Semiconductor device with diode and silicon controlled rectifier (SCR)
Provided is a semiconductor device with a diode and a silicon controlled rectifier (SCR) including a substrate having a first conductivity type, a well region having a second conductivity type, a first doped region having the first conductivity type, and a second doped region having the second conductivity type. The well region is disposed in the substrate. The first doped region is disposed in the substrate. The second doped region is disposed in the substrate. The well region and the first doped region form a first PN junction, the well region and the substrate form a second PN junction, and the substrate and the second doped region form a third junction. The first, second, and third PN junctions form the SCR, and the first doped region and the third PN junction form the diode.
1. A semiconductor device with a diode and a silicon controlled rectifier (SCR), comprising:
a substrate having a first conductivity type;
a well region having a second conductivity type, and disposed in the substrate;
a first doped region having the first conductivity type, and disposed in the substrate; and
a second doped region having the second conductivity type, and disposed in the substrate,
wherein the well region and the first doped region form a first PN junction, the well region and the substrate form a second PN junction, and the substrate and the second doped region form a third junction,
wherein the first, second, and third PN junctions form the SCR, and the first doped region and the third PN junction form the diode,
wherein the substrate has a path allowing the third PN junction and the first doped region to form the diode.
2. The semiconductor device according to claim 1 , wherein a portion of the first doped region is located in the well region.
3. The semiconductor device according to claim 1 , wherein the second doped region is separated from the well region and the first doped region.
4. The semiconductor device according to claim 1 , wherein the substrate and the well region are both electrically floating.
5. The semiconductor device according to claim 1 , wherein
a current path of the diode is formed from the second doped region, the substrate to the first doped region; and
a current path of the SCR is formed from the second doped region, the substrate, the well region to the first doped region.
6. The semiconductor device according to claim 1 , wherein the first doped region comprises a first doped sub-region and a second doped sub-region, the second doped sub-region is located on the first doped sub-region, and the first doped sub-region has a doping concentration greater than a doping concentration of the second doped sub-region.
7. The semiconductor device according to claim 1 , wherein the well region has a first well region and a second well region separated from each other, the first doped region is located between the first and second well regions, the first doped region is in contact with the first well region and the second well region respectively to form PN junctions, and the first doped region is in contact with the substrate.
8. The semiconductor device according to claim 7 , further comprising:
a third doped region having the second conductivity type, and disposed in the substrate, wherein the third doped region is separated from the well region by the substrate, and the first doped region is located between the second doped region and the third doped region.