Measurement system, substrate processing system, and device manufacturing method
A measurement system to be used in a manufacturing line for micro-devices is provided independently from an exposure apparatus. The measurement system has measurement devices that each performs measurement processing on substrates (e.g., substrates that have gone through at least one processing but before being coated with a sensitive agent), and a carrying system for performing delivery of substrates to/from the measurement devices. The measurement devices include a first measurement device that acquires position information on a plurality of marks formed on a substrate under a setting of a first condition, and a second measurement device that acquires position information on a plurality of marks formed on another substrate (e.g., another substrate included in the same lot as the substrate on which acquiring position information is performed under the setting of the first condition in the first measurement device) under a setting of a first condition.
1. A measurement system used in a manufacturing line for micro-devices, the measurement system comprising:
a plurality of measurement devices in which each device performs measurement processing on substrates; and
a carrying system to perform delivery of the substrates to and from the plurality of measurement devices, wherein
the plurality of measurement devices includes a first measurement device that acquires position information on a plurality of marks formed on the substrates, and a second measurement device that acquires position information on the plurality of marks formed on the substrates, and
the position information on the plurality of marks formed on one of the substrates can be acquired under a setting of a first predetermined condition in the first measurement device, and the position information on the plurality of marks formed on another one of the substrates can be acquired under a setting of a second predetermined condition different from the first predetermined condition in the second measurement device, the position information is utilized in an exposure processing on the substrates by an exposure apparatus that is provided separately from the measurement devices in the manufacturing line.
2. The measurement system according to claim 1 , wherein
with the another one of the substrates, acquirement of the position information is performed under the setting of the second predetermined condition in the second measurement device, after acquirement of the position information has been completed under the setting of the first predetermined condition in the first measurement device.
3. The measurement system according to claim 1 , wherein
the first predetermined condition is different from the second predetermined condition in at least one of an irradiating condition of a detection light irradiated on the mark, a light receiving condition when receiving light generated from the mark, and a signal processing condition to process photo-electrically converted signals obtained by receiving the light generated from the mark.
4. The measurement system according to claim 3 , wherein
each of the first measurement device and the second measurement device is equipped with an optical system that irradiates the mark with the detection light, and
the irradiating condition includes at least one of: wavelength of the detection light, light amount of the detection light, and one of NA and σ of the optical system.
5. The measurement system according to claim 3 , wherein
a plurality of diffracted lights of a different order is generated from the mark, and
the light receiving condition includes order of diffracted light used to acquire the position information.
6. The measurement system according to claim 3 , wherein
a plurality of lights of a different wavelength is generated from the mark, and
the light receiving condition includes wavelength of light used to acquire the position information.
7. The measurement system according to claim 1 , wherein
the position information on the plurality of marks formed on an mth layer (m is an integral number of 1 or more) of the substrates is acquired under a setting of the first predetermined condition in the first measurement device, and the position information on the plurality of marks formed on an nth layer (n is an integral number of 2 or more and is larger than m) of the substrates is acquired under a setting of the second predetermined condition in the second measurement device.
8. The measurement system according to claim 7 , wherein
each of position information on the plurality of marks formed on the mth layer and position information on the plurality of marks formed on the nth layer is output.
9. The measurement system according to claim 8 , wherein
the plurality of marks formed on the mth layer includes a grating mark whose periodic direction is in one direction within a predetermined plane, and the plurality of marks formed on the nth layer includes a grating mark whose periodic direction is in a direction intersecting with the one direction within a predetermined plane.
10. The measurement system according to claim 7 , wherein
information obtained, based on the position information on the plurality of marks formed on the mth layer and the position information on the plurality of marks formed on the nth layer, is output.
11. The measurement system according to claim 10 , wherein
the plurality of marks formed on the mth layer includes a first mark, and the plurality of marks formed on the nth layer includes a second mark corresponding to the first mark, and
the information output includes information related to position displacement of the first mark and the second mark.
12. The measurement system according to claim 10 , wherein
the information output includes information related to overlay displacement between the mth layer and the nth layer.
13. The measurement system according to claim 1 , wherein
the position information on the marks formed on the another one of the substrates included in the same lot as the one substrate on which acquiring the position information under the setting of the first condition is performed in the first measurement device, is acquired in the second measurement device under the setting of the second condition, the position information is utilized for the exposure processing on the another one of the substrates.
