Display device and method for manufacturing the same

1. A display device comprising:

a plurality of display modules including a plurality of substrates, wherein the plurality of substrates are spaced apart from each other and each of the plurality of display modules includes a substrate of the plurality of substrates and a plurality of inorganic light emitting elements mounted on a mounting surface of the substrate;

a light absorbing pattern formed to cover a gap between the plurality of display modules; and

an encapsulation layer formed on mounting surfaces of the plurality of display modules to cover the mounting surfaces of the plurality of display modules.

2. The display device of claim 1 , wherein the light absorbing pattern has a cross-striped form.

3. The display device of claim 1 , wherein the substrate comprises an anisotropic conductive layer for electrically connecting contact electrodes of the plurality of inorganic light emitting elements to pad electrodes of the substrate.

4. The display device of claim 3 , wherein the light absorbing pattern is formed on the anisotropic conductive layer.

5. The display device of claim 1 , wherein the encapsulation layer is formed to cover the light absorbing pattern.

6. The display device of claim 1 , wherein the substrate comprises a glass substrate and a thin film transistor (TFT) layer formed on the glass substrate.

7. The display device of claim 1 , wherein the encapsulation layer comprises a transparent molding resin made with at least one of acrylic resin, polyimide resin, epoxy resin, polyurethane resin, or silicon resin.

8. The display device of claim 1 , wherein the encapsulation layer comprises an optical adhesive made with one of an optical cleared adhesive (OCA) and an optical clear resin (OCR).

9. The display device of claim 8 , further comprising: a cover glass attached onto the optical adhesive.

10. The display device of claim 1 , further comprising: an auxiliary light absorbing pattern formed between the plurality of inorganic light emitting elements.

11. The display device of claim 1 , further comprising: a rear cover for supporting the plurality of display modules.

12. The display device of claim 1 , wherein the substrate comprises a light absorbing layer formed entirely on the mounting surface to enhance contrast by absorbing external light.

13. A method for manufacturing a display device, the method comprising:

preparing a plurality of display modules including a plurality of substrates, wherein each of the plurality of display modules is formed with a substrate of the plurality of substrates and a plurality of inorganic light emitting elements mounted on a mounting surface of the substrate;

arranging the plurality of display modules to be adjacent to each other such that the plurality of substrates are spaced apart from each other;

forming a light absorbing pattern to cover a gap formed between the plurality of display modules; and

forming an encapsulation layer on mounting surfaces of the plurality of display modules to cover the mounting surfaces of the plurality of display modules.

14. The method of claim 13 , wherein the plurality of inorganic light emitting elements mounted on the mounting surface of a substrate is obtained by picking up the plurality of inorganic light emitting elements from a wafer and transferring the plurality of inorganic light emitting elements onto the substrate.

15. The method of claim 13 , wherein the arranging of the plurality of display modules to be adjacent to each other comprises arranging the plurality of display modules in the form of an M×N matrix.

16. The method of claim 14 , further comprising: forming an auxiliary light absorbing pattern between the plurality of inorganic light emitting elements.

17. The method of claim 16 , wherein the forming of the light absorbing pattern between the plurality of display modules and the forming of the auxiliary light absorbing pattern between the plurality of inorganic light emitting elements are performed at the same time.

18. The method of claim 15 , wherein the forming of an encapsulation layer comprises applying a transparent molding resin made with at least one of acrylic resin, polyimide resin, epoxy resin, polyurethane resin, or silicon resin onto the mounting surfaces of the plurality of display modules.

19. The method of claim 15 , wherein the forming of an encapsulation layer comprises adhering an optical adhesive made with one of an optical cleared adhesive (OCA) and an optical clear resin (OCR) onto the mounting surfaces of the plurality of display modules.

20. The method of claim 19 , further comprising: attaching a cover glass onto the optical adhesive.