Substrate processing apparatus
Disclosed is an apparatus for processing substrate which prevents a plasma discharge from being transferred to a substrate so as to minimize damages on the substrate and also minimize deterioration in quality of a thin film deposited on the substrate, wherein the apparatus may include a process chamber for providing a reaction space, and a gas distribution module for dissociating processing gas by the use of plasma, and distributing the dissociated processing gas onto a substrate, wherein the gas distribution module may include a lower frame having a plurality of electrode inserting portions, an upper frame having a plurality of protruding electrodes and processing gas distribution holes, and an insulating plate having a plurality of electrode penetrating portions.
1. A substrate processing apparatus comprising:
a process chamber that provides a reaction space;
a single gas distribution module that distributes a processing gas onto a substrate; and
a chamber lid that covers the process chamber, wherein:
the single gas distribution module is detachably connected with a lower surface of the chamber lid,
the single gas distribution module is in the process chamber and includes a lower frame, an upper frame, and an insulating plate between the lower frame and the upper frame, the insulating plate having a plurality of electrode penetrating portions, and a processing gas buffer space is between an upper surface of the upper frame and the lower surface of the chamber lid;
the upper frame includes:
a plurality of protruding electrodes that protrude from a lower surface of the upper frame toward the substrate, each of the protruding electrodes having an outer lateral surface;
a plurality of processing gas distribution holes that penetrate through the plurality of protruding electrodes and downwardly distribute the processing gas from the processing gas buffer space to a lower surface of the plurality of protruding electrodes;
a plurality of dilution gas division holes in the upper frame in communication with a plurality of dilution gas common supply pipes;
a plurality of dilution gas supply holes inside the upper frame and in communication with the plurality of dilution gas division holes; and
a plurality of dilution gas distribution holes at fixed intervals in the upper frame and receiving the dilution gas from the plurality of dilution gas supply holes, wherein each of the plurality of protruding electrodes is between at least two of the plurality of dilution gas distribution holes,
the lower frame includes a plurality of electrode inserting portions, each of the electrode inserting portions having an inner lateral surface;
the plurality of protruding electrodes are in and penetrate through the electrode penetrating portions, and the inner lateral surface of each of the electrode inserting portions and the outer lateral surface of a corresponding one of the protruding electrodes therein defines a gap space, whereby the plurality of dilution gas distribution holes distribute a dilution gas to the gap spaces around the protruding electrodes;
the upper frame is electrically grounded;
the plurality of dilution gas common supply pipes are in the processing gas buffer space;
the substrate processing apparatus further comprises a plasma power supplier that supplies power to the lower frame; and
the substrate processing apparatus generates a plasma in or below the gap space using the dilution gas from the plurality of dilution gas distribution holes.
2. The substrate processing apparatus according to claim 1 , wherein each of the electrode inserting portions and each of the protruding electrodes has a same shape.
3. The substrate processing apparatus according to claim 2 , wherein the same shape of each of the electrode inserting portions and each of the protruding electrodes is circular or polygonal.
4. The substrate processing apparatus according to claim 1 , wherein the plurality of electrode inserting portions have a lattice or zigzag configuration, and face an upper surface of the substrate.
5. The substrate processing apparatus according to claim 1 , wherein a first distance between a lower surface of the lower frame and an upper surface of the substrate is different from a second distance between the lower surface of the plurality of protruding electrodes and the upper surface of the substrate.
6. The substrate processing apparatus according to claim 5 , wherein each of the plurality of protruding electrodes has a different length.
7. The substrate processing apparatus according to claim 1 , wherein the dilution gas comprises hydrogen (H 2 ), nitrogen (N 2 ), oxygen (O 2 ), nitrogen dioxide (NO 2 ), ammonia (NH 3 ), water (H 2 ), or ozone (O 3 ).
8. The substrate processing apparatus according to claim 1 , wherein each of the plurality of protruding electrodes has a circular or polygonal cross section.
9. The substrate processing apparatus according to claim 1 , wherein the processing gas includes a material comprising silicon, titanium, zirconium, hafnium, or aluminum.
