Resin powder for solid freeform fabrication, device for fabricating solid freeform fabrication object, and resin powder
A resin powder for solid freeform fabrication, having a melting point of 100 degrees C. or higher as measured according to ISO 3146 regulation and a ratio of melt mass-flow rate B to melt mass-flow rate A of greater than 0.80 to 1.20, wherein the melt mass-flow rate A and the melt mass-flow rate B are respectively measured at 15 degrees C. higher than the melting point under a load of 2.16 kg according to JIS K7210 format before and after the resin powder is maintained at a temperature 15 degrees C. lower than the melting point under a pressure of 0.1 kPa for four hours.
1. A resin powder suitable for solid freeform fabrication, the powder comprising:
a polyarylketone comprising polyether ether ketone, polyether ketone, and/or polyether ketone ketone,
wherein the powder has a melting point of 100° C. or higher as measured according to ISO 3146 regulation and a ratio of melt mass-flow rate B to melt mass-flow rate A of greater than 0.80 to 1.20,
wherein the melt mass-flow rate A and the melt mass-flow rate B are respectively measured at 15° C. higher than the melting point under a load of 2.16 kg according to JIS K7210 format before and after the resin powder is maintained at a temperature 15° C. lower than the melting point under a pressure of 0.1 kPa for four hours.
2. The powder of claim 1 , further comprising:
an anti-degradation agent.
3. The powder of claim 1 , further comprising:
a first anti-degradation agent; and
a second anti-degradation agent.
4. The powder of claim 3 , wherein each of the first and second anti-degradation agent has a proportion of from 0.05 to 5 percent by mass of a total mass of the powder.
5. The powder of claim 2 , wherein the anti-degradation agent comprises a metal chelate material, an ultraviolet absorber, a polymerization inhibitor, and/or an antioxidant.
6. The powder of claim 2 , further comprising:
a hindered phenol-based compound;
a phosphorus-containing compound;
a sulfur-containing compound; and/or
copper acetate.
7. The powder of claim 1 , having an Mv/Mn ratio of 2.00 or less,
wherein Mv is a volume average particle diameter and Mn is a number average particle diameter.
8. The powder of claim 1 , having a specific gravity of 0.8 g/mL or greater.
9. A rein powder, comprising:
a polyolefin, polyarylketone, polyphenylene sulfide, liquid crystal polymer, polyacetal, polyimide, and/or fluorochemical resin;
a hindered phenol-based compound, a phosphorus-containing compound, a sulfur-containing compound, and/or copper acetate,
wherein the powder has an Mv/Mn ratio of 2.00 or less, My being a volume average particle diameter and Mn being a number average particle diameter,
wherein the powder has a melting point of 100° C. or higher as measured according to ISO 3146 regulation and a ratio of melt mass-flow rate B to melt mass-flow rate A of greater than 0.80 to 1.20, and
wherein the melt mass-flow rate A and the melt mass-flow rate B are respectively measured at 15° C. higher than the melting point under a load of 2.16 kg according to JIS K7210 format before and after the resin powder is maintained at a temperature 15° C. lower than the melting point under a pressure of 0.1 kPa for four hours.
10. The powder of claim 1 , further comprising:
a polyolefin, polyamide, polyester, polyphenylene sulfide, liquid crystal polymers, polyacetal, polyimide, and/or fluorochemical resin.
11. The powder of claim 10 , wherein the polyamide is present and comprises polyamide 410, polyamide 4T, polyamide 6, polyamide 66, polyamide MXD6, polyamide 610, polyamide 6T, polyamide 11, polyamide 12, polyamide 9T, polyamide 10T, and/or aramid.
12. The powder of claim 10 , wherein the polyester is present and comprises polyethylene terephthalate, polybutylene terephthalate, and/or polylactate.
13. A device configured for fabricating a solid freeform fabrication object, the device comprising:
an accommodating device configured to accommodate the resin powder of claim 1 ;
a supplying device configured to supply the resin powder; and
a layer-forming device configured to melt the resin powder supplied by the supplying device in a selected area to form a layer,
wherein the supplying device repeats supplying the resin powder and the layer forming device repeats forming the layer to laminate the layer to form a solid freeform fabrication object.
14. The powder of claim 9 , having a 50 percent cumulative volume particle diameter in a range of from 5 to 200 μm.
15. The powder of claim 9 , wherein the polyarylketone is present and comprises polyether ether ketone, polyether ketone, and/or polyether ketone ketone.
16. The powder of claim 1 , further comprising copper acetate.
17. The powder of claim 9 , comprising the copper acetate.
18. The powder of claim 1 , further comprising a polymerization inhibitor.
19. The powder of claim 9 , comprising the polyolefin.
20. The powder of claim 9 , comprising the polyphenylene sulfide, liquid crystal polymer, polyacetal, polyimide, and/or fluorochemical resin.