IP Library › Granted Patent US 11,079,540
Granted Patent B2
US 11,079,540 · App. 16/183,319 · Granted Aug 3, 2021

Semiconductor device

Inventors: Shinichi Watanuki (Ibaraki, JP); Yasutaka Nakashiba (Ibaraki, JP)
Assignee: RENESAS ELECTRONICS CORPORATION
G02B6/1223G02B6/12004G02F1/025H01L21/0214H01L21/02219H01L23/5329H01L25/167G02B6/43G02B2006/12061G02B2006/12123G02B2006/12142G02B2006/12176H01L23/345
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Quick Facts
Patent No.
US 11,079,540
App. No.
16/183,319
Granted
Aug 3, 2021
Kind
B2
Abstract

Two optical waveguides and an insulating film provided to cover the optical waveguides are formed over an insulating layer. Two wirings and a heater metal wire are formed over the insulating film via an insulating film different from the above insulating film. The latter insulating film is thinner than the former insulating film, and has a higher refractive index than the former insulating film. The leaked light from either of the two optical waveguides can be suppressed or prevented from being reflected by any one of the two wirings, the heater metal wire, and the like to travel again toward the two optical waveguides by utilizing the difference between the refractive indices of the two insulating films.

Claims (40)

1. A semiconductor device comprising:

a first insulating film formed over a substrate;

an optical waveguide formed over the first insulating film and having a refractive index n1;

a second insulating film formed over the first insulating film so as to cover the optical waveguide and having a refractive index n2;

a third insulating film formed over the second insulating film and having a refractive index n3, the third insulating film including a portion that overlaps the optical waveguide in plan view; and

a conductive film formed over the third insulating film, the conductive film being formed over the portion of the third insulating film such that the conductive film overlaps the optical waveguide in plan view,

wherein the shortest distance between the optical waveguide and the third insulating film is smaller than a thickness of the first insulating film, and

wherein the refractive indices n1, n2, and n3 satisfy the relationships of n1 >n2 and n3 >n2.

2. The semiconductor device according to claim 1 , wherein a thickness of the second insulating film is larger than a thickness of at least the portion of the third insulating film.

3. The semiconductor device according to claim 1 , wherein the third insulating film is a silicon nitride film or a silicon oxynitride film.

4. The semiconductor device according to claim 1 , further comprising:

a photodetector having a first semiconductor layer of a first conductivity type and a second semiconductor layer of a second conductivity type different from the first conductivity type over the first insulating film,

wherein the third insulating film is not arranged over an optical path for light incident on the photodetector.

5. The semiconductor device according to claim 1 ,

wherein the optical waveguide further includes a grating coupler having a plurality of protrusions formed to be parallel to each other, and

wherein the third insulating film is not arranged over an optical path for light emitted from the grating coupler or incident on the grating coupler.

6. A semiconductor device comprising:

a first insulating film formed over a substrate;

an optical waveguide formed over the first insulating film and having a refractive index n1;

a second insulating film formed over the first insulating film so as to cover the optical waveguide and having a refractive index n2;

a third insulating film formed over the second insulating film and having a refractive index n3, the third insulating film including a portion that is formed directly above the optical waveguide; and

a conductive film formed over the third insulating film,

wherein the third insulating film is arranged at a position corresponding to the conductive film,

wherein the refractive indices n1, n2, and n3 satisfy the relationships of n1 >n2 and n3 >n2, and

wherein the shortest distance between the optical waveguide and the third insulating film is smaller than a thickness of the first insulating film.

7. The semiconductor device according to claim 6 , wherein a thickness of the second insulating film is larger than a thickness of at least the portion of the third insulating film.

8. The semiconductor device according to claim 6 , further comprising:

a fourth insulating film formed between the third insulating film and the conductive film.

9. The semiconductor device according to claim 6 , wherein the third insulating film is a silicon nitride film or a silicon oxynitride film.

10. The semiconductor device according to claim 8 ,

wherein the fourth insulating film has a refractive index n4, and

wherein the refractive indices n3 and n4 satisfy the relationship of n4 >n3.

11. The semiconductor device according to claim 8 , wherein the fourth insulating film is a silicon nitride film.

12. The semiconductor device according to claim 8 , wherein the fourth insulating film is a silicon oxide film.

13. The semiconductor device according to claim 6 , further comprising:

a photodetector having a first semiconductor layer of a first conductivity type and a second semiconductor layer of a second conductivity type different from the first conductivity type over the first insulating film,

wherein the third insulating film is not arranged over an optical path above the photodetector.

14. The semiconductor device according to claim 6 ,

wherein the optical waveguide further includes a grating coupler having a plurality of protrusions formed to be parallel to each other, and

wherein the third insulating film is not arranged over an optical path for light emitted from the grating coupler or incident on the grating coupler.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 9, 2018
From: WATANUKI, SHINICHI; NAKASHIBA, YASUTAKA
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 047465/0018 →
Priority Claims (1)
JP JP2017-246106 · Dec 22, 2017 · national
Continuity (1)
Related Publication 20190196099A1 · Jun 27, 2019