10. A substrate processing apparatus comprising:
a process chamber that provides a reaction space; and
a single gas distribution module that distributes a processing gas onto a substrate; and
a chamber lid that covers the process chamber, wherein the single gas distribution module is detachably connected with a lower surface of the chamber lid, and:
the single gas distribution module is in the process chamber and includes a lower frame and an upper frame, such that a processing gas buffer space is between an upper surface of the upper frame and the lower surface of the chamber lid;
the upper frame includes:
a plurality of protruding electrodes that protrude from a lower surface of the upper frame toward the substrate, each of the protruding electrodes having an outer lateral surface;
a plurality of processing gas distribution holes that penetrate through the plurality of protruding electrodes and downwardly distribute the processing gas from the processing gas buffer space to a lower surface of the plurality of protruding electrodes;
a plurality of dilution gas division holes in the upper frame in communication with the plurality of dilution gas common supply pipes;
a plurality of dilution gas supply holes in the upper frame and in communication with the plurality of dilution gas division holes; and
a plurality of dilution gas distribution holes at fixed intervals in the upper frame and receiving the dilution gas from the plurality of dilution gas supply holes, wherein each of the plurality of protruding electrodes is between at least two of the plurality of dilution gas distribution holes,
the lower frame includes a plurality of electrode inserting portions, each of the electrode inserting portions having an inner lateral surface;
the plurality of protruding electrodes are in the plurality of electrode inserting portions, and the inner lateral surface of each of the electrode inserting portions and the outer lateral surface of a corresponding one of the protruding electrodes therein defines a gap space, whereby the plurality of dilution gas distribution holes distribute a dilution gas to the gap spaces around the protruding electrodes;
the upper frame is electrically grounded;
the plurality of dilution gas common supply pipes are in the processing gas buffer space;
the substrate processing apparatus further comprises a plasma power supplier that supplies power to the lower frame,
the substrate processing apparatus generates a plasma in or below the gap space using the dilution gas from the dilution gas distribution holes; and
the plurality of electrode inserting portions are at fixed intervals and are alternatingly staggered in each of n columns, wherein the n columns comprise odd-numbered columns and even-numbered columns.
11. The substrate processing apparatus according to claim 10 , wherein each of the electrode inserting portions and each of the protruding electrodes has a same shape, and the same shape is circular or polygonal.
12. The substrate processing apparatus according to claim 10 , wherein the plurality of electrode inserting portions have a lattice or zigzag configuration, and face an upper surface of the substrate.
13. The substrate processing apparatus according to claim 10 , wherein a first distance between a lower surface of the lower frame and an upper surface of the substrate is different from a second distance between the lower surface of the plurality of protruding electrodes and the upper surface of the substrate.
14. The substrate processing apparatus according to claim 10 , wherein the dilution gas comprises hydrogen (H 2 ), nitrogen (N 2 ), oxygen (O 2 ), nitrogen dioxide (NO 2 ), ammonia (NH 3 ), water (H 2 ), or ozone (O 3 ).
15. The substrate processing apparatus according to claim 14 , wherein the processing gas includes a material comprising silicon, titanium, zirconium, hafnium, or aluminum.
16. The substrate processing apparatus according to claim 10 , wherein the even-numbered columns are offset from the odd-numbered columns.
17. The substrate processing apparatus according to claim 1 , further comprising at least one common block on the upper surface of the upper frame, configured to seal the plurality of dilution gas division holes, wherein the at least one common block includes a plurality of communication holes that communicate with the plurality of dilution gas common supply pipes and the dilution gas division holes.
18. The substrate processing apparatus according to claim 17 , wherein the plurality of communication holes communicate with respective ones of the plurality of dilution gas division holes, and each of the plurality of dilution gas common supply pipes has a lower surface with a plurality of lower holes therein that communicate with respective ones of the plurality of communication holes.
19. The substrate processing apparatus according to claim 10 , further comprising at least one common block on the upper surface of the upper frame, configured to seal the plurality of dilution gas division holes, wherein the at least one common block includes a plurality of communication holes that communicate with the plurality of dilution gas common supply pipes and the dilution gas division holes.
20. The substrate processing apparatus according to claim 19 , wherein the plurality of communication holes communicate with respective ones of the plurality of dilution gas division holes, and each of the plurality of dilution gas common supply pipes has a lower surface with a plurality of lower holes therein that communicate with respective ones of the plurality of communication holes.