IP Library › Granted Patent US 11,056,274
Granted Patent B2
US 11,056,274 · App. 16/050,808 · Granted Jul 6, 2021

Thin film type inductor

Inventors: Jung Hyuk Jung (Suwon-Si, KR); Ki Young Yoo (Suwon-Si, KR); Hye Yeon Cha (Suwon-Si, KR); Ji Hye Oh (Suwon-Si, KR)
Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
H01F27/29H01F5/003H01F5/04H01F17/0006H01F17/0013H01F27/022H01F27/292H01F2017/048
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Quick Facts
Patent No.
US 11,056,274
App. No.
16/050,808
Granted
Jul 6, 2021
Kind
B2
Abstract

A thin film type inductor includes a body and external electrodes disposed on an external surface of the body. The body includes a support member and an internal coil supported by the support member, the internal coil includes an upper coil disposed on one surface of the support member and a lower coil disposed on the other surface thereof, and the upper and lower coils are connected to each other by a via electrode. Heights of a plurality of coil patterns arranged along a first virtual line are substantially equal to each other, and heights of a plurality of coil patterns arranged along a second virtual line increase toward the external surface of the body, where the first virtual line radiates from a center of a core of the body toward the via electrode and the second virtual line radiates in the opposite direction.

Claims (26)

1. A thin film type inductor comprising:

a body including a support member including a through hole and a via hole spaced apart from the through hole and filled with a conductive material, an internal coil supported by the support member, and a magnetic material encapsulating the support member and the internal coil and filling the through hole; and

first and second external electrodes disposed on an external surface of the body and connected to both end portions of the internal coil, respectively,

wherein the internal coil includes a first coil disposed on an upper surface of the support member and a second coil disposed on a lower surface of the support member, the first and second coils being connected to each other by a via electrode formed by filling the via hole with the conductive material,

each of the first and second coils includes a plurality of coil patterns,

heights of a plurality of coil patterns arranged along a first virtual line are substantially equal to each other, and heights of a plurality of coil patterns arranged along a second virtual line increase toward the external surface of the body, where the first virtual line radiates from a center of a core of the body toward the via electrode and the second virtual line radiates in the opposite direction,

a connection coil pattern, among the plurality of coil patterns arranged along the first virtual line, is directly connected to the via electrode, and

wherein heights of at least three of the plurality of coil patterns arranged along the second virtual line increase toward the external surface of the body.

2. The thin film type inductor of claim 1 , wherein the connection coil pattern has a width wider than that of another coil pattern adjacent thereto.

3. The thin film type inductor of claim 1 , wherein among the plurality of coil patterns arranged along the first virtual line, an outermost coil pattern has the same height as that of an outermost coil pattern among the plurality of coil patterns arranged along the second virtual line.

4. The thin film type inductor of claim 1 , wherein a boundary line between the via electrode and the connection coil pattern is disposed on the same plane as at least one surface of the support member.

5. The thin film type inductor of claim 4 , wherein the connection coil pattern includes a plurality of coil layers, and among the plurality of coil layers, a coil layer disposed in a lowermost portion comes into contact with the via electrode.

6. The thin film type inductor of claim 5 , wherein at least one of the plurality of coil layers has a greater extent in a thickness direction than in a width or length direction.

7. The thin film type inductor of claim 1 , wherein the via electrode has a shape enclosing both side surfaces of the via hole.

8. The thin film type inductor of claim 7 , wherein the connection coil pattern includes a connection coil pattern of the first coil and a connection coil pattern of the second coil, and the connection coil patterns of the first and second coils are physically connected to each other.

9. The thin film type inductor of claim 1 , wherein a rate of increase in height of the plurality of coil patterns disposed along the second virtual line toward the external surface of the body is constant between adjacent coil patterns.

10. The thin film type inductor of claim 1 , wherein the internal coil has a spiral shape.

11. The thin film type inductor of claim 1 , wherein each of the plurality of coil patterns includes a plurality of coil layers.

12. The thin film type inductor of claim 11 , wherein at least one of the plurality of coil layers has a greater extent in a thickness direction than in a width or length direction.

13. The thin film type inductor of claim 1 , wherein a maximum width of an outermost coil pattern among the plurality of coil patterns arranged along the second virtual line is wider than that of a coil pattern most adjacent thereto.

14. The thin film type inductor of claim 1 , wherein a rate of increase in height of the plurality of coil patterns disposed along the second virtual line decreases toward an outermost coil pattern.

15. The thin film type inductor of claim 1 , further comprising an insulating layer on a surface of the internal coil.

16. The thin film type inductor of claim 15 , wherein a shortest distance from an uppermost surface of an insulating layer on an innermost coil pattern among the plurality of coil patterns arranged along the second virtual line to an upper surface of the body is greater than a shortest distance from an uppermost surface of an insulating layer on the connection coil pattern among the plurality of coil patterns arranged along the first virtual line to the upper surface of the body.

17. The thin film type inductor of claim 1 , wherein the plurality of coil patterns have an asymmetrical shape with respect to the center of the core of the body.

18. The thin film type inductor of claim 1 , wherein another coil pattern of the plurality of coil patterns arranged along the first virtual line is directly connected to the via electrode.

19. The thin film type inductor of claim 1 , wherein the through hole is devoid of the internal coil.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 1, 2018
From: JUNG, JUNG HYUK; YOO, KI YOUNG; CHA, HYE YEON; OH, JI HYE
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 046524/0580 →
Priority Claims (1)
KR 10-2017-0127951 · Sep 29, 2017 · national
Continuity (1)
Related Publication 20190103215A1 · Apr 4, 2019