IP Library Granted Patent US 11,077,495
Granted Patent B2
US 11,077,495 · App. 15/657,348 · Granted Aug 3, 2021

Metal powder, method of producing additively-manufactured article, and additively-manufactured article

Inventors: Ryusuke Tsubota (Osaka, JP); Junichi Tanaka (Osaka, JP); Yohei Oka (Osaka, JP); Takayuki Nakamoto (Izumi, JP); Takahiro Sugahara (Izumi, JP); Mamoru Takemura (Izumi, JP); Sohei Uchida (Izumi, JP)
Assignees: DAIHEN CORPORATION; Osaka Research Institute of Industrial Science and Technology
B22F1/0003B22F3/24B22F12/00C22C1/0425C22C9/00C22C9/06C22C9/10B22F1/0011B22F9/08B22F10/10B22F2003/248B22F2009/0812B22F2009/0828B22F2009/0836B22F2998/10B33Y10/00B33Y70/00B33Y80/00Y02P10/25
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Quick Facts
Patent No.
US 11,077,495
App. No.
15/657,348
Granted
Aug 3, 2021
Kind
B2
Abstract

A metal powder contains not less than 0.10 mass % and not more than 1.00 mass % of at least one of chromium and silicon, and a balance of copper. The total content of the chromium and the silicon is not more than 1.00 mass %. In accordance with an additive manufacturing method for this metal powder, an additively-manufactured article made from a copper alloy is provided. The additively-manufactured article has both an adequate mechanical strength and an adequate electrical conductivity.

Claims (30)

1. A method of using a copper alloy powder in additive manufacturing, the method comprising:

preparing the copper alloy powder;

using the copper alloy powder solely in the form of a powder layer substantially made up of only the copper alloy powder as a raw material for an additively-manufactured article; and

melting and/or sintering the copper alloy powder by irradiating the copper alloy powder with at least one selected from the group consisting of a laser, an electron beam and plasma so that metal particles included in the copper alloy powder fuse directly to each other, wherein

the copper alloy powder consists of

not less than 0.10 mass % and not more than 1.00 mass % of at least one of chromium and silicon, a total content of the chromium and the silicon being not more than 1.00 mass %; and

a balance of copper,

an element besides the copper, the chromium, and the silicon being less than 0.10 mass %.

2. The method of using a copper alloy powder in additive manufacturing according to claim 1 , wherein the copper alloy powder comprises:

not less than 0.10 mass % and not more than 0.60 mass % of the chromium; and

a balance of the copper.

3. The method of using a copper alloy powder in additive manufacturing according to claim 1 , wherein the copper alloy powder comprises:

not less than 0.10 mass % and not more than 0.60 mass % of the silicon; and

a balance of the copper.

4. The method of using a copper alloy powder in additive manufacturing according to claim 1 , wherein the copper alloy powder is prepared by an atomization method.

5. A method of using a copper alloy powder in additive manufacturing, the method comprising:

preparing the copper alloy powder;

using the copper alloy powder solely in the form of a powder layer substantially made up of only the copper alloy powder as a raw material for an additively-manufactured article; and

melting and/or sintering the copper alloy powder by irradiating the copper alloy powder with at least one selected from the group consisting of a laser, an electron beam and plasma so that metal particles included in the copper alloy powder fuse directly to each other, wherein

the copper alloy powder consists of

not less than 0.22 mass % and not more than 0.94 mass % of chromium,

not less than 98.0 mass % of copper; and

an impurity element,

the impurity element being an element besides the copper and the chromium,

the impurity element being less than 0.10 mass %.

6. The method of using a copper alloy powder in additive manufacturing according to claim 5 , wherein the copper alloy powder comprises more than 0.51 mass % and not more than 0.94 mass % of the chromium.

7. The method of using a copper alloy powder in additive manufacturing according to claim 5 , wherein the copper alloy powder comprises not less than 0.22 mass % and not more than 0.51 mass % of the chromium.

8. The method of using a copper alloy powder in additive manufacturing according to claim 5 , wherein the copper alloy powder comprises not less than 98.5 mass % of the copper.

9. The method of using a copper alloy powder in additive manufacturing according to claim 5 , wherein the copper alloy powder comprises not less than 99.0 mass % of the copper.

10. The method of using a copper alloy powder in additive manufacturing according to claim 5 , wherein the copper alloy powder is prepared by an atomization method.

Assignments (2)
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE ADDRESS PREVIOUSLY RECORDED AT REEL: 044794 FRAME: 0161. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER . Recorded Feb 12, 2018
From: TECHNOLOGY RESEARCH INSTITUTE OF OSAKA PREFECTURE
To: OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
Reel/Frame 045302/0840 →
MERGER Recorded Feb 1, 2018
From: TECHNOLOGY RESEARCH INSTITUTE OF OSAKA PREFECTURE
To: OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
Reel/Frame 044794/0161 →
Priority Claims (1)
JP JP2015-097974 · May 13, 2015 · national
Continuity (2)
Division 15151693 · May 11, 2016
Related Publication 20170320134A1 · Nov 9, 2017