IP Library › Granted Patent US 11,056,319
Granted Patent B2
US 11,056,319 · App. 16/524,646 · Granted Jul 6, 2021

Apparatus and system having extraction assembly for wide angle ion beam

Inventors: Costel Biloiu (Rockport, MA); Appu Naveen Thomas (Danvers, MA); Tyler Rockwell (Wakefield, MA); Frank Sinclair (Boston, MA); Christopher Campbell (Newburyport, MA)
Assignee: APPLIED Materials, Inc.
H01J37/32541H01J37/08H01J37/3255H01J37/32422
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Quick Facts
Patent No.
US 11,056,319
App. No.
16/524,646
Granted
Jul 6, 2021
Kind
B2
Abstract

An ion beam processing apparatus may include a plasma chamber, and a plasma plate, disposed alongside the plasma chamber, where the plasma plate defines a first extraction aperture. The apparatus may include a beam blocker, disposed within the plasma chamber and facing the extraction aperture. The apparatus may further include a non-planar electrode, disposed adjacent the beam blocker and outside of the plasma chamber; and an extraction plate, disposed outside the plasma plate, and defining a second extraction aperture, aligned with the first extraction aperture.

Claims (30)

1. An ion beam processing apparatus comprising:

a plasma chamber;

a plasma plate, disposed alongside the plasma chamber, the plasma plate defining a first extraction aperture;

a beam blocker, disposed within the plasma chamber and facing the extraction aperture;

a non-planar electrode, disposed adjacent the beam blocker and outside of the plasma chamber;

an extraction plate, disposed outside the plasma plate, and defining a second extraction aperture, aligned with the first extraction aperture; and

an extraction voltage supply, being electrically coupled to bias the extraction plate, the non-planar electrode, and the substrate at a same voltage with respect to the plasma chamber.

2. The ion beam processing apparatus of claim 1 , wherein the plasma plate comprises an electrical insulator body, and the beam blocker comprises an electrical insulator body.

3. The ion beam processing apparatus of claim 1 , wherein the non-planar electrode comprises a first dielectric coating, surrounding an electrically conductive inner electrode, and wherein the extraction plate comprises a second dielectric coating, disposed on an electrically conductive inner plate portion.

4. The ion beam processing apparatus of claim 1 , wherein the non-planar electrode comprises a triangular shape in cross-section along a first direction, the first direction being perpendicular to a plane of the plasma plate.

5. The ion beam processing apparatus of claim 1 , wherein the extraction plate is movable with respect to the plasma plate, along a first direction, the first direction being perpendicular to a plane of the plasma plate.

6. The ion beam processing apparatus of claim 1 , wherein the first extraction aperture and the second extraction aperture comprise an elongated shape.

7. The ion beam processing apparatus of claim 1 , wherein the extraction plate comprises a first part and a second part, mutually movable with respect to one another along a scan direction, so as to change a size of the second extraction aperture.

8. The ion beam processing apparatus of claim 1 , wherein the beam blocker, non-planar electrode, plasma plate, and extraction plate are mutually disposed to extract an ion beam as a pair of ion beamlets, characterized by an extraction angle having a value of 30 degrees or greater with respect to a normal to a plane of the plasma plate.

9. An ion beam processing system comprising:

a plasma chamber;

an extraction assembly, disposed along a side of the plasma chamber, comprising:

a plasma plate, disposed alongside the plasma chamber, the plasma plate defining a first extraction aperture;

a beam blocker, disposed within the plasma chamber and facing the extraction aperture;

a non-planar electrode, disposed adjacent the beam blocker and outside of the plasma chamber; and

an extraction plate, disposed outside the plasma plate, and defining a second extraction aperture, aligned with the first extraction aperture; and

an extraction voltage system, electrically coupled to the plasma chamber and the extraction plate to generate a bias voltage between the extraction plate and the plasma chamber, the extraction voltage system being electrically coupled to bias the extraction plate, the non-planar electrode, and the substrate at a same voltage with respect to the plasma chamber.

10. The ion beam processing system of claim 9 , the extraction voltage system having a pulse component, to generate a pulsed bias voltage between the extraction plate and the plasma chamber.

11. The ion beam processing system of claim 9 , wherein the plasma plate comprises an electrical insulator body, and the beam blocker comprises an electrical insulator body.

12. The ion beam processing system of claim 9 , wherein the non-planar electrode comprises a first dielectric coating, surrounding an electrically conductive inner electrode, and wherein the extraction plate comprises a second dielectric coating, disposed on an electrically conductive inner plate portion.

13. The ion beam processing system of claim 9 , wherein the non-planar electrode comprises a triangular shape in cross-section along a first direction, the first direction being perpendicular to a plane of the plasma plate.

14. The ion beam processing system of claim 9 , wherein the extraction plate is movable with respect to the plasma plate, along a first direction, the first direction being perpendicular to a plane of the plasma plate.

15. The ion beam processing system of claim 9 , wherein the extraction plate comprises a first part and a second part, mutually movable with respect to one another along a scan direction, so as to change a size of the second extraction aperture.

16. The ion beam processing system of claim 9 , further comprising a process chamber to house a substrate, the extraction voltage system being electrically coupled to supply a first voltage to the plasma chamber, and being electrically coupled to supply a second voltage to the extraction plate, the non-planar electrode, and the substrate, the second voltage being more negative than the first voltage.

17. The ion beam processing system of claim 16 , wherein the first extraction aperture and the second extraction aperture are elongated along a first direction, the ion beam processing system further comprising a substrate stage, disposed to scan the substrate along a scan direction, perpendicular to the first direction.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 28, 2020
From: BILOIU, COSTEL; THOMAS, APPU NAVEEN; ROCKWELL, TYLER; SINCLAIR, FRANK; CAMPBELL, CHRISTOPHER
To: APPLIED MATERIALS, INC.
Reel/Frame 051720/0388 →
Continuity (1)
Related Publication 20210035779A1 · Feb 4, 2021
Cited By (1)
US 12,191,117