IP Library Granted Patent US 12,374,799
Granted Patent B2
US 12,374,799 · App. 18/054,312 · Granted Jul 29, 2025

Electronic device including antenna

Inventors: Namjun Cho (Suwon-si, KR); Hyoseok Na (Suwon-si, KR); Junghwan Son (Suwon-si, KR)
Assignee: Samsung Electronics Co., Ltd.
H01Q9/285H01Q1/422
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Quick Facts
Patent No.
US 12,374,799
App. No.
18/054,312
Granted
Jul 29, 2025
Kind
B2
Abstract

According to various embodiment, an electronic device may include: a housing, a first substrate disposed in an inner space of the housing and including a first surface facing a first direction, a second surface facing a direction opposite to the first surface, and a first recess area at least partially corresponding to the first surface, a second substrate at least partially disposed in the first recess area of the first substrate, a third substrate at least partially disposed on one surface of the second substrate and including multiple antenna elements comprising at least one antenna, and a wireless communication circuit disposed on the second surface of the first substrate and electrically connected to the second substrate. The second substrate may include at least one matching circuit electrically connected to the wireless communication circuit corresponding to each of the multiple elements.

Claims (26)

1. An electronic device comprising:

a housing;

a first substrate disposed in an inner space of the housing and comprising a first surface facing a first direction, a second surface facing a direction opposite to the first surface, and a first recess area at least partially corresponding to the first surface;

a second substrate at least partially disposed in the first recess area of the first substrate;

a third substrate at least partially disposed on one surface of the second substrate and comprising multiple antenna elements each comprising at least one antenna; and

a wireless communication circuit disposed on the second surface of the first substrate and electrically connected to the second substrate through at least one via included in the first substrate,

wherein the second substrate comprises a plurality of matching circuits electrically connected to the wireless communication circuit corresponding to each of the multiple antenna elements, and

wherein the first substrate comprises the first recess area for insertion of the second substrate such that the third substrate is closer to the wireless communication circuit than if the second substrate was disposed on the first substrate without the first recess area.

2. The electronic device of claim 1 , wherein the first substrate comprises the at least one via configured to electrically connect the second substrate and the wireless communication circuit.

3. The electronic device of claim 1 , wherein the first substrate comprises at least one stacked layer, and a layer included in a first group among the at least one layer comprises an opening corresponding to the first recess area.

4. The electronic device of claim 1 , wherein one end of each of the plurality of matching circuits included in the second substrate is electrically connected to the at least one antenna element included in the third substrate and another end of each of the plurality of matching circuits is electrically connected to the wireless communication circuit through the via included in the first substrate.

5. The electronic device of claim 4 , wherein the third substrate comprises at least one antenna element disposed at regular intervals and comprising an array antenna, based on the at least one antenna element.

6. The electronic device of claim 5 , wherein the third substrate comprises a first antenna structure on which a first antenna element is disposed and a second antenna structure on which a second antenna element is disposed, and comprises the array antenna, based on the first antenna element and the second antenna element.

7. The electronic device of claim 5 , wherein the third substrate is at least partially disposed on one of the first substrate and the second substrate.

8. The electronic device of claim 1 , wherein the second substrate is comprises a material having permittivity less than a permittivity of the first substrate or a transmission loss lower than a transmission loss of an electrical signal, and

wherein the third substrate has a dielectric constant (DK) value relatively larger than a DK of the first substrate and permittivity substantially the same as a permittivity of the second substrate.

9. The electronic device of claim 1 , wherein the number of the plurality of matching circuits is based on the number of antenna elements disposed on the third substrate, and

wherein each of the plurality of matching circuits comprises a conductive pattern.

10. An electronic device comprising:

a housing;

a first substrate disposed in an inner space of the housing and comprising a first surface facing a first direction, a second surface facing a direction opposite to the first surface, and a first recess area at least partially corresponding to the first surface, wherein the first recess area is positioned within a perimeter of the first substrate when viewed from a position orthogonal to a plane of the first substrate;

a second substrate at least partially disposed in the first recess area of the first substrate;

a third substrate at least partially disposed on one surface of the second substrate and comprising multiple antenna elements each comprising at least one antenna; and

a wireless communication circuit disposed on the second surface of the first substrate and electrically connected to the second substrate through at least one via included in the first substrate,

wherein the second substrate comprises a plurality of matching circuits electrically connected to the wireless communication circuit corresponding to each of the multiple antenna elements, and

wherein the first substrate comprises the first recess area for insertion of the second substrate such that the third substrate is closer to the wireless communication circuit than if the second substrate was disposed on the first substrate without the first recess area.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 10, 2022
From: CHO, NAMJUN; NA, HYOSEOK; SON, JUNGHWAN
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 061720/0937 →
Priority Claims (2)
KR 10-2021-0161047 · Nov 22, 2021 · national
KR 10-2022-0001626 · Jan 5, 2022 · national
Continuity (2)
Continuation PCTKR2022095136 · Oct 19, 2022
Related Publication 20230163475A1 · May 25, 2023
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