3D IC power grid
A three dimensional Integrated Circuit (IC) Power Grid (PG) may be provided. The three dimensional IC PG may comprise a first IC die, a second IC die, an interface, and a power distribution structure. The interface may be disposed between the first IC die and the second IC die. The power distribution structure may be connected to the interface. The power distribution structure may comprise at least one Through-Silicon Vias (TSV) and a ladder structure connected to at least one TSV.
1. An apparatus comprising:
a first integrated circuit (IC) die;
a second IC die stacked on the first IC die;
an interface disposed between the first IC die and the second IC die, wherein the interface comprises:
a plurality of hybrid layer pins corresponding to the second IC die;
a plurality of hybrid layer bumps corresponding to the first IC die; and
a plurality of vertical top metal elements corresponding to the first IC die,
wherein the plurality of hybrid layer pins connect to the plurality of hybrid layer bumps which connect to the plurality of vertical top metal elements; and
a power distribution structure connected to the interface, the power distribution structure comprising:
at least one Through-Silicon Via (TSV) connected to a power supply, and
a ladder structure connected to the at least one TSV and the interface.
2. The apparatus of claim 1 , wherein the first IC die and the second IC die are stacked in a face-to-face configuration.
3. The apparatus of claim 1 , wherein the first IC die comprises a first functional element that is configured to be supplied with power from the interface.
4. The apparatus of claim 1 , wherein the second IC die comprises a second functional element that is configured to be supplied with power from the interface.
5. The apparatus of claim 1 , wherein the interface is disposed between a horizontal top metal layer of the first IC die and a horizontal top metal layer of the second IC die.
6. The apparatus of claim 1 , wherein the power distribution structure passes through the first IC die.
7. The apparatus of claim 1 , wherein the at least one TSV is connected to a package bump.
8. The apparatus of claim 1 , wherein the ladder structure comprise a plurality of horizontal elements connected by a plurality of vertical elements.
9. The apparatus of claim 1 , wherein a third IC die is connected to the interface.
10. The apparatus of claim 1 , wherein the power distribution structure is configured to supply power to the first IC die and to the second IC die.
11. An apparatus comprising:
a first integrated circuit (IC) die;
a second IC die stacked on the first IC die in a face-to-face configuration;
an interface disposed between the first IC die and the second IC die, wherein the interface comprises:
a plurality of hybrid layer pins corresponding to the second IC die,
a plurality of hybrid layer bumps corresponding to the first IC die, and
a plurality of vertical top metal elements corresponding to the first IC die,
wherein the plurality of hybrid layer pins connect to the plurality of hybrid layer bumps which connect to the plurality of vertical top metal elements; and
a power distribution structure connected to the interface, wherein the power distribution structure passes through the first IC die, the power distribution structure comprising:
at least one Through-Silicon Via (TSV) connected to a power supply, and
a ladder structure connected to the least one TSV and the interface,
wherein the ladder structure comprises a plurality of horizontal elements connected by a plurality of vertical elements.
12. The apparatus of claim 11 , wherein the first IC die comprising a first functional element that is configured to be supplied with power from the interface.
13. The apparatus of claim 11 , wherein the second IC die comprising a second functional element that is configured to be supplied with power from the interface.
14. The apparatus of claim 11 , wherein the interface is disposed between a horizontal top metal layer of the first IC die and a horizontal top metal layer of the second IC die.
15. A method comprising:
providing a first integrated circuit (IC) die comprising a first functional element;
stacking a second IC die comprising a second functional element on the first IC die;
providing a first package bump on the first IC die, the first package bump being configured to connect to a first power supply
providing a second package bump on the second IC die, the second package bump being configured to connect to a second power supply; and
forming a power distribution structure in the first IC die, the power distribution structure comprising at least one Through-Silicon Via (TSV) connected to the first power supply and a ladder structure connected to the at least one TSV and the interface, wherein the ladder structure comprises a plurality of horizontal elements connected by a plurality of vertical elements.
16. The method of claim 15 , wherein stacking the second IC die on the first IC die comprises stacking the second IC die on the first IC die in a face-to-face configuration.
17. The method of claim 15 , further comprising connecting the power distribution structure to an interface disposed between a horizontal top metal layer of the first IC die and a horizontal top metal layer of the second IC die.
18. The method of claim 15 , further comprising connecting the plurality of TSVs to the first package bump.
19. The apparatus of claim 11 , wherein a third IC die is connected to the interface.
20. The apparatus of claim 11 , wherein the power distribution structure is configured to supply power to the first IC die and to the second IC die.