IP Library › Granted Patent US 11,081,776
Granted Patent B2
US 11,081,776 · App. 16/554,952 · Granted Aug 3, 2021

Electronic package

Inventors: Ying-Wei Lu (Taichung, TW); Bo-Siang Fang (Taichung, TW); Kuan-Ta Chen (Taichung, TW); Chia-Chu Lai (Taichung, TW)
Assignee: Siliconware Precision Industries Co., Ltd.
H01Q1/22
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Quick Facts
Patent No.
US 11,081,776
App. No.
16/554,952
Granted
Aug 3, 2021
Kind
B2
Abstract

An electronic package is provided. A functioning member having a concave portion and a second antenna portion is disposed on a carrier having a first antenna portion. The concave portion and the carrier form a functioning space. The first antenna portion and the second antenna portion are disposed in a projection space of the functioning space. The first antenna portion induces the second antenna portion.

Claims (16)

1. An electronic package, comprising:

a carrier provided with a circuit portion and a first antenna portion electrically connected to the circuit portion; and

a functioning member mounted on the carrier and provided with a concave portion and a second antenna portion,

wherein the functioning member is defined with a first block and a second block, the second antenna portion is disposed on the first block, the concave portion is disposed on the second block, and the functioning member is bonded via the second block to the carrier, and

wherein the concave portion and the carrier form a functioning space, the first antenna portion and the second antenna portion are disposed in a projection space of the functioning space, and the first antenna portion induces the second antenna portion.

2. The electronic package of claim 1 , wherein the functioning member is integrated with the concave portion.

3. The electronic package of claim 1 , further comprising a bonding layer bonding the functioning member to the carrier.

4. The electronic package of claim 1 , wherein the functioning member comprises an insulation material or a semiconductor material.

5. The electronic package of claim 4 , wherein the insulation material is a ceramic material.

6. The electronic package of claim 4 , wherein the semiconductor material is a silicon material.

7. The electronic package of claim 1 , wherein the second block is thicker than the first block.

8. The electronic package of claim 1 , wherein the second antenna portion is free from being electrically connected to the circuit portion.

9. The electronic package of claim 1 , wherein the functioning member is free from being electrically connected to the carrier.

10. The electronic package of claim 1 , wherein the functioning space is an air chamber.

11. The electronic package of claim 1 , wherein the first antenna portion is disposed inside the functioning space, and the second antenna portion is disposed outside the functioning space.

12. The electronic package of claim 1 , further comprising an electronic component disposed on the carrier.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 29, 2019
From: LU, YING-WEI; FANG, BO-SIANG; CHEN, KUAN-TA; LAI, CHIA-CHU
To: SILICONWARE PRECISION INDUSTRIES CO., LTD.
Reel/Frame 050210/0684 →
Priority Claims (1)
TW 108124508 · Jul 11, 2019 · national
Continuity (1)
Related Publication 20210013583A1 · Jan 14, 2021
Cited By (1)
US 12,738,634