Induction heating device having improved target object detection accuracy and induction heating system including the same

1. An induction heating device, comprising:

a first working coil and a second working coil that are connected to each other electrically in parallel;

an inverter comprising at least two switches configured to cause a resonant current to flow in at least one of the first working coil or the second working coil by performing a switching operation;

a first semiconductor switch connected to the first working coil and configured to turn on or turn off the first working coil;

a second semiconductor switch connected to the second working coil and configured to turn on or turn off the second working coil; and

a processor configured to:

apply the resonant current to the first working coil or the second working coil by controlling the inverter, the first semiconductor switch, and the second semiconductor switch, respectively,

identify a number of pulses or a frequency of the resonant current applied to the first working coil or the second working coil, and

based on the number of pulses or the frequency of the resonant current, determine whether a target object is located at a first location corresponding to the first working coil or a second location corresponding to the second working coil.

2. The induction heating device of claim 1 , wherein the processor is further configured to:

supply one or more pulses to the inverter in a predetermined cycle to identify a location of the target object; and

within the predetermined cycle, sequentially turn on or turn off the first semiconductor switch and the second semiconductor switch based on the one or more pulses before identifying the location of the target object.

3. The induction heating device of claim 2 , wherein a number of the one or more pulses is less than or equal to three.

4. The induction heating device of claim 2 , wherein the processor is further configured to simultaneously turn on the second semiconductor switch and turn off the first semiconductor switch after supplying a first pulse of the one or more pulses to the inverter.

5. The induction heating device of claim 4 , wherein the processor is further configured to:

supply the first pulse of the one or more pulses to the inverter after turning on the first semiconductor switch before turning on the second semiconductor switch; and

turn off the first semiconductor switch before supplying a second pulse of the one or more pulses.

6. The induction heating device of claim 2 , wherein the processor is further configured to repeat supplying the one or more pulses to the inverter until identifying the location of the target object.

7. The induction heating device of claim 2 , wherein the processor is further configured to:

turn on the first semiconductor switch at a first time in the predetermined cycle;

based on turning on the first semiconductor switch, supply the one or more pulses to the inverter;

determine whether the target object is located at the first location corresponding to the first working coil or the second location corresponding to the second working coil before a second time in the predetermined cycle, the second time being later than the first time;

turn off the first semiconductor switch and turn on the second semiconductor switch at the second time; and

based on turning off the first semiconductor switch and turning on the second semiconductor switch at the second time, supply the one or more pulses to the inverter.

8. The induction heating device of claim 7 , wherein the processor is further configured to:

determine whether the target object is located at the first location corresponding to the first working coil or the second location corresponding to the second working coil before a third time in the predetermined cycle, the third time being later than the second time;

turn off the second semiconductor switch and turn on the first semiconductor switch at the third time; and

based on turning off the second semiconductor switch and turning on the first semiconductor switch at the third time, supply the one or more pulses to the inverter.

9. The induction heating device of claim 7 , wherein the processor is further configured to determine, before the second time after the first time, that the target object is not located at the first location corresponding to the first working coil (i) based on the number of pulses of the resonant current being greater than or equal to a first reference number or (ii) based on the frequency of the resonant current being equal to a first reference frequency.

10. The induction heating device of claim 9 , wherein the processor is further configured to:

determine that the target object is located at a first position offset from the first working coil based on the number of pulses of the resonant current being less than the first reference number and being greater than or equal to a second reference number; and

determine that the target object is located at a second position different from the first position based on the number of pulses of the resonant current being less than the second reference number.

11. The induction heating device of claim 10 , wherein the second position is closer to a center of the first working coil than the first position.

12. The induction heating device of claim 9 , wherein the processor is further configured to:

determine that the target object is located at a first position offset from the first working coil based on the frequency of the resonant current being less than the first reference frequency and being greater than or equal to a second reference frequency; and

determine that the target object is located at a second position different from the first position based on the frequency of the resonant current being less than the second reference frequency.

13. The induction heating device of claim 7 , wherein the processor is further configured to:

based on an elapse of a first delay after turning on the first semiconductor switch at the first time, supply the one or more pulses to the inverter; and

based on an elapse of a second delay after supplying the one or more pulses to the inverter, turn off the first semiconductor switch at the second time.

14. The induction heating device of claim 2 , wherein the processor is configured to:

based on determining that the target object is located at the first location corresponding to the first working coil, supply a switching signal to the inverter, the switching signal having a frequency and a phase corresponding to a power level that is input from a user; and

turn on or turn off the first semiconductor switch based on the switching signal.

15. The induction heating device of claim 14 , wherein the processor is further configured to:

stop supplying the switching signal to the inverter to determine whether an object different than the target object is located at the second working coil;

simultaneously turn off the first semiconductor switch and turn on the second semiconductor switch at a start of a predetermined time period after stopping supply of the switching signal to the inverter; and

after turning on the second semiconductor switch, supply the one or more pulses to the inverter within the predetermined time period.

16. The induction heating device of claim 15 , wherein the processor is further configured to:

determine whether the object is located at the second working coil based on the number of pulses or the frequency of the resonant current before an end of the predetermined time period;

simultaneously turn off the second semiconductor switch and turn on the first semiconductor switch at the end of the predetermined time period;

turn on the first semiconductor switch; and

after turning on the first semiconductor switch, supply the switching signal to the inverter.

17. The induction heating device of claim 14 , wherein the processor is further configured to adjust the frequency and the phase of the switching signal based on a change of the power level that is input from the user.

18. The induction heating device of claim 17 , wherein the processor is further configured to receive information about the target object, the information including a type of the target object, a charging mode, or an amount of power required to heat the target object.

19. The induction heating device of claim 18 , wherein the processor is further configured to determine whether the target object is a container for induction heating or a wireless power receiving device based on receiving the information about the target object.

20. The induction heating device of claim 1 , wherein the processor is further configured to:

based on the target object corresponding to a container for induction heating, determine whether the target object is located at the first location corresponding to the first working coil or the second location corresponding to the second working coil based on the number of pulses of the resonant current; and

based on the target object corresponding to a wireless power receiving device, determine whether the target object is located at the first location corresponding to the first working coil or the second location corresponding to the second working coil based on the frequency of the resonant current.