Methods of manufacturing semiconductor device and semiconductor device
In a method of manufacturing a semiconductor device, a first interlayer dielectric (ILD) layer is formed over a substrate, a CMP stop layer is formed over the first ILD layer, a trench opening is formed by patterning the CMP stop layer and the first ILD layer, an underlying first process mark is formed by forming a first conductive layer in the trench opening, a lower dielectric layer is formed over the underlying first process mark, a middle dielectric layer is formed over the lower dielectric layer, an upper dielectric layer is formed over the middle dielectric layer, a planarization operation is performed on the upper, middle and lower dielectric layers so that a part of the middle dielectric layer remains over the underlying first process mark, and a second process mark by the lower dielectric layer is formed by removing the remaining part of the middle dielectric layer.
1. A method of manufacturing a semiconductor device, comprising:
forming a first interlayer dielectric (ILD) layer over a substrate;
forming a chemical mechanical polishing (CMP) stop layer over the first ILD layer;
forming a trench opening by patterning the CMP stop layer and the first ILD layer;
forming an underlying first process mark by forming a first conductive layer in the trench opening;
forming a lower dielectric layer over the underlying first process mark;
forming a middle dielectric layer over the lower dielectric layer;
forming an upper dielectric layer over the middle dielectric layer;
performing a planarization operation on the upper, middle and lower dielectric layers so that a part of the middle dielectric layer remains over the underlying first process mark; and
forming a second process mark by the lower dielectric layer by removing the remaining part of the middle dielectric layer.
2. The method of claim 1 , wherein the second process mark includes at least one of an alignment mark and an overlay measurement mark.
3. The method of claim 2 , wherein the lower and upper dielectric layers include silicon oxide and the middle dielectric layer includes silicon nitride.
4. The method of claim 2 , wherein:
the second process mark is an alignment mark, and
the method further comprises:
forming a second conductive layer over the alignment mark;
forming a photo resist layer over the second conductive layer; and
detecting the alignment mark or an edge or a step formed by the second conductive layer above an edge of the alignment mark to perform a lithography operation.
5. The method of claim 4 , wherein the second conductive layer includes W.
6. The method of claim 1 , wherein the second process mark has a step height in a range from 20 nm to 100 nm.
7. The method of claim 1 , wherein the planarization operation includes a CMP operation followed by an etch-back operation.
8. The method of claim 7 , wherein the CMP operation is performed such that a part of the upper dielectric layer remains over the underlying first process mark and an upper surface of a part of the middle dielectric layer surrounding the underlying first process mark is exposed.
9. The method of claim 1 , wherein the CMP stop layer includes at least one of silicon-rich oxide and silicon carbide.
10. A method of manufacturing a semiconductor device, comprising:
forming a first interlayer dielectric (ILD) layer over a substrate;
forming a chemical mechanical polishing (CMP) stop layer over the first ILD layer;
forming a trench opening in a peripheral area and a via opening in a circuit area by patterning the CMP stop layer and the first ILD layer;
forming an underlying first process mark in the peripheral area and a via contact in the circuit area by forming a first conductive layer in the trench opening and the via opening, respectively;
forming a memory structure over the via contact;
forming a lower dielectric layer over the underlying first process mark and the memory structure;
forming a middle dielectric layer over the lower dielectric layer;
forming an upper dielectric layer over the middle dielectric layer;
performing a planarization operation on the upper, middle and lower dielectric layers so that a part of the middle dielectric layer remains over the underlying first process mark; and
forming a second process mark by the lower dielectric layer by removing the remaining part of the middle dielectric layer.
11. The method of claim 10 , wherein the planarization operation includes a CMP operation followed by an etch-back operation.
12. The method of claim 11 , wherein:
the memory structure includes a memory stack and a hard mask layer disposed on the memory stack layer, and
the CMP operation stops when the hard mask layer is exposed.
13. The method of claim 12 , wherein the lower dielectric layer and the middle dielectric layer have thicknesses such that an upper surface of the middle dielectric layer in the peripheral area other than the underlying first process mark is substantially equal to an upper surface of the hard mask layer.
14. The method of claim 11 , wherein:
the memory stack includes a lower conductive layer, a memory layer over the lower conductive layer and an upper conductive layer over the memory layer, and
the etch-back operation is performed so that the upper conductive layer is exposed and the part of the middle dielectric layer remains over the underlying first process mark.
15. The method of claim 14 , wherein:
the second process mark includes an alignment mark,
the method further comprises:
forming a second conductive layer over the alignment mark and the exposed upper conductive layer;
forming a photo resist layer over the second conductive layer; and
detecting the alignment mark or an edge or a step formed by the second conductive layer above an edge of the alignment mark to perform a lithography operation.
16. The method of claim 15 , wherein a height of the step is in a range from 20 nm to 100 nm.
17. The method of claim 14 , wherein the memory layer includes at least one of a phase change material layer and a resistive change material layer.
18. The method of claim 14 , wherein the lower dielectric layer has a thickness such that a bottom surface of the middle dielectric layer above the underlying first process mark is below an upper surface of the upper conductive layer.
19. The method of claim 10 , wherein the lower and upper dielectric layers include silicon oxide and the middle dielectric layer includes silicon nitride.
20. A method of manufacturing a semiconductor device, comprising:
forming a first dielectric layer over a substrate;
forming a trench opening by patterning the first dielectric layer;
forming an underlying first process mark by forming a first conductive layer in the trench opening;
forming a lower dielectric layer over the underlying first process mark;
forming a middle dielectric layer over the lower dielectric layer;
forming an upper dielectric layer over the middle dielectric layer;
performing a planarization operation on the upper, middle and lower dielectric layers so that a part of the middle dielectric layer remains over the underlying first process mark; and
forming a second process mark by the lower dielectric layer by removing the remaining part of the middle dielectric layer.