal communication with the internal space of the container, the condenser being configured to remove heat from a vapor of the dielectric coolant, thereby condensing the vapor of the dielectric coolant into a liquid returned to the internal space via gravity or pump.

8. The immersion cooling system of claim 1 , further comprising:

a condenser in thermal communication with the internal space of the container, the condenser being configured to remove heat from a vapor of the dielectric coolant, thereby condensing the vapor of the dielectric coolant into a liquid returned to the internal space via gravity or pump; and

wherein the container further includes:

a vapor outlet from the internal space of the container; and

a filter layer between the vapor outlet and the condenser, the filter layer being configured to allow air to pass through but not the vapor of the dielectric coolant.

9. The immersion cooling system of claim 1 wherein:

the container further includes a vapor outlet from the internal space of the container;

the immersion cooling system further includes:

a first condenser;

a second condenser between the first condenser and the vapor outlet, the first and second condensers both being in thermal communication with the internal space and configured to remove heat from a vapor of the dielectric coolant, thereby condensing the vapor of the dielectric coolant into a liquid returned to the internal space of the container via gravity or pump; and

a filter layer between the first and second condensers, the filter layer being configured to allow air to pass through but not the vapor of the dielectric coolant, the filter layer being constructed from carbon.

10. The immersion cooling system of claim 1 wherein:

the container further includes a vapor outlet from the internal space of the container;

the immersion cooling system further includes:

a first condenser;

a second condenser between the first condenser and the vapor outlet, the first and second condensers both being in thermal communication with the internal space and configured to remove heat from a vapor of the dielectric coolant, thereby condensing the vapor of the dielectric coolant into a liquid returned to the internal space of the container via gravity or pump; and

a first filter layer between the first and second condensers; and

a second filter layer at the vapor outlet, the first and second filter layers being configured to allow air to pass through but not the vapor of the dielectric coolant, the filter layer being constructed from carbon.

11. A computing facility, comprising:

multiple immersion cooling enclosures individually having:

a container constructed with a substrate material, the container having an internal space configured to contain a dielectric coolant submerging one or more computing devices in the internal space; and

an insulating liner on the second surface and the side surfaces of the container, the insulating liner having a first side in contact with the dielectric coolant and a second side in direct contact with the substrate material at the second surface and the side surfaces of the container, wherein the insulating liner is non-permeable to the dielectric coolant;

one or more servers in the internal space of the individual immersion cooling enclosures, the one or more servers being submerged in the dielectric coolant in the internal space of the respective immersion cooling enclosures; and

a manifold operatively coupled to one or more condensers of the individual immersion cooling enclosures, the manifold being coupled to a source of cooling fluid.

12. The computing facility of claim 11 wherein the insulating liner includes an insulating layer constructed from a polymeric material that is non-permeable to the dielectric coolant.

13. The computing facility of claim 11 wherein the insulating liner includes:

an insulating layer constructed from a polymeric material that is non-permeable to the dielectric coolant; and

a protection layer between the insulating layer and the dielectric coolant, the protection layer being constructed from one or more of Nylon, Kevlar, ultra-high molecular weight polyethylene, silk, or carbon fibers.

14. The computing facility of claim 11 wherein the insulating liner includes:

an insulating layer constructed from a polymeric material that is non-permeable to the dielectric coolant;

a protection layer between the insulating layer and the dielectric coolant, the protection layer being constructed from one or more of Nylon, Kevlar, ultra-high molecular weight polyethylene, silk, or carbon fibers; and

a sealing layer between the insulating layer and the substrate material of the container, the sealing layer being constructed from one or more of a ballistic gelatin or multiple strata of rubber.

15. The computing facility of claim 11 wherein the insulating liner includes:

an insulating layer constructed from a polymeric material that is non-permeable to the dielectric coolant;

a protection layer between the insulating layer and the dielectric coolant, the protection layer being constructed from one or more of Nylon, Kevlar, ultra-high molecular weight polyethylene, silk, or carbon fibers;

a sealing layer between the insulating layer and the substrate material of the container, the sealing layer being constructed from one or more of a ballistic gelatin or multiple strata of rubber; and

a perfusion layer between the insulating layer and the substrate material of the container, the perfusion layer including one or more channels in fluid communication with a vacuum source configured to remove any dielectric coolant passing through the insulating layer.

16. The computing facility of claim 11 wherein the insulating liner includes:

an insulating layer constructed from a polymeric material that is non-permeable to the dielectric coolant;

a protection layer between the insulating layer and the dielectric coolant, the protection layer being constructed from one or more of Nylon, Kevlar, ultra-high molecular weight polyethylene, silk, or carbon fibers;

a sealing layer between the insulating layer and the substrate material of the container, the sealing layer being constructed from one or more of a ballistic gelatin or multiple strata of rubber; and

a perfusion layer between the insulating layer and the substrate material of the container, the perfusion layer including a base having multiple protrusions extending toward the insulating layer, wherein adjacent pairs of protrusions form multiple channels in fluid communication with a vacuum source configured to remove any dielectric coolant passing through the insulating layer.

17. The computing facility of claim 10 wherein the containers individually include:

a vapor outlet from the internal space of the immersion cooling enclosure; and

a filter layer between the vapor outlet and the condenser, the filter layer being configured to allow air to pass through but not the vapor of the dielectric coolant.

18. A method of housing servers in a computing facility, the method comprising:

forming a container in a substrate material, the container having an internal space configured to contain a dielectric coolant submerging one or more computing devices in the internal space;

placing an insulating liner in the internal space of the container, the insulating liner having a first side configured to be in contact with the dielectric coolant and a second side facing and in direct contact with the substrate material of the container;

positioning one or more servers in the internal space of container having the placed insulating liner, the one or more servers being separated from the substrate material of the container by at least the insulating liner; and

sealing the one or more servers in the container and filling the internal space of the container with the dielectric coolant such that the one or more servers are submerged in the dielectric coolant.

19. The method of claim 18 wherein placing the insulating liner includes one or more of:

fastening the insulating liner to the second surface and the side surfaces of the container via one or more of an adhesive or a mechanical fastener; or

spraying an insulating material of the insulating liner onto the second surface and the side surfaces of the container.

20. The method of claim 18 wherein placing the insulating liner includes one or more of:

fastening the insulating liner to the second surface and the side surfaces of the container via one or more of an adhesive or a mechanical fastener, the insulating liner including an insulating layer constructed from a polymeric material that is non-permeable to the dielectric coolant and one or more of:

a protection layer between the insulating layer and the dielectric coolant, the protection layer being constructed from one or more of Nylon, Kevlar, ultra-high molecular weight polyethylene, silk, or carbon fibers;

a sealing layer between the insulating layer and the substrate material of the container, the sealing layer being constructed from one or more of a ballistic gelatin or multiple strata of rubber; or

a perfusion layer between the insulating layer and the substrate material of the container, the perfusion layer including one or more channels in fluid communication with a vacuum source configured to remove any dielectric coolant passing through the insulating layer; or

spraying a corresponding material of the insulating layer and one or more of the protection layer, the sealing layer, or the perfusion layer onto the second surface and the side surfaces of the container or a preceding layer.