Inductor

1. An inductor comprising:

first and second external electrodes spaced apart from each other;

a substrate disposed between the first and second external electrodes, and having a first surface and a second surface opposing each other; and

a conductive structure electrically connected to the first and second external electrodes,

wherein the conductive structure comprises a first conductive pattern disposed on the first surface of the substrate, a second conductive pattern disposed on the second surface of the substrate, and at least one reinforcing portion,

wherein the first conductive pattern has a first side facing the first external electrode,

wherein the second conductive pattern has a second side facing the second external electrode,

wherein the at least one reinforcing portion is connected to at least one of the first and second sides and is interposed between the substrate and at least one of the first and second external electrodes,

wherein the at least one reinforcing portion comprises a first reinforcing portion extending from at least a portion of the first side of the first conductive pattern in a first direction,

wherein the first direction is a direction from the first surface of the substrate toward the second surface of the substrate,

wherein the conductive structure further comprises a first expansion part spaced apart from the second conductive pattern,

wherein the first reinforcing portion is disposed between the first expansion part and the first side of the first conductive pattern, and

wherein the first side, the first reinforcing portion, and the first expansion part are in electrical contact with the first external electrode.

2. The inductor of claim 1 , wherein at least one of the first and second external electrodes is in direct contact with a portion of the substrate and the at least one reinforcing portion.

3. The inductor of claim 1 , wherein the conductive structure further comprises a conductive connection via penetrating through the substrate and electrically connecting the first and second conductive patterns.

4. The inductor of claim 1 , wherein a plurality of first reinforcing portions extending from one portion of the first side in the first direction and spaced apart from each other are formed, and

wherein a portion of the substrate is in direct contact with the first external electrode.

5. The inductor of claim 1 , wherein the entire substrate is spaced apart from the first external electrode, and

wherein the first reinforcing portion is interposed between the substrate and the first external electrode.

6. The inductor of claim 1 , wherein the at least one reinforcing portion further comprises a second reinforcing portion extending from at least a portion of the second side of the second conductive pattern in a second direction, and

wherein the second direction is a direction from the second surface of the substrate toward the first surface of the substrate.

7. The inductor of claim 6 , wherein the conductive structure further comprises a second expansion part spaced apart from the first conductive pattern,

wherein the second reinforcing portion is disposed between the second expansion part and the second side of the second conductive pattern, and

wherein the second side, the second reinforcing portion, and the second expansion part are in electrical contact with the second external electrode.

8. The inductor of claim 6 , wherein a plurality of second reinforcing portions extending from one portion of the second side in the second direction and spaced apart from each other are formed, and

wherein a portion of the substrate is in direct contact with the second external electrode.

9. The inductor of claim 6 , wherein the entire substrate is spaced apart from the second external electrode, and

wherein the second reinforcing portion is interposed between the substrate and the second external electrode.

10. The inductor of claim 1 , wherein the first or second external electrode comprises inner and outer conductive layers, and the at least one reinforcing portion is in direct contact with the inner conductive layer.

11. The inductor of claim 10 , wherein the inner conductive layer overlaps an entirety of the substrate in a thickness direction, and the at least one reinforcing portion is in direct contact with the inner conductive layer where the inner conductive layer overlaps the substrate in the thickness direction.

12. An inductor comprising:

a body;

first and second external electrodes disposed on external surfaces of the body and spaced apart from each other;

a substrate disposed in the body and having a first surface and a second surface opposing each other; and

a conductive structure disposed in the body,

wherein the conductive structure comprises a first conductive pattern disposed on the first surface of the substrate, a second conductive pattern disposed on the second surface of the substrate, a connection via penetrating through the substrate and electrically connecting the first and second conductive patterns, a first reinforcing portion in contact with the first external electrode, and a second reinforcing portion in contact with the second external electrode,

wherein the first conductive pattern has a first side facing the first external electrode and in contact with the first external electrode,

wherein the second conductive pattern has a second side facing the second external electrode and in contact with the second external electrode,

wherein the first reinforcing portion is electrically connected to the first side and is interposed between the substrate and the first external electrode,

wherein the second reinforcing portion is electrically connected to the second side and is interposed between the substrate and the second external electrode,

wherein the first reinforcing portion extends from the first side of the first conductive pattern in a first direction,

wherein the first direction is a direction from the first surface of the substrate toward the second surface of the substrate,

wherein the conductive structure further comprises a first expansion part spaced apart from the second conductive pattern,

wherein the first reinforcing portion is disposed between the first expansion part and the first side of the first conductive pattern, and

wherein the first side, the first reinforcing portion, and the first expansion part are in electrical contact with the first external electrode.

13. The inductor of claim 12 , wherein a plurality of first reinforcing portions or a plurality of second reinforcing portions are formed, or a plurality of first reinforcing portions and a plurality of second reinforcing portions are formed.

14. The inductor of claim 13 , wherein each of the plurality of first reinforcing portions or each of the plurality of second reinforcing portions comprises a reinforcing portion having a width gradually decreasing in a direction from an adjacent external electrode among the first and second external electrodes to the substrate, and a reinforcing portion having a width gradually increasing in a direction from the substrate to an adjacent external electrode among the first and second external electrodes.

15. The inductor of claim 13 , wherein at least one reinforcing portion of the first and second reinforcing portions has a hemispherical shape, a triangular shape or a shape of an elongated hemisphere having a constant width when viewed in a top view toward the first surface of the substrate.

16. The inductor of claim 12 , wherein each of the first and second external electrodes comprises an inner conductive layer, and an outer conductive layer covering the inner conductive layer, and

wherein the outer conductive layer comprises a first conductive layer covering the inner conductive layer, and a second conductive layer covering the first conductive layer.

17. The inductor of claim 16 , wherein the inner conductive layers overlap an entirety of the substrate in a thickness direction, and the first and second reinforcing portions are in direct contact with the inner conductive layers where the inner conductive layers overlap the substrate in the thickness direction.