Microelectronic devices designed with foldable flexible substrates for high frequency communication modules
Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) circuits and a second substrate coupled to the first substrate. The second substrate includes a first section and a second section with the second substrate being foldable in order to obtain a desired orientation of an antenna unit of the second section for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.
1. A microelectronic device comprising:
a first substrate having radio frequency (RF) circuits; and
a second substrate including a first section and a second section, the first section coupled to the first substrate, and the second section being foldable at a location in order to obtain a desired orientation of an antenna unit of the second section for transmitting and receiving communications at a frequency of approximately 4 GHz or higher, wherein the second substrate includes an organic material and multiple conductive layers, and wherein the second substrate has fewer conductive layers at the location where the second section is foldable than at a location beneath the first substrate.
2. The microelectronic device of claim 1 , wherein the antenna unit has a perpendicular orientation with respect to a length of the first section based on folding of the second section of the second substrate.
3. The microelectronic device of claim 1 , wherein the antenna unit includes at least one microstrip patch antenna.
4. The microelectronic device of claim 1 , wherein the antenna unit includes at least one slot antenna, at least one dipole antenna, or at least one monopole antenna.
5. The microelectronic device of claim 1 , wherein the first substrate is overmolded to provide mechanical stability and die protection.
6. The microelectronic device of claim 1 , wherein the microelectronic device comprises a 5G package architecture for 5G communications.
7. A microelectronic device comprising:
a first substrate having radio frequency (RF) circuits; and
a second substrate including a first section and a second section, the first section coupled to the first substrate, and the second section folded at a location to obtain a desired orientation of an antenna unit of the second section for transmitting and receiving communications at a frequency of approximately 4 GHz or higher, wherein the second substrate includes an organic material and multiple conductive layers, and wherein the second substrate has fewer conductive layers at the location where the second section is folded than at a location beneath the first substrate.
8. The microelectronic device of claim 7 , wherein the antenna unit has a perpendicular orientation with respect to a length of the first section of the second substrate.
9. The microelectronic device of claim 7 , wherein the antenna unit includes at least one microstrip patch antenna.
10. The microelectronic device of claim 7 , wherein the antenna unit includes at least one slot antenna, at least one dipole antenna, or at least one monopole antenna.
11. The microelectronic device of claim 7 , wherein the first substrate is overmolded to provide mechanical stability and die protection.
12. The microelectronic device of claim 7 , wherein the microelectronic device comprises a 5G package architecture for 5G communications.
13. A computing device comprising:
at least one processor to process data; and
a communication module or chip coupled to the at least one processor, the communication module or chip comprises, a first substrate having radio frequency (RF) circuits, a second substrate including a first section and a second section, the first section coupled to the first substrate, and the second section being folded at a location in order to obtain a desired orientation of an antenna unit of the second section for transmitting and receiving communications at a frequency of approximately 15 GHz or higher, wherein the second substrate includes an organic material and multiple conductive layers, and wherein the second substrate has fewer conductive layers at the location where the second section is folded than at a location beneath the first substrate.
14. The computing device of claim 13 , wherein the antenna unit has a perpendicular orientation with respect to a length of the first section of the second substrate.
15. The computing device of claim 13 , wherein the antenna unit includes at least one microstrip patch antenna.
16. The computing device of claim 13 , wherein the antenna unit includes at least one slot antenna, at least one dipole antenna, or at least one monopole antenna.
17. The computing device of claim 13 , further comprising:
a printed circuit board coupled to the communication module or chip.