Semiconductor device structure with silicide and method for forming the same

1. A semiconductor device structure, comprising:

a substrate having a base portion and a fin portion over the base portion;

an epitaxial structure over the fin portion;

a dielectric fin over the base portion, wherein a top surface of the dielectric fin is close to the epitaxial structure; and

a silicide layer wrapping around the epitaxial structure and partially between the dielectric fin and the epitaxial structure, wherein the silicide layer covers a lower surface of the epitaxial structure, and the lower surface is lower than the top surface of the dielectric fin.

2. The semiconductor device structure as claimed in claim 1 , wherein the silicide layer is in direct contact with the dielectric fin.

3. The semiconductor device structure as claimed in claim 1 , further comprising:

a metal layer over the silicide layer covering the lower surface of the epitaxial structure.

4. The semiconductor device structure as claimed in claim 3 , wherein the metal layer further covers a first sidewall of the dielectric fin, and the first sidewall faces the epitaxial structure.

5. The semiconductor device structure as claimed in claim 4 , further comprising:

a dielectric layer over the base portion and a second sidewall of the fin portion, wherein the dielectric fin is over the dielectric layer, a void is surrounded by the epitaxial structure, the dielectric layer, and the dielectric fin, and the metal layer is in the void.

6. The semiconductor device structure as claimed in claim 5 , wherein the metal layer further covers the dielectric layer.

7. The semiconductor device structure as claimed in claim 5 , further comprising:

a spacer layer between the dielectric layer and the dielectric fin, wherein the metal layer further covers the spacer layer.

8. The semiconductor device structure as claimed in claim 1 , further comprising:

a contact structure over the silicide layer and the dielectric fin.

9. A semiconductor device structure, comprising:

a substrate having a base portion and a fin portion over the base portion;

an epitaxial structure over the fin portion;

a dielectric fin over the base portion, wherein the dielectric fin is spaced apart from the epitaxial structure; and

a silicide layer wrapping around the epitaxial structure, wherein the silicide layer has an upper portion and a first lower portion, the upper portion is higher than the dielectric fin, the first lower portion is between the epitaxial structure and the dielectric fin, and the upper portion is thicker than the first lower portion.

10. The semiconductor device structure as claimed in claim 9 , wherein the silicide layer exposes a second lower portion of a lower surface of the epitaxial structure.

11. The semiconductor device structure as claimed in claim 10 , wherein a thickness of the first lower portion of the silicide layer decreases toward the second lower portion of the lower surface of the epitaxial structure.

12. The semiconductor device structure as claimed in claim 9 , wherein the silicide layer is in direct contact with the dielectric fin and the epitaxial structure.

13. The semiconductor device structure as claimed in claim 9 , wherein a void is surrounded by the silicide layer, the epitaxial structure, and the dielectric fin.

14. The semiconductor device structure as claimed in claim 9 , further comprising:

a contact structure over the silicide layer, wherein the contact structure is partially between the silicide layer and the dielectric fin.

15. The semiconductor device structure as claimed in claim 14 , further comprising:

a spacer layer over a sidewall of the dielectric fin, wherein the sidewall faces the fin portion of the substrate, and the spacer layer is under the contact structure between the silicide layer and the dielectric fin.

16. A method for forming a semiconductor device structure, comprising:

providing a substrate having a base portion and a fin portion over the base portion;

forming a spacer layer over the base portion and a sidewall of the fin portion, wherein the spacer layer is spaced apart from the substrate;

forming an epitaxial structure over the fin portion, wherein the epitaxial structure is in direct contact with the spacer layer;

removing the spacer layer originally in direct contact with the epitaxial structure; and

forming a silicide layer wrapping around the epitaxial structure.

17. The method for forming the semiconductor device structure as claimed in claim 16 , further comprising:

forming a dielectric fin over the spacer layer before forming the epitaxial structure over the fin portion, wherein the spacer layer separates the dielectric fin from the substrate, and the spacer layer is partially between the epitaxial structure and the dielectric fin.

18. The method for forming the semiconductor device structure as claimed in claim 17 , wherein after removing the spacer layer originally in direct contact with the epitaxial structure, a gap is formed between the epitaxial structure and the dielectric fin, and the silicide layer passes through the gap.

19. The method forming the semiconductor device structure as claimed in claim 18 , wherein the silicide layer has an upper portion and a lower portion, the upper portion is higher than the gap, the lower portion is lower than the gap, and the upper portion is thicker than the lower portion.

20. The method for forming the semiconductor device structure as claimed in claim 1 , further comprising:

forming a dielectric layer over the base portion and the sidewall of the fin portion before forming the spacer layer over the base portion and the sidewall of the fin portion, wherein the spacer layer is formed over the dielectric layer;

removing a first upper portion of the dielectric layer over the sidewall of the fin portion before forming the epitaxial structure over the fin portion; and

removing a second upper portion of the fin portion after removing the first upper portion of the dielectric layer and before forming the epitaxial structure over the fin portion.