Multi-device transducer modulus, electronic apparatus including the transducer modulus and method for manufacturing the transducer modulus

1. A transducer modulus, comprising:

a cap having a first through opening;

a supporting substrate having a second through opening, the cap coupled to the supporting substrate to define a single chamber; and

one or more semiconductor chips in the single chamber and coupled to the supporting substrate so that the one or more semiconductor chips covers the second through opening, the one or more semiconductor chips comprising:

a first MEMS transducer at a first surface and having a first sensitive element facing the first through opening in the cap, the first MEMS transducer configured to detect a first environmental quantity and generate a first transduced signal as a function of the first environmental quantity detected; and

a second MEMS transducer at a second surface and having a second sensitive element facing the second through opening in the supporting substrate, the second surface being opposite the first surface, the second MEMS transducer configured to detect a second environmental quantity and generate a second transduced signal as a function of the second environmental quantity detected, the second sensitive element being fluidicly isolated from the first sensitive element.

2. The transducer modulus according to claim 1 , further comprising an isolating region arranged between the second MEMS transducer and the supporting substrate, the isolating region being configured to fluidically isolate the second sensitive element from the single chamber.

3. The transducer modulus according to claim 1 , further comprising a fixing structure configured to secure the second MEMS transducer to the supporting substrate, the fixing structure including at least one of:

a solder mask surrounding the second sensitive element;

a layer of glue surrounding the second sensitive element;

an adhesive layer surrounding the second sensitive element; or

solder bumps arranged alongside the second sensitive element.

4. The transducer modulus according to claim 1 , further comprising a processing chip arranged in the single chamber or integrated in the supporting substrate, the processing chip being functionally coupled to the first and second MEMS transducers and configured to receive, in use, the first and second transduced signals, respectively.

5. The transducer modulus according to claim 4 , wherein the processing chip is an ASIC.

6. The transducer modulus according to claim 4 , wherein the processing chip is functionally coupled to the first and second MEMS transducers by wire bonds.

7. The transducer modulus according to claim 1 , wherein the first MEMS transducer and the second MEMS transducer are one of a pressure transducer, a light-radiation sensor, a UV sensor, and an IR sensor, configured, respectively, to detect an environmental quantity from among an environmental pressure, visible light radiation, UV radiation, and IR radiation.

8. The transducer modulus according to claim 1 , wherein the supporting substrate is made of semiconductor material or epoxy resin.

9. An electronic apparatus, comprising:

a microprocessor; and

a transducer modulus coupled to the microprocessor, the transducer modulus including:

a cap having a first through opening;

a supporting substrate having a second through opening, the cap coupled to the supporting substrate to define a chamber;

a first chip comprising a first MEMS transducer, the first MEMS transducer having a first sensitive element facing the first through opening in the cap, the first MEMS transducer configured to detect a first environmental quantity and generate a first transduced signal as a function of the first environmental quantity detected;

a second chip comprising a second MEMS transducer, the second chip vertically stacked with the first chip and located between the first MEMS transducer and the supporting substrate, the second MEMS transducer having a second sensitive element facing the second through opening in the supporting substrate, the second sensitive element being fluidicly isolated from the chamber, the second MEMS transducer configured to detect a second environmental quantity and generate a second transduced signal as a function of the second environmental quantity detected; and

an ASIC, wherein the second MEMS transducer is coupled to the ASIC by a conductive via through the first chip.

10. The electronic apparatus according to claim 9 , wherein the electronic apparatus is at least one of a cellphone, a personal digital assistant, a notebook, a voice recorder, an audio player with voice-recording function, a console for videogames, a hydrophone, a photographic camera and/or a video camera, an instrument for measuring environmental quantities, an industrial absolute-pressure meter, or an industrial relative-pressure meter.

11. A method comprising:

coupling one or more chips to a supporting substrate such that the one or more chips covers a first through opening in the supporting substrate, the one or more chips including a first MEMS transducer at a first surface and a second MEMS transducer at a second surface that is opposite to the first surface, the first MEMS transducer having a first sensitive element facing away from the supporting substrate, the first MEMS transducer being configured to detect a first environmental quantity and generate a first transduced signal as a function of the first environmental quantity detected, the second MEMS transducer having a second sensitive element facing toward the first through opening in the supporting substrate, the second MEMS transducer being configured to detect a second environmental quantity and generate a second transduced signal as a function of the environmental quantity detected; and

coupling a cap to the supporting substrate to enclose the one or more chips in a single chamber, the cap including a second through opening that is in fluid communication with the first sensitive element.

12. The method according to claim 11 , wherein coupling the one or more chips to the supporting substrate comprises forming an isolating region between the second MEMS transducer and the supporting substrate that is configured to fluidically isolate the second sensitive element from the single chamber.

13. The method according to claim 12 , wherein forming the isolating region includes at least one of:

forming a frame of glue that surrounds the second sensitive element; and

forming a frame of underfill that surrounds the second sensitive element.

14. The method according to claim 11 , wherein coupling the one or more chips to the supporting substrate includes at least one of:

forming a solder mask on a surface of the supporting substrate and surrounding the second sensitive element;

forming a layer of glue on at least one of a surface of the one or more chips and a surface of the supporting substrate, the layer of glue surrounding the second sensitive element;

providing an adhesive layer surrounding the second sensitive element; or

forming solder bumps alongside the second sensitive element.

15. The method according to claim 11 , further comprising:

coupling a processing chip to the supporting substrate; and

functionally coupling the processing chip to the first and second MEMS transducers to receive, in use, the first and second transduced signals, respectively.

16. The method according to claim 15 , wherein functionally coupling the processing chip to the first and second MEMS transducers comprises coupling first wire bonds between the processing chip and the first MEMS transducer and coupling second wire bonds between the processing chip and the second MEMS transducer.

17. The method according to claim 11 , wherein the one or more chips is a single chip comprising a monolithic body of semiconductor material that integrates the first sensitive element on a first side and the second sensitive element on a second side that is opposite to the first side.

18. The transducer modulus according to claim 1 , wherein the first through opening of the cap is arranged vertical with respect to the second through opening of the supporting substrate, and wherein at least a portion of the first through opening of the cap faces at least a portion of the second through opening of the supporting substrate.

19. The electronic apparatus according to claim 9 , wherein the first through opening of the cap is vertically aligned with the second through opening of the supporting substrate.

20. The electronic apparatus according to claim 9 , wherein the first through opening of the cap is arranged vertical with respect to the second through opening of the supporting substrate, and wherein at least a portion of the first through opening of the cap faces at least a portion of the second through opening of the supporting substrate.