ID chip socket for test connector assembly, test connector assembly including ID chip socket, and test equipment set including test connector assembly

1. An ID (identification) chip socket fixed to a frame that supports a connector of a test connector assembly, the ID chip socket comprising:

a contactor configured to be fixed to an upper side of the frame;

a socket-conductive part penetrating the contactor in a vertical direction and configured to enable electrical connection in the vertical direction;

an ID chip fixed to an upper side of the socket-conductive part and electrically connected to the socket-conductive part; and

a cover configured to cover an upper surface of the ID chip and to be fixed to at least one of the contactor and the frame.

2. The ID chip socket of claim 1 , wherein the upper surface of the ID chip and an inner downwardly-facing surface of the cover are disposed to form a vertical gap between the upper surface of the ID chip and the inner downwardly-facing surface of the cover.

3. The ID chip socket of claim 2 , wherein the vertical gap is filled with air or a material that is more flexible than a material of the cover.

4. The ID chip socket of claim 2 , wherein a lateral surface of the ID chip and an inner lateral surface of the cover are disposed to form a lateral gap between the lateral surface of the ID chip and the inner lateral surface of the cover.

5. The ID chip socket of claim 1 , wherein the cover comprises:

an upper portion that covers the upper surface of the ID chip;

a lateral portion that covers a lateral surface of the ID chip; and

an attachment portion fixed to at least one of the contactor and the frame below the lateral portion.

6. The ID chip socket of claim 1 , wherein the cover is formed by coating the ID chip with a silicon material.

7. The ID chip socket of claim 1 , wherein the contactor comprises a base plate made of an insulating material, and

wherein the socket-conductive part comprises:

a penetration portion made of a conductive material and vertically penetrating the base plate;

at least one upper conductive plate disposed between an upper end of the penetration portion and the ID chip to enable electrical connection, the at least one upper conductive plate being fixed to an upper surface of the base plate; and

a lower conductive plate disposed at a lower end of the penetration portion to enable electrical connection, the lower conductive plate being fixed to a lower surface of the base plate.

8. The ID chip socket of claim 7 , wherein the at least one upper conductive plate comprises two upper conductive plates which are in contact with one of the penetration portion and are spaced apart from each other.

9. The ID chip socket of claim 1 , wherein the socket-conductive part comprises a contact pad fixed to a lower side of the contactor and configured to be brought into contact with a test equipment, and

wherein the contact pad comprises:

a sheet made of an elastically deformable insulating material; and

a pad-conductive part extending in the sheet in the vertical direction to enable electrical connection in the vertical direction.

10. The ID chip socket of claim 1 , wherein the ID chip stores at least one of identification information and history information,

wherein the identification information is identification information on the test connector assembly, and

wherein the history information is history information related to a lifespan or usage frequency of the test connector assembly.

11. A test connector assembly disposed between a device to be inspected and test equipment to electrically connect the device to be inspected and the test equipment to each other, the test connector assembly comprising:

a frame supporting a connector for testing; and

an ID chip socket fixed to an upper side of the frame,

wherein the ID chip socket comprises:

a contactor fixed to the upper side of the frame;

a socket-conductive part penetrating the contactor in a vertical direction and configured to enable electrical connection in the vertical direction;

an ID chip fixed to an upper side of the socket-conductive part and electrically connected to the socket-conductive part; and

a cover configured to cover an upper surface of the ID chip and fixed to at least one of the contactor and the frame.

12. The test connector assembly of claim 11 , wherein the cover is fixed to the frame.

13. The test connector assembly of claim 12 , wherein the frame comprises a plurality of layers including at least one first layer and at least one second layer below the at least one first layer, which are stacked in the vertical direction, and

wherein a portion of the first layer is opened such that the cover is fixed to an upper surface of the second layer.

14. The test connector assembly of claim 11 , wherein the frame comprises a plurality of layers including at least one first layer and at least one second layer below the at least one first layer, which are stacked in the vertical direction, and

wherein a portion of the first layer is opened such that the contactor is fixed to an upper surface of the second layer.

15. The test connector assembly of claim 11 , wherein the frame comprises a plurality of layers further comprising at least one first layer and at least one second layer below the at least one first layer, which are stacked in the vertical direction,

wherein a portion of the first layer is opened such that a portion of an upper surface of the second layer is exposed, and

wherein each of the contactor and the cover is fixed to the portion of the upper surface of the second layer.

16. The test connector assembly of claim 15 , wherein a hole is formed in a central portion of the portion of the upper surface of the second layer such that a lower end of the socket-conductive part is exposed downward.

17. The test connector assembly of claim 11 , wherein the upper surface of the ID chip and an inner downwardly-facing surface of the cover are disposed to form a vertical gap between the upper surface of the ID chip and the inner downwardly-facing surface of the cover.

18. The test connector assembly of claim 11 , wherein the cover is formed by coating the ID chip with a silicon material.

19. The test connector assembly of claim 11 , wherein the contactor comprises a base plate made of an insulating material, and

wherein the socket-conductive part further comprises:

a penetration portion made of a conductive material and vertically penetrating the base plate;

an upper conductive plate disposed between an upper end of the penetration portion and the ID chip to enable electrical connection, the upper conductive plate being fixed to an upper surface of the base plate; and

a lower conductive plate disposed at a lower end of the penetration portion to enable electrical connection, the lower conductive plate being fixed to a lower surface of the base plate.

20. A test equipment set comprising:

a test equipment; and

a test connector assembly disposed between a device to be inspected and the test equipment to electrically connect the device to be inspected and the test equipment to each other,

wherein the test connector assembly further comprises:

a frame supporting a connector for testing; and

an ID chip socket fixed to an upper side of the frame,

wherein the ID chip socket comprises:

a contactor fixed to the upper side of the frame;

a socket-conductive part penetrating the contactor in a vertical direction and configured to enable electrical connection in the vertical direction, the socket-conductive part having a lower end brought into contact with the test equipment;

an ID chip fixed to an upper side of the socket-conductive part and electrically connected to the socket-conductive part; and

a cover configured to cover an upper surface of the ID chip and fixed to at least one of the contactor and the frame, and

wherein the ID chip is configured to execute at least one of an identification function of identifying at least one of the device to be inspected and the test connector assembly and a history management function of tracking a history of the ID chip socket, by receiving an electrical signal from the test equipment or sending an electrical signal to the test equipment.