Carrier ring, grinding device, and grinding method
A double-head grinding machine includes a disc-shaped carrier ring having a support hole for supporting a silicon wafer, a rotation mechanism rotating the carrier ring around a center of the carrier ring, and a grinding wheel including a grinding stone for grinding the silicon wafer. The support hole is circular and has a center eccentric to the center of the carrier ring.
1. A grinding machine configured to grind a workpiece with a circular contour and having two opposing surfaces, the grinding machine comprising:
a disc-shaped carrier ring provided with a support hole for supporting the workpiece such that the two opposing surfaces are exposed for grinding;
a rotation mechanism configured to rotate the carrier ring around a center of the carrier ring;
two grinding wheels such that one grinding wheel is disposed facing one surface of the workpiece and the other grinding wheel is disposed facing the other surface of the workpiece;
each of the two grinding wheels comprising a disc-shaped wheel base and
a plurality of grinding stones for grinding the workpiece,
wherein the support hole provided in a circular shape has a center eccentric to the center of the carrier ring,
an eccentricity of the center of the support hole to the center of the carrier ring is greater than 0.0% and at most 1.7% of a diameter of the workpiece,
a diameter of each of the wheel bases is smaller than a diameter of the support hole, and
the plurality of grinding stones are arranged on a surface of each of the wheel bases along an outer edge at regular intervals.
2. A grinding method for grinding a workpiece with a circular contour, the method comprising:
supporting the workpiece in a circular-shaped support hole provided to a disc-shaped carrier ring such that a center of the workpiece is eccentric to a center of the carrier ring;
rotating the carrier ring around the center of the carrier ring; and
grinding the workpiece by pressing two grinding wheels against both surfaces of the workpiece while rotating the grinding wheels, the grinding wheels facing the respective surfaces of the workpiece held by the carrier ring,
wherein an eccentricity of the center of the support hole to the center of the carrier ring is greater than 0.0% and at most 1.7% of a diameter of the workpiece,
the grinding wheels each comprise a disc-shaped wheel base and a plurality of grinding stones arranged on a surface of each of the wheel bases along an outer edge at regular intervals, and
a diameter of each wheel base is smaller than a diameter of the support hole.