IP Library › Granted Patent US 11,069,868
Granted Patent B2
US 11,069,868 · App. 16/448,086 · Granted Jul 20, 2021

Semiconductor structure, semiconductor device, photodetector and spectrometer

Inventors: Ke Zhang (Beijing, CN); Yang Wei (Beijing, CN); Shou-Shan Fan (Beijing, CN)
Assignees: Tsinghua University; HON HAI PRECISION INDUSTRY CO., LTD.
H01L51/4213H01L51/0048H01L51/057H01L51/4286B82Y10/00B82Y15/00H01L29/267H01L31/0336
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Quick Facts
Patent No.
US 11,069,868
App. No.
16/448,086
Granted
Jul 20, 2021
Kind
B2
Abstract

The present invention relates to a semiconductor structure. The semiconductor structure comprises a semiconductor layer, at least one metallic carbon nanotube, and at least one graphene layer. The semiconductor layer defines a first surface and a second surface opposite to the first surface. The at least one metallic carbon nanotube is located on the first surface of the semiconductor layer. The at least one graphene layer is located on the second surface of the semiconductor layer. The at least one metallic carbon nanotube, the semiconductor layer and the at least one graphene layer are stacked with each other to form at least one three-layered stereoscopic structure. The present invention also relates a semiconductor device, and a photodetector.

Claims (36)

1. A semiconductor structure, comprising:

a semiconductor layer defining a first surface and a second surface opposite to the first surface;

a single metallic carbon nanotube located on the first surface of the semiconductor layer; and

at least one graphene layer located on the second surface of the semiconductor layer,

wherein the single metallic carbon nanotube, the semiconductor layer and the at least one graphene layer are stacked with each other to form at least one three-layered stereoscopic structure, the semiconductor layer is asymmetrically sandwiched between the single metallic carbon nanotube and the at least one graphene layer.

2. The semiconductor structure of claim 1 , wherein a thickness of the semiconductor layer ranges from approximately 1 nanometer to 100 nanometers.

3. The semiconductor structure of claim 1 , wherein a diameter of the single metallic carbon nanotube ranges from approximately 0.5 nanometers to 150 nanometers.

4. The semiconductor structure of claim 1 , wherein a thickness of the graphene layer ranges from approximately 1 nanometer to 100 nanometers.

5. The semiconductor structure of claim 1 , wherein the at least one graphene layer is a single graphene layer.

6. The semiconductor structure of claim 1 , wherein the at least one graphene layer comprises a plurality of graphene layers.

7. The semiconductor structure of claim 6 , wherein the plurality of graphene layers are coplanar on the second surface of the semiconductor layer.

8. The semiconductor structure of claim 6 , wherein the plurality of graphene layers are spaced apart from each other on the second surface of the semiconductor layer.

9. The semiconductor structure of claim 1 , wherein the single metallic carbon nanotube is prepared by removing an outer wall of a multi-walled metallic carbon nanotube.

10. A semiconductor device, comprising:

a gate electrode with a layered structure;

an insulating layer located on a surface of the gate electrode;

at least one metallic carbon nanotube located on a surface of the insulating layer;

a semiconductor layer located on the surface of the insulating layer and covering the at least one metallic carbon nanotube;

at least one graphene layer located on a surface of the semiconductor layer, wherein the semiconductor layer is located between the at least one metallic carbon nanotube and the at least one graphene layer and the at least one metallic carbon nanotube, the semiconductor layer and the at least one graphene layer are stacked with each other to form at least one three-layered stereoscopic structure;

at least one first electrode electrically connected to the at least one metallic carbon nanotube; and

at least one second electrode electrically connected to the at least one graphene layer.

11. The semiconductor device of claim 10 , wherein a number of the first electrode is the same as a number of the metallic carbon nanotube, and a number of the second electrode is the same as a number of the graphene layer.

12. The semiconductor device of claim 10 , wherein the first electrode is located at one end of the metallic carbon nanotube and adhered on a surface of the metallic carbon nanotube.

13. The semiconductor device of claim 10 , wherein the second electrode is located at one end of the graphene layer and adhered on a surface of the graphene layer.

14. A photodetector, comprising:

a gate electrode being a layered structure;

an insulating layer located on a surface of the gate electrode;

at least one metallic carbon nanotube located on a surface of the insulating layer;

a semiconductor layer located on the surface of the insulating layer and covering the at least one metallic carbon nanotube;

at least one graphene layer located on a surface of the semiconductor layer, wherein the semiconductor layer is located between the at least one metallic carbon nanotube and the at least one graphene layer and the at least one metallic carbon nanotube, the semiconductor layer and the at least one graphene layer are stacked with each other to form at least one three-layered stereoscopic structure;

at least one first electrode electrically connected to the at least one metallic carbon nanotube;

at least one second electrode electrically connected to the at least one graphene layer;

at least one current detecting element electrically connected with the at least first electrode and the at least second electrode; and

at least one power source electrically connected with the at least first electrode and the at least second electrode.

15. The photodetector of claim 14 , wherein a number of the current detecting element is the same as a number of the three-layered stereoscopic structure.

16. The photodetector of claim 14 , wherein a number of the power source is the same as a number of the three-layered stereoscopic structure.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 21, 2019
From: ZHANG, KE; WEI, YANG; FAN, SHOU-SHAN
To: TSINGHUA UNIVERSITY; HON HAI PRECISION INDUSTRY CO., LTD.
Reel/Frame 049547/0232 →
Priority Claims (1)
CN 201810713762.4 · Jul 3, 2018 · national
Continuity (1)
Related Publication 20200013972A1 · Jan 9, 2020
Cited By (1)
US 12,532,496