IP Library › Granted Patent US 11,056,473
Granted Patent B2
US 11,056,473 · App. 16/670,457 · Granted Jul 6, 2021

Micro light source array, display device having the same, and method of manufacturing display device

Inventors: Junhee Choi (Seongnam-si, KR); Euijoon Yoon (Seoul, KR)
Assignees: SAMSUNG ELECTRONICS CO., LTD.; SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
H01L25/167H01L27/1214H01L33/486H01L33/50H01L2933/0033
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Quick Facts
Patent No.
US 11,056,473
App. No.
16/670,457
Granted
Jul 6, 2021
Kind
B2
Abstract

Provided are a micro light source array for a display device, a display device including the micro light source array, and a method of manufacturing the display device. The micro light source array includes: a plurality of silicon sub-mounts provided on a substrate, each silicon sub-mount from among the plurality of silicon sub-mounts corresponding to a respective sub-pixel from among a plurality of sub-pixels of a display device, the plurality of silicon sub-mounts being separated from each other by a plurality of trenches; a plurality of light emitting device chips coupled to the plurality of silicon sub-mounts; and a plurality of driving circuits provided at the plurality of silicon sub-mounts.

Claims (11)

1. A display device comprising:

a substrate;

a plurality of silicon sub-mounts provided on the substrate, each silicon sub-mount from among the plurality of silicon sub-mounts corresponding to a respective sub-pixel from among a plurality of sub-pixels of the display device, the plurality of silicon sub-mounts being separated from each other by a plurality of trenches;

a plurality of light emitting device chips coupled to the plurality of silicon sub-mounts;

a plurality of driving circuits provided at the plurality of silicon sub-mounts; and

a plurality of color conversion devices provided on the plurality of light emitting device chips, the plurality of color conversion devices being configured to convert a color of light emitted from the plurality of light emitting device chips.

2. The display device of claim 1 , wherein each driving circuit from among the plurality of driving circuits comprises a complementary metal-oxide semiconductor (CMOS) or an n-channel metal-oxide semiconductor (NMOS).

3. The display device of claim 1 , wherein the plurality of light emitting device chips are flip-chip bonded to the plurality of silicon sub-mounts.

4. The display device of claim 1 , wherein a pitch between adjacent silicon sub-mounts from among the plurality of silicon sub-mounts in each of a first direction and a second direction perpendicular to the first direction is equal to a pitch between adjacent sub-pixels from among the plurality of sub-pixels.

5. The display device of claim 1 , wherein each light emitting device chip from among the plurality of light emitting device chips micro LED.

6. The display device of claim 1 , wherein the plurality of light emitting device chips are configured to emit blue light.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 10, 2020
From: CHOI, JUNHEE; YOON, EUIJOON
To: SAMSUNG ELECTRONICS CO., LTD.; SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
Reel/Frame 051474/0817 →
Priority Claims (1)
KR 10-2018-0148546 · Nov 27, 2018 · national
Continuity (1)
Related Publication 20200168594A1 · May 28, 2020