Component-embedded substrate
A component-embedded substrate includes: a buildup layer including an insulating resin layer and a conductor layer; a cavity that is formed in the buildup layer; an electronic component that is mounted on a bottom face of the cavity through an adhesive layer; a pedestal that is disposed on the bottom face of the cavity so as to be opposed to four corners of the electronic component; and a filling resin layer that is filled into the cavity to cover the electronic component and the pedestal.
1. A component-embedded substrate comprising:
a buildup layer comprising an insulating resin layer and a conductor layer;
a cavity that is formed in the buildup layer;
an electronic component that is mounted on a bottom face of the cavity through an adhesive layer;
a pedestal that is disposed on the bottom face of the cavity so as to be opposed to four corners of the electronic component; and
a filling resin layer that is filled into the cavity to cover the electronic component and the pedestal,
wherein a thickness of the pedestal is larger than a thickness of the adhesive layer, and the thickness of the pedestal is smaller than a depth of the cavity, and
wherein an entirety of the pedestal is housed within the cavity when the component-embedded substrate is viewed in plan view, and the filling resin covers an entirety of an upper surface of the pedestal, the upper surface of the pedestal being opposite to a lower surface of the pedestal which faces the bottom face of the cavity.
2. The component-embedded substrate according to claim 1 , wherein:
the bottom face of the cavity is a surface of the conductor layer exposed from the cavity.
3. The component-embedded substrate according to claim 1 , wherein:
the electronic component has a first side face and a second face that is opposite to the first side face; and
the pedestal is disposed on the bottom face of the cavity so as to be opposed to the first side face and the second side face.
4. The component-embedded substrate according to claim 1 , wherein:
the pedestal is disposed on the bottom face of the cavity so as to completely surround the electronic component.
5. The component-embedded substrate according to claim 1 , wherein:
the pedestal comprises:
a first pedestal portion that is opposed to a first corner portion of the electronic component,
a second pedestal portion that is opposed to a second corner portion of the electronic component,
a third pedestal portion that is opposed to a third corner portion of the electronic component, and
a fourth pedestal portion that is opposed to a fourth corner portion of the electronic component; and
each of the first pedestal portion, the second pedestal portion, the third pedestal portion and the fourth pedestal portions is formed into a rectangular shape in plan view.
6. The component-embedded substrate according to claim 1 , wherein:
the electronic component comprises:
a first side face,
a second side face that is opposite to the first side face,
a third side face that is positioned between the first side face and the second side face, and
a fourth side face that is opposite to the third side face;
the pedestal comprises:
a first pedestal portion that is opposed to the first side face and the third side face,
a second pedestal portion that is opposed to the first side face and the fourth side face,
a third pedestal portion that is opposed to the second side face and the third side face, and
a fourth pedestal portion that is opposed to the second side face and the fourth side face; and
each of the first pedestal portion, the second pedestal portion, the third pedestal portion and the fourth pedestal portions is substantially formed into an L shape in plan view.
7. The component-embedded substrate according to claim 1 , wherein:
the pedestal is formed of an insulating resin material and formed as a member separate from the buildup layer.
8. The component-embedded substrate according to claim 1 , wherein:
a side wall of the cavity is defined by the insulating resin layer, and the bottom face of the cavity is a surface of the conductor layer exposed from the cavity; and
the side wall of the cavity and the bottom face of the cavity are continuously connected to each other.
9. A component-embedded substrate comprising:
a buildup layer comprising an insulating resin layer and a conductor layer;
a cavity that is formed in the buildup layer;
an electronic component that is mounted on a bottom face of the cavity through an adhesive layer;
a pedestal that is disposed on the bottom face of the cavity so as to be opposed to four corners of the electronic component; and
a filling resin layer that is filled into the cavity to cover the electronic component and the pedestal,
wherein:
the pedestal comprises:
a first pedestal portion that is opposed to a first corner portion of the electronic component,
a second pedestal portion that is opposed to a second corner portion of the electronic component,
a third pedestal portion that is opposed to a third corner portion of the electronic component, and
a fourth pedestal portion that is opposed to a fourth corner portion of the electronic component; and
each of the first pedestal portion, the second pedestal portion, the third pedestal portion and the fourth pedestal portions is formed into a triangular shape in plan view.