14. The measurement system according to claim 13 , further comprising:
a carrier system which has at least one carrier mounting section where a carrier that can house the plurality of substrates can be installed, and
the carrying system performs delivery of the substrates with the carrier system.
15. The measurement system according to claim 14 , wherein
the one of the substrates and the another one of the substrates included in the same lot are carried into the carrier mounting section in a state housed in the carrier, prior to acquiring position information on the plurality of marks.
16. The measurement system according to claim 1 , wherein
acquiring the position information on the plurality of marks performed in at least one of the first measurement device and the second measurement device is performed on the substrates after going through at least one processing of: resist coating before exposure, developing after exposure, cleaning, oxidation/diffusion, film deposition, etching, ion implantation, and CMP.
17. The measurement system according to claim 16 , wherein
acquiring the position information of the plurality of marks performed in at least one of the first measurement device and the second measurement device is performed on the substrates that have completed developing and is before etching.
18. The measurement system according to claim 1 , wherein
acquiring the position information of the plurality of marks performed in at least one of the first measurement device and the second measurement device is performed on the substrates before coating of a sensitive agent for the next exposure.
19. The measurement system according to claim 1 , wherein
the plurality of measurement devices includes at least one third measurement device which performs a different type of measurement from that of the first measurement device and that of the second measurement device with respect to the substrates.
20. The measurement system according to claim 19 , wherein
the third measurement device is a device that can measure flatness information on a surface of the substrates.
21. The measurement system according to claim 1 , wherein
the first measurement device comprises:
a stage that is movable holding the substrate;
a drive system that moves the stage;
a first position measurement system that can acquire position information on the stage; and
a mark detection system that detects a mark formed on the substrate, the measurement system further comprising:
a controller that controls movement of the stage by the drive system and detects each of the plurality of marks formed on the substrate using the mark detection system, and obtains an absolute position coordinate of each of the plurality of marks, based on detection results of each of the plurality of marks and position information of the stage obtained using the first position measurement system at the time of detection of each of the plurality of marks.
22. The measurement system according to claim 21 , wherein
the first position measurement system can acquire position information on the stage in at least directions of three degrees of freedom.
23. The measurement system according to claim 21 , wherein
the first position measurement system has one of a measurement surface having a grating section and a head section which irradiates the measurement surface with a beam provided in the stage, and along with irradiating the measurement surface with the beam from the head section, receives a return beam from the measurement surface of the beam so that position information of the stage can be acquired.
24. The measurement system according to claim 23 , further comprising:
a base member in which the head section is provided; and
a second position measurement system which acquires relative position information between the mark detection system and the base member, wherein
the controller controls movement of the stage by the drive system, based on position information acquired using the second position measurement system and position information acquired using the first position measurement system.
25. The measurement system according to claim 24 , wherein
the base member supports the stage movable in directions of six degrees of freedom which includes a first direction and a second direction orthogonal to each other in a predetermined plane and a third direction perpendicular to the predetermined plane, and
the second position detection system can acquire relative position information in the directions of six degrees of freedom between the mark detection system and the base member.
26. The measurement system according to claim 25 , wherein
the controller uses the relative position information between the mark detection system and the base member within the predetermined plane obtained using the second position measurement system as a correction amount, when obtaining the absolute position coordinates of the plurality of marks.
27. The measurement system according to claim 21 , wherein
the controller performs statistical calculation using a plurality of the absolute position coordinates of the marks obtained, and obtains a correction amount from design values of an arrangement of the plurality of divided areas on the substrate.
28. The measurement system according to claim 1 , wherein
the plurality of marks includes alignment marks.
29. The measurement system according to claim 1 , wherein
the plurality of marks includes marks used for overlay displacement measurement.
30. A substrate processing system, comprising:
the measurement system according to claim 1 ; and
the exposure apparatus that has a substrate stage on which the substrate that has completed measurement of position information of the plurality of marks by at least one of the first measurement device and the second measurement device of the measurement system is mounted, and to the substrate mounted on the substrate stage, performs alignment measurement in which position information of a part of marks selected from a plurality of marks on the substrate is acquired and exposure in which the substrate is exposed with an energy beam.
