Module comprising antenna and RF element, and base station including same
A communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. According to the disclosure, an antenna module includes a first substrate layer on which at least one substrate is stacked; an antenna coupled to an upper end surface of the first substrate layer; a second substrate layer having an upper end surface coupled to a lower end surface of the first substrate layer and on which at least one substrate is stacked; and a radio frequency (RF) element coupled to a lower end surface of the second substrate layer.
1. A module for use in a wireless communication apparatus for communicating with a terminal, the module comprising:
a first printed circuit board (PCB) comprising multiple layers;
a plurality of second PCBs, each of the plurality of second PCBs comprising multiple layers;
a plurality of antenna sets disposed on a first side of the first PCB, the first side including a plurality of regions corresponding to the plurality of second PCBs, wherein each of the antenna sets is disposed on a corresponding region of the plurality of regions of the first PCB; and
a plurality of radio frequency integrated circuit (RFIC) chips,
wherein each of the second PCBs is configured to electrically connect a corresponding RFIC chip of the plurality of RFIC chips to the first PCB,
wherein each of the second PCBs has a smaller surface area than the first PCB the second PCBs are spaced apart from each other,
wherein each of the second PCBs is coupled to a second side of the first PCB opposite to the first side of the first PCB via a grid array, and
wherein the module is configured to operate in a multiple input multiple output (MIMO) antenna scheme.
2. The module of claim 1 , wherein the plurality of regions are arranged in a plurality of columns and a plurality of rows configured for operating in the MIMO antenna scheme.
3. The module of claim 1 , wherein the plurality of antenna sets, the first PCB, and the second PCBs are arranged substantially parallel with respect to each other.
4. The module of claim 1 ,
wherein each of the second PCBs is configured to be electrically connected to a corresponding antenna set of the plurality of antenna sets on the first PCB, and
wherein each of the plurality of regions of the first PCB includes conductive lines in the first PCB.
5. The module of claim 1 , wherein each of grid arrays is spaced apart from an adjacent grid array at a predetermined interval in a space between the first PCB and a corresponding second PCB of the second PCBs.
6. The module of claim 1 , wherein a set of antennas within the plurality of antenna sets forms a group and each of antennas included in the group is spaced apart from an adjacent antenna in the group at a predetermined interval.
7. The module of claim 6 , wherein a set of second PCBs within the plurality of second PCBs forms a group, and each of second PCBs included in the group is spaced apart from an adjacent second PCB at a predetermined interval.
8. The module of claim 1 , wherein at least one capacitor for removing a noise is coupled with a first side, which is opposite to a second side to which the first PCB is coupled, of each of the second PCBs.
9. The module of claim 1 , wherein each of the regions of the first PCB is electrically connected to a corresponding grid array disposed between within a space between the first PCB and a corresponding second PCB of the second PCBs.
10. The module of claim 1 ,
wherein each of the second PCBs is electrically connected to a same number of antennas, and
wherein a total number of antennas electrically connected to each of the second PCBs is smaller than from a total number of the plurality of antenna sets.
11. A wireless communication apparatus for communicating with a terminal, the wireless communication apparatus comprising:
a power supply;
a field programmable gate array (FPGA) having programmable logic circuits; and
a module;
wherein the module comprises:
a first printed circuit board (PCB) comprising multiple layers;
a plurality of second PCBs, each of the plurality of second PCBs comprising multiple layers;
a plurality of antenna sets disposed on a first side of the first PCB, the first side including a plurality of regions corresponding to the plurality of second PCBs, wherein each of the antenna sets is disposed on a corresponding region of the plurality of regions of the first PCB; and
a plurality of radio frequency integrated circuit (RFIC) chips,
wherein each of the second PCBs is configured to electrically connect a corresponding RFIC chip of the plurality of RFIC chips to the first PCB,
wherein each of the second PCBs has a smaller surface area than the first PCB and the second PCBs are spaced apart from each other,
wherein each of the second PCBs is coupled to a second side of the first PCB opposite to the first side of the first PCB via a grid array, and
wherein the module is configured to operate in a multiple input multiple output (MIMO) antenna scheme.
12. The wireless communication apparatus of claim 11 , wherein the plurality of regions are arranged in a plurality of columns and a plurality of rows configured for operating in the MIMO antenna scheme.
13. The wireless communication apparatus of claim 11 , wherein the plurality of antenna sets, the first PCB, and the second PCBs are arranged substantially parallel with respect to each other.
14. The wireless communication apparatus of claim 11 ,
wherein each of the second PCBs is configured to be electrically connected to a corresponding antenna set of the plurality of antenna sets on the first PCB, and
wherein each of the plurality of regions of the first PCB includes conductive lines in the first PCB.
15. The wireless communication apparatus of claim 11 , wherein each of grid arrays is spaced apart from an adjacent grid array at a predetermined interval in a space between the first PCB and a corresponding second PCB of the second PCBs.
16. The wireless communication apparatus of claim 11 , wherein a set of antennas within the plurality of antenna sets forms a group and each of antennas included in the group is spaced apart from an adjacent antenna in the group at a predetermined interval.
17. The wireless communication apparatus of claim 16 , wherein a set of second PCBs within the plurality of second PCBs forms a group, and each of second PCBs included in the group is spaced apart from an adjacent second PCB at a predetermined interval.
18. The wireless communication apparatus of claim 11 , wherein at least one capacitor for removing a noise is coupled with a first side, which is opposite to a second side to which the first PCB is coupled, of each of the second PCBs.
19. The wireless communication apparatus of claim 11 , wherein each of the regions of the first PCB is electrically connected to a corresponding grid array disposed between within a space between the first PCB and a corresponding second PCB of the second PCBs.