IP Library Granted Patent US 11,077,647
Granted Patent B2
US 11,077,647 · App. 16/313,795 · Granted Aug 3, 2021

Thermally conductive silicone rubber composite sheet

Inventors: Akihiro Endo (Annaka, JP); Yuki Tanaka (Annaka, JP)
Assignee: SHIN-ETSU CHEMICAL CO., LTD.
B32B27/281C08J5/18C08J7/042C08J7/043C08J7/044C08K3/22C09D5/00C09D7/61C09D183/04C09K5/14H01L23/3735H01L23/3737C08J2379/08C08J2483/07C08K2003/2227C08K2201/001
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Quick Facts
Patent No.
US 11,077,647
App. No.
16/313,795
Granted
Aug 3, 2021
Kind
B2
Abstract

Provided is an inexpensive thermally conductive silicone rubber composite sheet. The thermally conductive silicone rubber composite sheet of the invention includes a laminated structure body comprised of an intermediate layer and an outer layer laminated on both surfaces of the intermediate layer, in which (A) the intermediate layer is an electrical insulating synthetic resin film layer having a thermal conductivity of not lower than 0.20 W/m·K and a tensile elastic modulus of not lower than 5 GPa, and (B) the outer layer is a silicone rubber layer of a cured product of a composition containing: (a) an organopolysiloxane; (b) a curing agent; (c) a thermally conductive filler; and (d) a silicon compound-based adhesion imparting agent having at least one kind of group selected from the group consisting of an epoxy group, an alkoxy group, a methyl group, a vinyl group and a Si—H group.

Claims (21)

1. A thermally conductive silicone rubber composite sheet including a laminated structure body comprised of an intermediate layer and an outer layer laminated on both surfaces of the intermediate layer, wherein

(A) the intermediate layer is an electrically insulating synthetic resin film layer having a thermal conductivity of not lower than 0.20 W/m·K, a tensile elastic modulus of not lower than 5 GPa, and a thickness of 50 to 100 μm, and

(B) the outer layer is a silicone rubber layer of a cured product of a composition containing: (a) an organopolysiloxane; (b) a curing agent; (c) a thermally conductive filler; and (d) a silicon compound-based adhesion imparting agent having at least one kind of group selected from the group consisting of an epoxy group, an alkoxy group, a methyl group, a vinyl group and a Si—H group.

2. The thermally conductive silicone rubber composite sheet according to claim 1 , wherein the thermally conductive silicone rubber composite sheet has a total thickness of not larger than 300 μm.

3. The thermally conductive silicone rubber composite sheet according to claim 1 , wherein the intermediate layer has a tensile strength of not lower than 200 MPa.

4. The thermally conductive silicone rubber composite sheet according to claim 1 , wherein a synthetic resin used in the synthetic resin film layer is an aromatic polyimide, a polyamide, a polyamideimide, a polyester or a fluorine-based polymer; or a combination of two or more of them.

5. The thermally conductive silicone rubber composite sheet according to claim 1 , wherein a synthetic resin used in the synthetic resin film layer is a polyimide as a polycondensate of biphenyltetracarboxylic acid dianhydride and diamine.

6. The thermally conductive silicone rubber composite sheet according to claim 1 , wherein a powder as the thermally conductive filler is a zinc oxide powder, an aluminum oxide powder, a magnesium oxide powder, an aluminum hydroxide powder, a boron nitride powder, an aluminum nitride powder, a silicon oxide powder, a silicon carbide powder or a diamond powder; or a combination of two or more of them.

7. The thermally conductive silicone rubber composite sheet according to claim 1 , wherein the curing agent as the component (b) is an addition reaction-type curing agent utilizing hydrosilylation reaction, and the silicon compound-based adhesion imparting agent as the component (d) has any one or both of a vinyl group and a Si—H group; and any one or both of an epoxy group and an alkoxy group.

8. The thermally conductive silicone rubber composite sheet according to claim 1 , wherein the curing agent as the component (b) is an organic peroxide, and the silicon compound-based adhesion imparting agent as the component (d) has any one or both of a methyl group and a vinyl group; and any one or both of an epoxy group and an alkoxy group.

9. The thermally conductive silicone rubber composite sheet according to claim 2 , wherein the intermediate layer has a tensile strength of not lower than 200 MPa.

10. The thermally conductive silicone rubber composite sheet according to claim 2 , wherein a synthetic resin used in the synthetic resin film layer is an aromatic polyimide, a polyamide, a polyamideimide, a polyester or a fluorine-based polymer; or a combination of two or more of them.

11. The thermally conductive silicone rubber composite sheet according to claim 3 , wherein a synthetic resin used in the synthetic resin film layer is an aromatic polyimide, a polyamide, a polyamideimide, a polyester or a fluorine-based polymer; or a combination of two or more of them.

12. The thermally conductive silicone rubber composite sheet according to claim 9 , wherein a synthetic resin used in the synthetic resin film layer is an aromatic polyimide, a polyamide, a polyamideimide, a polyester or a fluorine-based polymer; or a combination of two or more of them.

13. The thermally conductive silicone rubber composite sheet according to claim 2 , wherein a synthetic resin used in the synthetic resin film layer is a polyimide as a polycondensate of biphenyltetracarboxylic acid dianhydride and diamine.

14. The thermally conductive silicone rubber composite sheet according to claim 3 , wherein a synthetic resin used in the synthetic resin film layer is a polyimide as a polycondensate of biphenyltetracarboxylic acid dianhydride and diamine.

15. The thermally conductive silicone rubber composite sheet according to claim 9 , wherein a synthetic resin used in the synthetic resin film layer is a polyimide as a polycondensate of biphenyltetracarboxylic acid dianhydride and diamine.

16. The thermally conductive silicone rubber composite sheet according to claim 2 , wherein a powder as the thermally conductive filler is a zinc oxide powder, an aluminum oxide powder, a magnesium oxide powder, an aluminum hydroxide powder, a boron nitride powder, an aluminum nitride powder, a silicon oxide powder, a silicon carbide powder or a diamond powder; or a combination of two or more of them.

17. The thermally conductive silicone rubber composite sheet according to claim 3 , wherein a powder as the thermally conductive filler is a zinc oxide powder, an aluminum oxide powder, a magnesium oxide powder, an aluminum hydroxide powder, a boron nitride powder, an aluminum nitride powder, a silicon oxide powder, a silicon carbide powder or a diamond powder; or a combination of two or more of them.

18. The thermally conductive silicone rubber composite sheet according to claim 4 , wherein a powder as the thermally conductive filler is a zinc oxide powder, an aluminum oxide powder, a magnesium oxide powder, an aluminum hydroxide powder, a boron nitride powder, an aluminum nitride powder, a silicon oxide powder, a silicon carbide powder or a diamond powder; or a combination of two or more of them.

19. The thermally conductive silicone rubber composite sheet according to claim 5 , wherein a powder as the thermally conductive filler is a zinc oxide powder, an aluminum oxide powder, a magnesium oxide powder, an aluminum hydroxide powder, a boron nitride powder, an aluminum nitride powder, a silicon oxide powder, a silicon carbide powder or a diamond powder; or a combination of two or more of them.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 28, 2018
From: ENDO, AKIHIRO; TANAKA, YUKI
To: SHIN-ETSU CHEMICAL CO., LTD.
Reel/Frame 047870/0103 →
Priority Claims (1)
JP JP2016-154228 · Aug 5, 2016 · national
Continuity (1)
Related Publication 20200123427A1 · Apr 23, 2020