IP Library › Granted Patent US 11,061,146
Granted Patent B2
US 11,061,146 · App. 16/256,409 · Granted Jul 13, 2021

Nanosheet radiation dosimeter

Inventors: Jeng-Bang Yau (Yorktown Heights, NY); Alexander Reznicek (Troy, NY); Karthik Balakrishnan (Scarsdale, NY); Bahman Hekmatshoartabari (White Plains, NY)
Assignee: International Business Machines Corporation
G01T1/026H01L21/02532H01L21/02603H01L29/66545H01L29/7845
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,061,146
App. No.
16/256,409
Granted
Jul 13, 2021
Kind
B2
Abstract

A semiconductor radiation monitor is provided that includes a charge storage region composed of a dielectric material nanosheet, such as, for example an epitaxial oxide nanosheet, which is sandwiched between a top semiconductor nanosheet and a bottom semiconductor nanosheet. A functional gate structure is located above the top semiconductor nanosheet and beneath the bottom semiconductor nanosheet.

Claims (13)

1. A semiconductor radiation monitor comprising:

a nanosheet stack comprising a charge storage dielectric material nanosheet sandwiched between a first silicon channel material nanosheet and a second silicon channel material nanosheet, and suspended above a semiconductor substrate, wherein the charge storage dielectric material nanosheet has a first surface that directly contacts a surface of the first silicon channel material nanosheet, and a second surface, opposite the first surface, that directly contacts a surface of the second silicon channel material nanosheet;

a functional gate structure located beneath the first silicon channel material nanosheet and above the second silicon channel material nanosheet;

a topmost inner spacer located laterally adjacent to the function gate structure that is located above the second silicon channel material nanosheet and having a bottommost surface directly contacting a topmost surface of the second silicon channel material nanosheet; and

a lowermost inner spacer located laterally adjacent to the function gate structure that is located beneath the first silicon channel material nanosheet and having a topmost surface directly contacting a bottommost surface of the first silicon channel material nanosheet.

2. The semiconductor radiation monitor of claim 1 , wherein the charge storage dielectric material nanosheet is lattice matched to the first and second silicon channel material nanosheets and is composed of an epitaxial oxide.

3. The semiconductor radiation monitor of claim 2 , wherein the epitaxial oxide is composed of lanthanum (II) oxide, gadolinium(III)-oxide, dysprosium(III)-oxide, holmium(III) oxide, erbium (III) oxide, thulium (III) oxide, lutetium(III) oxide, cerium (IV) oxide, lanthanum-yttrium oxide, gadolinium-erbium oxide, neodymium-erbium oxide, neodymium-gadolinium oxide, or lanthanum-erbium oxide.

4. The semiconductor radiation monitor of claim 1 , wherein the charge storage dielectric material nanosheet has a same width as the first and second silicon channel material nanosheets.

5. The semiconductor radiation monitor of claim 1 , wherein charge storage dielectric material nanosheet is composed of a dielectric oxide and has width that is less than a width of the first and second silicon channel material nanosheets, and wherein an intermediate inner spacer is located at the end of the charge storage dielectric material nanosheet.

6. The semiconductor structure of claim 1 , further comprising a source/drain structure on each side of the nanosheet stack and in direct physically contact with a sidewall of the first silicon channel material nanosheet and in direct physical contact with a sidewall of the second silicon channel material nanosheet.

7. The semiconductor radiation monitor of claim 6 , wherein the source/drain structure has a faceted topmost surface.

8. The semiconductor radiation monitor of claim 6 , further comprising a contact structure contacting a surface of each source/drain structure.

9. The semiconductor radiation monitor of claim 8 , wherein each contact structure is located within an interlayer dielectric material layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 24, 2019
From: YAU, JENG-BANG; REZNICEK, ALEXANDER; BALAKRISHNAN, KARTHIK; HEKMATSHOARTABARI, BAHMAN
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 048124/0625 →
Continuity (1)
Related Publication 20200241149A1 · Jul 30, 2020