IP Library › Granted Patent US 11,075,221
Granted Patent B2
US 11,075,221 · App. 16/853,485 · Granted Jul 27, 2021

Thin-film transistor substrate having overlapping thin-film transistor

Inventors: Jong-Hyun Choi (Seoul, KR); Tae-Jin Kim (Hwaseong-si, KR)
H01L27/1225H01L27/124H01L27/1255H01L29/78696H01L27/1251
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Quick Facts
Patent No.
US 11,075,221
App. No.
16/853,485
Granted
Jul 27, 2021
Kind
B2
Abstract

A thin-film transistor substrate may include a first thin-film transistor and a second thin-film transistor which are disposed on a substrate. The first thin-film transistor may include a first semiconductor layer, a first gate electrode, and a first electrode. The second thin-film transistor may include a second semiconductor layer disposed on the first semiconductor layer and overlapping at least a portion of the first semiconductor layer, a second gate electrode, and a second electrode electrically connected to the first electrode. The second electrode may overlap the first electrode.

Claims (17)

1. A thin-film transistor substrate, comprising:

a first thin-film transistor disposed on a substrate, the first thin-film transistor comprising a first semiconductor layer and a first gate electrode; and

a second thin-film transistor comprising, a second gate electrode, a first electrode electrically connected to the first gate electrode, and a second semiconductor layer disposed on the first semiconductor layer and overlapping at least a portion of the first semiconductor layer,

wherein the first electrode overlaps the first gate electrode.

2. The thin-film transistor substrate of claim 1 , wherein the first electrode is one of a source electrode and a drain electrode of the second thin-film transistor.

3. The thin-film transistor substrate of claim 1 , wherein the first gate electrode is disposed between the first semiconductor layer and the first electrode.

4. The thin-film transistor substrate of claim 1 , further comprising:

a contact hole formed on the first gate electrode, the contact hole passing through the second semiconductor layer, at least a portion of the contact hole overlapping the first gate electrode and the second semiconductor layer, respectively,

wherein the first electrode is disposed on the second semiconductor layer and contacts the first gate electrode by filling the contact hole.

5. The thin-film transistor substrate of claim 4 , wherein the second gate electrode faces the first electrode with the second semiconductor layer interposed therebetween.

6. The thin-film transistor substrate of claim 5 , wherein the first gate electrode and the second gate electrode are disposed at a same level over the substrate.

7. The thin-film transistor substrate of claim 1 , further comprising:

a contact hole formed on the first gate electrode, the contact hole passing through the second semiconductor layer and the first electrode, at least a portion of the contact hole overlapping the first gate electrode and the second semiconductor layer, respectively; and

an auxiliary electrode disposed on the second semiconductor layer, the auxiliary electrode electrically connected to the first gate electrode and the second electrode by filling the contact hole.

8. The thin-film transistor substrate of claim 7 , wherein the first electrode is disposed between the first semiconductor layer and the second semiconductor layer.

9. The thin-film transistor substrate of claim 8 , wherein the second gate electrode faces the second semiconductor layer with the first electrode interposed therebetween.

10. The thin-film transistor substrate of claim 9 , wherein the first gate electrode and the second gate electrode are disposed at a same level over the substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 20, 2020
From: CHOI, JONG-HYUN; KIM, TAE-JIN
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 052448/0298 →
Priority Claims (1)
KR 10-2016-0165739 · Dec 7, 2016 · national
Continuity (2)
Division 15833757 · Dec 6, 2017
Related Publication 20200243570A1 · Jul 30, 2020