IP Library › Granted Patent US 11,056,460
Granted Patent B2
US 11,056,460 · App. 16/481,758 · Granted Jul 6, 2021

Method for producing an electric circuit comprising a circuit carrier, contact areas, and an insulating body

Inventors: Stefan Pfefferlein (Heroldsberg, DE); Thomas Bigl (Herzogenaurach, DE)
Assignee: Siemens Aktiengesellschaft
H01L24/82H01L23/498H01L24/69H05K1/181H05K3/284H05K3/3431H05K3/3478H01L2224/82101H01L2224/82105H01L2224/82801H01L2224/82986H01L2924/014H05K2203/046H05K2203/0415H05K2203/1178H05K2203/128
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Quick Facts
Patent No.
US 11,056,460
App. No.
16/481,758
Granted
Jul 6, 2021
Kind
B2
Abstract

A method for producing an electric circuit in which a contact carrier comprising a first contact area and a second contact area is provided. An insulating body is applied to the circuit carrier and at least partially covers the first contact area and the second contact area. The insulating body comprises cut-outs in regions both contact areas. A flowable electrical conducting medium is introduced into the insulating body.

Claims (21)

1. A method for producing an electric circuit, said method comprising:

forming an insulating body by molding, in which a lost core is used, or by 3D printing;

applying the insulating body to a circuit carrier such as to cover a first contact area and a second contact area at least partially, with the insulating body having a cut-out in a region of the first contact area and a cut-out in a region of the second contact area; and

pouring a flowable electrical conducting medium into the insulating body.

2. The method of claim 1 , wherein the electrically conducting medium is an alloy which includes at least partially gallium, indium and/or tin.

3. The method of claim 1 , wherein the electrically conducting medium is a medium with an electrical conductivity that is less than an electrical conductivity of copper.

4. The method of claim 1 , wherein the electrically conducting medium is a medium with an electrical conductivity that is less than half an electrical conductivity of copper.

5. The method of claim 1 , further comprising hardening the electrical conducting medium.

6. The method of claim 1 , wherein the insulating body is formed with a pouring-in opening and/or a ventilation opening.

7. The method of claim 6 , further comprising closing the pouring-in opening and/or the ventilation opening after pouring in the electrical conducting medium.

8. The method of claim 1 , wherein the insulating body is formed with a trough-like configuration.

9. The method of claim 8 , further comprising placing a cover upon the insulating body after pouring in the electrical conducting medium.

10. The method of claim 1 , wherein the insulating body is formed with a closed configuration, except for the cut-outs in the regions of the first and second contact areas, wherein the electrical conducting medium is injected into the insulating body.

11. An electric circuit, comprising a circuit carrier, said circuit carrier comprising first and second contact areas, an electrical conducting medium establishing an electrical contact between the first and second contact areas, and an insulating body at least partially surrounding the electrical conducting medium, said electric circuit being produced by a method as set forth in claim 1 .

12. The electric circuit of claim 11 , wherein the electrically conducting medium is an alloy which includes at least partially gallium, indium and/or tin.

13. The electric circuit of claim 11 , wherein the electrically conducting medium is a medium with an electrical conductivity that is less than an electrical conductivity of copper.

14. The electric circuit of claim 11 , wherein the electrically conducting medium is a medium with an electrical conductivity that is less than half an electrical conductivity of copper.

15. The electric circuit of claim 11 , wherein the insulating body is formed with a pouring-in opening and/or a ventilation opening.

16. The electric circuit of claim 11 , wherein the insulating body has a trough-like configuration.

17. The electric circuit of claim 11 , further comprising a cover placed upon the insulating body.

18. The electric circuit of claim 11 , wherein the insulating body has a closed configuration, except for the cut-outs in the regions of the first and second contact areas.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 9, 2019
From: BIGL, THOMAS; PFEFFERLEIN, STEFAN
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 050668/0114 →
Priority Claims (1)
EP 17153734 · Jan 30, 2017 · regional
Continuity (1)
Related Publication 20190393187A1 · Dec 26, 2019
Cited By (1)
US 12,325,534