LED bulb lamp
View Patent ↗An LED filament includes LED chips, two conductive electrodes, light conversion coating, and attaching structure. The LED chips are electrically connected with one another. Each of the two conductive electrodes is electrically connected to a corresponding LED chip of the LED chips. The light conversion coating is coated on two sides of the LED chips and the two conductive electrodes. A portion of each of the two conductive electrodes is exposed from the light conversion coating. The light conversion coating includes a top layer and a base layer. The base layer coats on one side of the LED chips, and the top layer coats on another sides of the LED chips. The attaching structure is between the top layer and the base layer, between the base layer and the conductive electrodes, or between the top layer and the conductive electrodes.
1. An LED filament comprising:
an LED chip assembly;
two conductive electrodes, each of the two conductive electrodes being electrically connected to the LED chip assembly; and
a light conversion coating coated on the LED chip assembly and the two conductive electrodes, a portion of each of the two conductive electrodes being exposed from the light conversion coating, wherein the light conversion coating is connected with the two conductive electrodes through an attaching structure to enhance fastness between the light conversion coating and the two conductive electrodes,
wherein the conductive electrodes are enclosed by the light conversion coating, the attaching structure is between the light conversion coating and the conductive electrodes, each of the conductive electrodes comprises a plurality of holes, and the light conversion coating extends into each of the conductive electrodes via the holes.
2. The LED filament of claim 1 , wherein the attaching structure comprises rough surfaces, and the rough surfaces are respectively formed on contact faces between the light conversion coating and the conductive electrodes.
3. The LED filament of claim 1 , wherein the attaching structure comprises wave-shaped interfaces, and the wave-shaped interfaces are respectively formed on contact faces between the light conversion coating and the conductive electrodes.
4. The LED filament of claim 1 , wherein the attaching structure comprises saw tooth shapes, and the saw tooth shapes are respectively formed on contact faces between the light conversion coating and the conductive electrodes.
5. The LED filament of claim 1 , wherein the light conversion coating passes through each of the holes from one side of each of the holes to an opposite side of each of the holes.
6. The LED filament of claim 5 , wherein the light conversion coating comprises a phosphor powder glue, and the phosphor powder glue extends into each of the conductive electrodes and passes through each of the holes from one side of each of the holes to an opposite side of each of the holes.
7. The LED filament of claim 5 , wherein each of the conductive electrodes is clamped by the light conversion coating, and the light conversion coating and each of the conductive electrodes are riveted together.
8. The LED filament of claim 1 , further comprising at least two auxiliary pieces, wherein each of the at least two auxiliary pieces extends from a side of a corresponding one of the two conductive electrodes to a side of the corresponding LED chip assembly along an axial direction of the LED filament.
9. The LED filament of claim 8 , wherein the conductive electrodes and the auxiliary pieces are enclosed by the light conversion coating, the attaching structure is between the light conversion coating and the conductive electrodes and between the light conversion coating and the auxiliary pieces, each of the conductive electrodes and each of the auxiliary pieces respectively comprise a plurality of holes, and the light conversion coating extends into each of the conductive electrodes and each of the auxiliary pieces via the holes.
10. The LED filament of claim 9 , wherein the light conversion coating passes through each of the holes from one side of each of the holes to an opposite side of each of the holes.
11. The LED filament of claim 10 , wherein the light conversion coating comprises a phosphor powder glue, and the phosphor powder glue extends into each of the conductive electrodes and each of the auxiliary pieces and passes through each of the holes from one side of each of the holes to an opposite side of each of the holes.