Cooling and compression clamp for short lead power devices
A clamp configured to be coupled to a printed circuit board to cool and compress one or more electrical connections subject to repeated power and thermal cycling. A first conductive column of the clamp is configured to compress a first electrical connection between a first power device lead and a first printed circuit board trace of the printed circuit board, and draw thermal energy away from the first power device lead. The first conductive column extends from a load spreading plate. The load spreading plate is an insulator that electrically isolates a fastener extending therefrom from the first conductive column. The fastener is configured to cooperate with the circuit board to connect the clamp to the circuit board, compress the load spreading plate against the first conductive column to compress the first electrical connection, and connect the clamp to ground.
1. A clamp configured to be coupled to a printed circuit board to cool and compress one or more electrical connections subject to repeated power and thermal cycling, the clamp comprising:
a first conductive column configured to compress a first electrical connection between a first power device lead and a first printed circuit board trace of the printed circuit board, and draw thermal energy away from the first power device lead to cool the first power device lead, wherein the first printed circuit board trace is generally planar and the first power device lead is generally planar, wherein the first power device lead and the first printed circuit board trace are in contact via surfaces of each respective plane;
a load spreading plate from which the first conductive column extends; and
a fastener extending from the load spreading plate, the load spreading plate is an insulator that electrically isolates the fastener from the first conductive column, the fastener is configured to: cooperate with the printed circuit board to connect the clamp to the printed circuit board; and compress the load spreading plate against the first conductive column to compress the first electrical connection.
2. The clamp of claim 1 , further comprising a second conductive column configured to compress a second electrical connection between a second power device lead and a second printed circuit board trace of the printed circuit board, and draw thermal energy away from the second power device lead to cool the second power device lead;
wherein the load spreading plate electrically isolates the second conductive column from both the fastener and the first conductive column; and
wherein the fastener is configured to compress the load spreading plate against the second conductive column to compress the second electrical connection.
3. The clamp of claim 2 , wherein the first power device lead is a first drain lead from a first transistor of a transistor package; and
wherein the second power device lead is a second drain lead from a second transistor of the transistor package.
4. The clamp of claim 3 , wherein the first printed circuit board trace and the second printed circuit board trace supply energy to an RF plasma output network.
5. The clamp of claim 2 , wherein both the first conductive column and the second conductive column include metal.
6. The clamp of claim 5 , wherein the metal includes copper.
7. The clamp of claim 2 , further comprising thermal energy dispersion surfaces on both the first conductive column and the second conductive column configured to release thermal energy conducted to the first and second conductive columns from the first and second power device leads.
8. The clamp of claim 7 , wherein the thermal energy dispersion surfaces include surface grooves.
9. The clamp of claim 1 , wherein the load spreading plate includes fiberglass.
10. The clamp of claim 1 , further comprising a compression washer between a head of the fastener and the load spreading plate.
11. The clamp of claim 1 , wherein the fastener is a screw.
12. The clamp of claim 2 , wherein at least one of the first electrical connection and the second electrical connection is a solder connection.
13. The clamp of claim 2 , wherein at least one of the first electrical connection and the second electrical connection is a solderless connection.
14. The clamp of claim 1 , wherein the fastener is further configured to connect the clamp to ground.