31. A substrate processing system, comprising:
a first measurement system and a second measurement system structured from the measurement system according to claim 1 ; and
the exposure apparatus that has a substrate stage on which the substrate that has completed measurement of position information on the plurality of marks by at least one of the first measurement device and the second measurement device of the measurement system is mounted, and to the substrate mounted on the substrate stage, performs alignment measurement in which position information on a part of marks selected from a plurality of marks on the substrate is acquired and exposure in which the substrate is exposed with an energy beam, wherein
acquiring position information on the plurality of marks performed in at least one of the first measurement device and the second measurement device that the first measurement system is equipped with is performed on a substrate that has gone through at least one processing of; cleaning, oxidation/diffusion, film deposition, etching, ion implantation, and CMP and is before coating of a sensitive agent for the next exposure,
acquiring position information on the plurality of marks performed in at least one of the first measurement device and the second measurement device that the second measurement system is equipped with is performed on a substrate before etching processing, the substrate having been exposed by the exposure apparatus and has been developed, and
acquiring position information on the plurality of marks for different substrates by each of the first measurement system and the second measurement system is performed concurrently with alignment measurement and exposure to different substrates by the exposure apparatus.
32. A device manufacturing method, comprising:
exposing a substrate using an exposure apparatus that structures a part of the substrate processing system according to claim 30 , and
developing the substrate that has been exposed.
33. A device manufacturing method, comprising:
exposing a substrate using an exposure apparatus that structures a part of the substrate processing system according to claim 31 , and
developing the substrate that has been exposed.
34. A measurement system used in a manufacturing line for micro-devices, the measurement system comprising:
a first measurement device that performs measurement processing on substrates; and
a second measurement device that performs measurement processing on the substrates, wherein
the substrates that have been measured by one of the first measurement device and the second measurement device can be measured by the other of the first measurement device and the second measurement device, at least one of results the measurement processing is for use in an exposure apparatus which is provided separately in the manufacturing line from the first measurement device and the second measurement device.
35. The measurement system according to claim 34 , wherein
the one of the first measurement device acquires position information on a plurality of marks formed on the substrates, and
the other of the second measurement device acquires position information on a plurality of marks formed on the substrates.
36. A substrate processing system, comprising:
the measurement system according to claim 34 ; and
the exposure apparatus that has a substrate stage on which the substrate that has completed measurement of position information of the plurality of marks by at least one of the first measurement device and the second measurement device of the measurement system is mounted, and to the substrate mounted on the substrate stage, performs alignment measurement in which position information of a part of marks selected from a plurality of marks on the substrate is acquired and exposure in which the substrate is exposed with an energy beam.
37. A substrate processing system, comprising:
a first measurement system and a second measurement system structured from the measurement system according to claim 34 ; and
the exposure apparatus that has a substrate stage on which the substrate that has completed measurement of position information on the plurality of marks by at least one of the first measurement device and the second measurement device of the measurement system is mounted, and to the substrate mounted on the substrate stage, performs alignment measurement in which position information on a part of marks selected from a plurality of marks on the substrate is acquired and exposure in which the substrate is exposed with an energy beam, wherein
acquiring position information on the plurality of marks performed in at least one of the first measurement device and the second measurement device that the first measurement system is equipped with is performed on a substrate that has gone through at least one processing of; cleaning, oxidation/diffusion, film deposition, etching, ion implantation, and CMP and is before coating of a sensitive agent for the next exposure,
acquiring position information on the plurality of marks performed in at least one of the first measurement device and the second measurement device that the second measurement system is equipped with is performed on a substrate before etching processing, the substrate having been exposed by the exposure apparatus and has been developed, and
acquiring position information on the plurality of marks for different substrates by each of the first measurement system and the second measurement system is performed concurrently with alignment measurement and exposure to different substrates by the exposure apparatus.
38. A device manufacturing method, comprising:
exposing a substrate using an exposure apparatus that structures a part of the substrate processing system according to claim 36 , and
developing the substrate that has been exposed.
39. A device manufacturing method, comprising:
exposing a substrate using an exposure apparatus that structures a part of the substrate processing system according to claim 37 , and
developing the substrate that has been exposed.