Light-emitting diode substrate and manufacturing method thereof, and display device

1. A light-emitting diode (LED) substrate, comprising: a receiving substrate, wherein the receiving substrate is provided thereon with a pixel definition layer and a plurality of LED units,

the pixel definition layer defines a plurality of sub-pixel regions, each of the plurality of sub-pixel regions is configured to receive at least one of the plurality of LED units, and

a solder point and an auxiliary metal member are both provided in the sub-pixel region, the auxiliary metal member is provided at a periphery of the solder point, an interval is provided between the solder point and the auxiliary metal member in a plan view of the receiving substrate, and a melting point of the auxiliary metal member is higher than a melting point of the solder point,

wherein each of the plurality of LED units comprises a light-emitting stacked layer, a current dispersion layer and a bonding layer; the current dispersion layer is configured to disperse current, and the bonding layer is configured to be in contact with both the solder point and the auxiliary metal member.

2. The LED substrate according to claim 1 , wherein the at least one of the plurality of LED units in the sub-pixel region is in contact with both the solder point and the auxiliary metal member.

3. The LED substrate according to claim 1 , wherein a material of the solder point comprises indium, tin, or indium tin material mixed with a soldering flux.

4. The LED substrate according to claim 1 , wherein the auxiliary metal member comprises copper, aluminum, silver or gold.

5. The LED substrate according to claim 1 , wherein the at least one of the plurality of LED units received in the sub-pixel region goes beyond an upper surface of the pixel definition layer facing away from the receiving substrate.

6. The LED substrate according to claim 1 , wherein a thickness of the pixel definition layer is smaller than a thickness of each of the plurality of LED units.

7. The LED substrate according to claim 1 , wherein an orthographic projection of each of the plurality of LED units on the receiving substrate covers an orthographic projection of the solder point corresponding thereto on the receiving substrate.

8. The LED substrate according to claim 1 , wherein an orthographic projection of each of the plurality of LED units on the receiving substrate covers an orthographic projection of the auxiliary metal member corresponding thereto on the receiving substrate.

9. The LED substrate according to claim 1 , wherein the auxiliary metal member is provided around the solder point.

10. The LED substrate according to claim 1 , wherein the auxiliary metal member is in a shape of a rectangle, a circle, or multiple dispersed points.

11. The LED substrate according to claim 1 , wherein the sub-pixel region comprises a first electrode, and the first electrode is electrically connected with a drain electrode of a thin film transistor on the receiving substrate.

12. The LED substrate according to claim 11 , wherein the at least one of the plurality of LED units within the sub-pixel region is electrically connected with the first electrode, so as to be further electrically connected with the drain electrode of the thin film transistor.

13. The LED substrate according to claim 12 , wherein the sub-pixel region of the receiving substrate is provided with a reflective layer, and the reflective layer is connected with the first electrode.

14. The LED substrate according to claim 13 , wherein the reflective layer is in contact with both the solder point and the auxiliary metal member.

15. The LED substrate according to claim 1 , further comprising a planarization layer on the receiving substrate, and the planarization layer comprises a plurality of opening to expose the plurality of LED units, respectively.

16. The LED substrate according to claim 1 , wherein the LED unit further comprises a second electrode, and the LED substrate further comprises an insulating protective layer located on the second electrode.

17. The LED substrate according to claim 1 , further comprising an encapsulation substrate opposite to the receiving substrate, wherein the pixel definition layer, the plurality of LED units, the solder point and the auxiliary metal member are located on a side of the receiving substrate facing the encapsulation substrate.

18. A display device, comprising the LED substrate according to claim 1 .