Ultrasonic probe with heat dissipation
An ultrasonic probe includes: an acoustic element that generates an ultrasonic wave and detects the ultrasonic wave; a support that supports the acoustic element on a side opposite to a test object side; and a heat dissipation material disposed on a side of the support opposite to the acoustic element, wherein an attenuation/thermal conduction material made of an attenuating material containing a thermally conductive material is disposed in contact with the heat dissipation material.
1. An ultrasonic probe comprising:
an acoustic element that generates an ultrasonic wave and detects the ultrasonic wave, the acoustic element including a lens and a flexible printed circuit, the lens disposed at a first side of the flexible printed circuit;
a support that supports the acoustic element on an acoustic element side opposite to a test object side, the support disposed at a second side of the flexible printed circuit opposite the first side; and
a heat dissipation material disposed on a side of the support opposite to the acoustic element, wherein
an attenuation/thermal conduction material made of an attenuating material containing a thermally conductive material is disposed in contact with the heat dissipation material.
2. The ultrasonic probe according to claim 1 , wherein
the attenuation/thermal conduction material is disposed at an end of the heat dissipation material on the acoustic element side.
3. The ultrasonic probe according to claim 1 , wherein
the attenuation/thermal conduction material is disposed at an end of the heat dissipation material on a side opposite to the acoustic element side.
4. The ultrasonic probe according to claim 3 , wherein
the attenuation/thermal conduction material is made of a material different from the heat dissipation material.
5. An ultrasonic probe comprising:
an acoustic element that generates an ultrasonic wave and detects the ultrasonic wave, the acoustic element including a lens and a flexible printed circuit, the lens disposed at a first side of the flexible printed circuit;
a support that supports the acoustic element on a side opposite to a test object side, the support disposed at a second side of the flexible printed circuit opposite the first side; and
a heat dissipation material disposed on a side of the support opposite to the acoustic element, wherein
an attenuator having a multifaceted scattering structure is formed at an end of the heat dissipation material on a side opposite to the acoustic element side.
6. The ultrasonic probe according to claim 5 , wherein the multifaceted scattering structure is a sawtooth-shaped structure.